Coplanar control for film-type thermal interface
A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.
1. A package comprising:
a package component;
a first device die and a second device die over and bonding to the package component;
an underfill comprising:
a first portion between the first device die and the package component; and
a second portion between the second device die and the package component; and
a first adhesive feature between the first device die and the second device die, wherein the first adhesive feature contacts a sidewall of the first device die.
2. The package of claim 1 , wherein the first adhesive feature further contacts the second device die.
3. The package of claim 1 further comprising a second adhesive feature separated from the first adhesive feature, wherein the second adhesive feature has a first top surface higher than a second top surface of the first device die, and a first bottom surface lower than a second bottom surface of the second device die.
4. The package of claim 3 , wherein the second adhesive feature is formed of a same material as the first adhesive feature.
5. The package of claim 3 further comprising:
a thermal interface material over and contacting the first device die; and
a heat sink over and contacting the thermal interface material, wherein the second adhesive feature contacts the heat sink to form a horizontal interface.
6. The package of claim 5 further comprising an air gap spacing the first adhesive feature apart from the heat sink.
7. The package of claim 1 further comprising:
a thermal interface material over and contacting the first device die; and
a heat sink comprising:
a first part over and contacting the thermal interface material; and
a second part in a top portion of the first adhesive feature.
8. The package of claim 1 , wherein the first adhesive feature is further in contact with the underfill.
9. The package of claim 1 , wherein the first adhesive feature has a curved top surface.
10. The package of claim 1 , wherein in a top view of the package, the first adhesive feature forms an elongated strip that extends beyond opposite sidewalls of the first device die.
11. The package of claim 1 further comprising an air gap underlying the first adhesive feature.
12. A package comprising:
a package component;
a first package and a second package bonded over the package component;
a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively;
a first adhesive feature on the package component; and
a heat sink over and contacting the first adhesive feature, wherein the heat sink is further over the first TIM and the second TIM.
13. The package of claim 12 , wherein the heat sink is in physical contact with the first TIM and the second TIM.
14. The package of claim 12 , wherein the first adhesive feature comprises non-straight sidewalls.
15. The package of claim 12 further comprising an underfill between the first package and the package component, wherein a first portion of the first adhesive feature is over and contacting a second portion of the underfill.
16. The package of claim 12 further comprising a second adhesive feature on the package component, wherein the second adhesive feature is between the first package and the second package, and is separated from the heat sink by an air gap.
17. The package of claim 16 , wherein the heat sink comprises:
an upper portion higher than the first TIM and the second TIM; and
a heat sink bar extending from a bottom surface of the upper portion, wherein the heat sink bar extends into the second adhesive feature.
18. A package comprising:
a package substrate;
a package component over and bonded to the package substrate, the package component comprising:
an interposer; and
a device die over and bonding to the interposer;
a lid comprising an upper portion over the package component; and
an adhesive feature between, and in physical contact with, the lid and the package substrate, wherein a first top surface of the adhesive feature is higher than a second top surface of the package component.
19. The package of claim 18 further comprising a thermal interface material between, and in physical contact with, the package component and the lid.
20. The package of claim 18 further comprising an underfill between the package component and the package substrate, wherein the package component comprises a molding compound molding the device die, and wherein the adhesive feature is softer than both of the molding compound and the underfill.