IP Library › Granted Patent US 12,281,840
Granted Patent B2
US 12,281,840 · App. 17/749,679 · Granted Apr 22, 2025

Vacuum adiabatic body and refrigerator

Inventors: Wonyeong Jung (Seoul, KR); Deokhyun Youn (Seoul, KR)
Assignee: LG ELECTRONICS INC.
F25D23/063F16L59/065F25D19/006F25D23/062F25D23/064F25D23/082F25D23/028F25D2201/14
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,281,840
App. No.
17/749,679
Granted
Apr 22, 2025
Kind
B2
Abstract

A vacuum adiabatic body includes: a first plate, a second plate, a sealing part sealing the first plate and the second plate to provide a third space, a supporting unit maintaining the third space, and a heat resistance unit for decreasing a heat transfer amount between the first plate and the second plate. The second plate may include a front part and a side part having a different extending direction from the front part, and the side part defines at least one portion of a wall for the third space.

Claims (57)

1. A vacuum adiabatic body comprising:

a first plate;

a second plate;

a vacuum space to be provided between the first plate and the second plate;

a support to be provided in the vacuum space to maintain a gap in the vacuum space;

a side frame to be provided between the first plate and the second plate, the side frame having a first end and a second end; and

a thermal insulator configured to reduce heat transfer between the first plate and the second plate, the thermal insulator having a third end and a fourth end,

wherein the first end of the side frame contacts the second plate, and the second end of the side frame contacts the third end of the thermal insulator,

wherein the fourth end of the thermal insulator contacts the first plate, and

wherein each of an inner surface of the side frame and an inner surface of the thermal insulator is configured to form a wall defining the vacuum space.

2. The vacuum adiabatic body according to claim 1 , wherein the thermal insulator is not supported directly by a structure within the vacuum space, or is indirectly supported by the structure within the vacuum space.

3. The vacuum adiabatic body according to claim 1 , wherein the thermal insulator does not contact an inner surface of the first plate or an inner surface of the second plate, the inner surface of the first plate and the inner surface of the second plate configured to form the vacuum space.

4. The vacuum adiabatic body according to claim 1 , wherein the thermal insulator includes a conductive resistance sheet provided at the first plate and configured to be curved into the vacuum space.

5. The vacuum adiabatic body according to claim 1 , wherein the thermal insulator includes at least one radiation resistance sheet within the vacuum space.

6. The vacuum adiabatic body according to claim 1 , wherein the thermal insulator includes porous material within the vacuum space.

7. A vacuum adiabatic body comprising:

a first plate;

a second plate;

a vacuum space to be provided between the first plate and the second plate;

a support to be provided in the vacuum space to maintain a gap in the vacuum space;

a side frame to be provided between the first plate and the second plate, the side frame having a first end and a second end; and

a thermal insulator configured to reduce heat transfer between the first plate and the second plate,

wherein the first end of the side frame contacts the second plate, and does not contact the thermal insulator,

wherein the second end of the side frame contacts the thermal insulator, and does not contact the second plate, and

wherein each of the side frame and the thermal insulator is configured to form a wall defining the vacuum space.

8. The vacuum adiabatic body according to claim 7 , wherein the thermal insulator is not supported directly by a structure within the vacuum space, or is indirectly supported by the structure within the vacuum space.

9. The vacuum adiabatic body according to claim 7 , wherein the thermal insulator does not contact an inner surface of the first plate or an inner surface of the second plate, the inner surface of the first plate and the inner surface of the second plate configured to form the vacuum space.

10. The vacuum adiabatic body according to claim 7 , wherein the thermal insulator includes a conductive resistance sheet provided at the first plate and configured to be curved into the vacuum space.

11. The vacuum adiabatic body according to claim 7 , wherein the thermal insulator includes at least one radiation resistance sheet within the vacuum space.

12. The vacuum adiabatic body according to claim 7 , wherein the thermal insulator includes porous material within the vacuum space.

13. A vacuum adiabatic body comprising:

a first plate;

a second plate;

a vacuum space to be provided between the first plate and the second plate;

a support to be provided in the vacuum space to maintain a gap in the vacuum space;

a side frame to be provided between the first plate and the second plate; and

a thermal insulator configured to reduce heat transfer between the first plate and the second plate, the thermal insulator having a first end and a second end,

wherein the first end of the thermal insulator contacts the first plate, and does not contact the side frame,

wherein the second end of the thermal insulator contacts the side frame, and does not contact the first plate, and

wherein each of the side frame and the thermal insulator is configured to form a wall defining the vacuum space.

14. The vacuum adiabatic body according to claim 13 , wherein the thermal insulator is not supported directly by a structure within the vacuum space, or is indirectly supported by the structure within the vacuum space.

15. The vacuum adiabatic body according to claim 13 , wherein the thermal insulator does not contact an inner surface of the first plate or an inner surface of the second plate, the inner surface of the first plate and the inner surface of the second plate configured to form the vacuum space.

16. The vacuum adiabatic body according to claim 13 , wherein the thermal insulator includes a conductive resistance sheet provided at the first plate and configured to be curved into the vacuum space.

17. The vacuum adiabatic body according to claim 13 , wherein the thermal insulator includes at least one radiation resistance sheet within the vacuum space.

18. The vacuum adiabatic body according to claim 13 , wherein the thermal insulator includes porous material within the vacuum space.

19. A vacuum adiabatic body comprising:

a first plate;

a second plate;

a vacuum space to be provided between the first plate and the second plate;

a support to be provided in the vacuum space to maintain a gap in the vacuum space;

a thermal insulator configured to reduce heat transfer between the first plate and the second plate; and

a side frame to be provided between the first plate and the second plate,

wherein the thermal insulator is not supported directly by a structure within the vacuum space, or is indirectly supported by the structure within the vacuum space,

wherein the thermal insulator does not contact an inner surface of the first plate or an inner surface of the second plate, the inner surface of the first plate and the inner surface of the second plate configured to form the vacuum space.

20. The vacuum adiabatic body according to claim 19 , wherein the thermal insulator includes a conductive resistance sheet provided at the first plate and configured to be curved into the vacuum space.

21. The vacuum adiabatic body according to claim 19 , wherein the thermal insulator includes at least one radiation resistance sheet within the vacuum space.

22. The vacuum adiabatic body according to claim 19 , wherein the thermal insulator includes porous material within the vacuum space.

Priority Claims (1)
KR 10-2015-0110010 · Aug 4, 2015 · national
Continuity (3)
Continuation 16942262 · Jul 29, 2020
Continuation 15749146
Related Publication 20220316791A1 · Oct 6, 2022
References Cited (400)
US 1413169A · Lawton · 1922 [cited by applicant]
US 1588707A · Alexander · 1926 [cited by applicant]
US 1845353A · Snell · 1932 [cited by applicant]
US 1898977A · Comstock · 1933 [cited by applicant]
US 2000882A · Comstock · 1935 [cited by applicant]
US 2550040A · Clar · 1951 [cited by applicant]
US 2708774A · Seelen · 1955 [cited by applicant]
US 2715976A · Whitmore · 1955 [cited by applicant]
US 2729863A · Kurtz · 1956 [cited by applicant]
US 2768046A · Evans · 1956 [cited by applicant]
US 2786241A · Garvey et al. · 1957 [cited by applicant]
US 3091946A · Kesling · 1963 [cited by applicant]
US 3161265A · Matsch et al. · 1964 [cited by applicant]
US 3289423A · Berner et al. · 1966 [cited by applicant]
US 3370740A · Anderson · 1968 [cited by applicant]
US 3520581A · Borghi · 1970 [cited by applicant]
US 4056211A · Zumwalt · 1977 [cited by applicant]
US 4646934A · McAllister · 1987 [cited by applicant]
US 4822117A · Boston, Jr. · 1989 [cited by applicant]
US 4959111A · Kruck et al. · 1990 [cited by applicant]
US 5011729A · McAllister · 1991 [cited by applicant]
US 5018328A · Cur · 1991 [cited by applicant]
US 5033803A · Katsuyoshi et al. · 1991 [cited by applicant]
US 5185981A · Martinez · 1993 [cited by applicant]
US 5200015A · Schilf · 1993 [cited by applicant]
US 5361598A · Roseen · 1994 [cited by applicant]
US 5512345A · Tsutsumi et al. · 1996 [cited by applicant]
US 5532034A · Kirby et al. · 1996 [cited by applicant]
US 5694789A · Do · 1997 [cited by applicant]
US 5795639A · Lin · 1998 [cited by applicant]
US 5843353A · De Vos et al. · 1998 [cited by applicant]
US 5947479A · Ostrowski · 1999 [cited by applicant]
US 5966888A · Richardson · 1999 [cited by applicant]
US 6001890A · Hamilton · 1999 [cited by applicant]
US 6029846A · Hirath et al. · 2000 [cited by applicant]
US 6038830A · Hirath et al. · 2000 [cited by applicant]
US 6109712A · Haworth et al. · 2000 [cited by applicant]
US 6168040B1 · Sautner et al. · 2001 [cited by applicant]
US 6192703B1 · Salyer et al. · 2001 [cited by applicant]
US 6244458B1 · Frysinger et al. · 2001 [cited by applicant]
US 6280814B1 · Offermann · 2001 [cited by applicant]
US 6338536B1 · Ueno et al. · 2002 [cited by applicant]
US 6427945B1 · Bansemir · 2002 [cited by applicant]
US 6485122B2 · Wolf · 2002 [cited by applicant]
US 6485805B1 · Smith · 2002 [cited by applicant]
US 6739104B2 · Tokonabe · 2004 [cited by applicant]
US 6860082B1 · Yamamoto · 2005 [cited by applicant]
US 7001656B2 · Maignan · 2006 [cited by applicant]
US 7111752B2 · Bucher · 2006 [cited by applicant]
US 7169459B2 · Lichodziejewski · 2007 [cited by applicant]
US 7288326B2 · Elzey · 2007 [cited by applicant]
US 7954301B2 · Mills · 2011 [cited by applicant]
US 8383225B2 · Rotter · 2013 [cited by applicant]
US 8857931B2 · Jung · 2014 [cited by applicant]
US 8881398B2 · Hanley et al. · 2014 [cited by applicant]
US 8943770B2 · Sanders · 2015 [cited by applicant]
US 8944541B2 · Allard · 2015 [cited by applicant]
US 9182158B2 · Wu · 2015 [cited by applicant]
US 9328951B2 · Shin · 2016 [cited by applicant]
US 9441779B1 · Alshourbagy et al. · 2016 [cited by applicant]
US 9463918B2 · Reid · 2016 [cited by applicant]
US 9752818B2 · Naik · 2017 [cited by applicant]
US 9791204B2 · Kim · 2017 [cited by applicant]
US 9945600B2 · Kang · 2018 [cited by applicant]
US 10082328B2 · Jung et al. · 2018 [cited by applicant]
US 10274247B2 · Jeong et al. · 2019 [cited by applicant]
US 20020041134A1 · Wolf et al. · 2002 [cited by applicant]
US 20020100250A1 · Hirath et al. · 2002 [cited by applicant]
US 20020170265A1 · Tokonabe et al. · 2002 [cited by applicant]
US 20030080126A1 · Voute et al. · 2003 [cited by applicant]
US 20030115838A1 · Rouanet et al. · 2003 [cited by applicant]
US 20030207075A1 · Maignan et al. · 2003 [cited by applicant]
US 20040051427A1 · Cittadini et al. · 2004 [cited by applicant]
US 20040091688A1 · Gaku · 2004 [cited by applicant]
US 20040226956A1 · Brooks · 2004 [cited by applicant]
US 20050175809A1 · Hirai et al. · 2005 [cited by applicant]
US 20050235682A1 · Hirai et al. · 2005 [cited by applicant]
US 20070089989A1 · Hoagland · 2007 [cited by applicant]
US 20070152551A1 · Kim · 2007 [cited by applicant]
US 20070204648A1 · Smale et al. · 2007 [cited by applicant]
US 20070243358A1 · Gandini · 2007 [cited by applicant]
US 20080110128A1 · Hirath · 2008 [cited by applicant]
US 20080289898A1 · Rickards · 2008 [cited by applicant]
US 20090031659A1 · Kalfon · 2009 [cited by applicant]
US 20090113899A1 · Dain · 2009 [cited by applicant]
US 20100104923A1 · Takeguchi · 2010 [cited by applicant]
US 20100178439A1 · Bettger et al. · 2010 [cited by applicant]
US 20100283359A1 · Hottmann · 2010 [cited by applicant]
US 20110089802A1 · Cording · 2011 [cited by applicant]
US 20110146333A1 · Koo et al. · 2011 [cited by applicant]
US 20110241513A1 · Nomura · 2011 [cited by applicant]
US 20110296797A1 · Stark et al. · 2011 [cited by applicant]
US 20120103006A1 · Jung · 2012 [cited by applicant]
US 20120104923A1 · Jung et al. · 2012 [cited by applicant]
US 20120118002A1 · Kim et al. · 2012 [cited by applicant]
US 20120125039A1 · Hwang · 2012 [cited by applicant]
US 20120128920A1 · Yoon et al. · 2012 [cited by applicant]
US 20120231204A1 · Jeon et al. · 2012 [cited by applicant]
US 20120269996A1 · Jäger · 2012 [cited by applicant]
US 20120326587A1 · Jeong et al. · 2012 [cited by applicant]
US 20130008309A1 · Hashida · 2013 [cited by applicant]
US 20130026900A1 · Oh et al. · 2013 [cited by applicant]
US 20130099650A1 · Lee et al. · 2013 [cited by applicant]
US 20130105494A1 · Jung · 2013 [cited by applicant]
US 20130105495A1 · Jung · 2013 [cited by applicant]
US 20130105496A1 · Jung · 2013 [cited by applicant]
US 20130195544A1 · Sanders et al. · 2013 [cited by applicant]
US 20130255304A1 · Cur et al. · 2013 [cited by applicant]
US 20130257257A1 · Cur · 2013 [cited by applicant]
US 20130293080A1 · Kim · 2013 [cited by applicant]
US 20140103791A1 · Cheon · 2014 [cited by applicant]
US 20140132142A1 · Kim et al. · 2014 [cited by applicant]
US 20140216100A1 · Toshimitsu et al. · 2014 [cited by applicant]
US 20140272208A1 · Song et al. · 2014 [cited by applicant]
US 20140315011A1 · Lee et al. · 2014 [cited by applicant]
US 20140346942A1 · Kim et al. · 2014 [cited by applicant]
US 20150068401A1 · Hashida · 2015 [cited by applicant]
US 20150192356A1 · Kang et al. · 2015 [cited by applicant]
US 20150360842A1 · Bessho et al. · 2015 [cited by applicant]
US 20160108659A1 · Stark et al. · 2016 [cited by applicant]
US 20160109172A1 · Kim et al. · 2016 [cited by applicant]
US 20160356542A1 · Kim et al. · 2016 [cited by applicant]
US 20170325634A1 · Cai et al. · 2017 [cited by applicant]
US 20180266620A1 · Kawarazaki · 2018 [cited by applicant]
US 20180299060A1 · Song · 2018 [cited by applicant]
US 20180313492A1 · Kitano · 2018 [cited by applicant]
US 20190101320A1 · Dherde et al. · 2019 [cited by applicant]
US 20190128593A1 · Deka et al. · 2019 [cited by applicant]
CN 1132346 · 1996 [cited by applicant]
CN 1191959 · 1998 [cited by applicant]
CN 1276052 · 2000 [cited by applicant]
CN 1286386 · 2001 [cited by applicant]
CN 1515857 · 2004 [cited by applicant]
CN 1576678 · 2005 [cited by applicant]
CN 2700790 · 2005 [cited by applicant]
CN 1666071 · 2005 [cited by applicant]
CN 2748848 · 2005 [cited by applicant]
CN 1731053 · 2006 [cited by applicant]
CN 1820173 · 2006 [cited by applicant]
CN 1896657 · 2007 [cited by applicant]
CN 101072968 · 2007 [cited by applicant]
CN 101171472 · 2008 [cited by applicant]
CN 101349493 · 2009 [cited by applicant]
CN 201191121 · 2009 [cited by applicant]
CN 201428906 · 2010 [cited by applicant]
CN 201764779 · 2011 [cited by applicant]
CN 102032736 · 2011 [cited by applicant]
CN 201811526 · 2011 [cited by applicant]
CN 102099646 · 2011 [cited by applicant]
CN 102116402 · 2011 [cited by applicant]
CN 102261470 · 2011 [cited by applicant]
CN 102455103 · 2012 [cited by applicant]
CN 102455104 · 2012 [cited by applicant]
CN 102455105 · 2012 [cited by applicant]
CN 102735013 · 2012 [cited by applicant]
CN 102818421 · 2012 [cited by applicant]
CN 102840729 · 2012 [cited by applicant]
CN 102927740 · 2013 [cited by applicant]
CN 103062981 · 2013 [cited by applicant]
CN 103090615 · 2013 [cited by applicant]
CN 103090616 · 2013 [cited by applicant]
CN 103140640 · 2013 [cited by applicant]
CN 103154648 · 2013 [cited by applicant]
CN 103189696 · 2013 [cited by applicant]
CN 103228851 · 2013 [cited by applicant]
CN 203095854 · 2013 [cited by applicant]
CN 103363764 · 2013 [cited by applicant]
CN 103370587 · 2013 [cited by applicant]
CN 103542660 · 2014 [cited by applicant]
CN 103575038 · 2014 [cited by applicant]
CN 103649658 · 2014 [cited by applicant]
CN 103968196 · 2014 [cited by applicant]
CN 104180595 · 2014 [cited by applicant]
CN 104204646 · 2014 [cited by applicant]
CN 104254749 · 2014 [cited by applicant]
CN 104344653 · 2015 [cited by applicant]
CN 104457117A · 2015 [cited by applicant]
CN 104482707 · 2015 [cited by applicant]
CN 104567215 · 2015 [cited by applicant]
CN 104634047 · 2015 [cited by applicant]
CN 104696669 · 2015 [cited by applicant]
CN 104729201 · 2015 [cited by applicant]
CN 104746690 · 2015 [cited by applicant]
CN 105546923 · 2016 [cited by applicant]
CN 108354755 · 2018 [cited by applicant]
DE 956899 · 1957 [cited by applicant]
DE 2802910 · 1978 [cited by applicant]
DE 2939878 · 1981 [cited by applicant]
DE 3121351 · 1982 [cited by applicant]
DE 9204365 · 1992 [cited by applicant]
DE 19745825 · 1999 [cited by applicant]
DE 19803908 · 1999 [cited by applicant]
DE 29912917 · 1999 [cited by applicant]
DE 19907182 · 2000 [cited by applicant]
DE 102011050473 · 2011 [cited by applicant]
DE 102011014302 · 2012 [cited by applicant]
DE 102011079209 · 2013 [cited by applicant]
DE 102012100490 · 2013 [cited by applicant]
DE 102012223539 · 2014 [cited by applicant]
EP 0071090 · 1983 [cited by applicant]
EP 0658716 · 1995 [cited by applicant]
EP 0658733 · 1995 [cited by applicant]
EP 0892120 · 1999 [cited by applicant]
EP 1477752 · 2004 [cited by applicant]
EP 1484563 · 2004 [cited by applicant]
EP 1614954 · 2006 [cited by applicant]
EP 2333179 · 2011 [cited by applicant]
EP 2447639 · 2012 [cited by applicant]
EP 2806239 · 2014 [cited by applicant]
EP 2824405 · 2015 [cited by applicant]
EP 2829827 · 2015 [cited by applicant]
EP 2936013 · 2015 [cited by applicant]
EP 2952839 · 2015 [cited by applicant]
EP 2952838 · 2015 [cited by applicant]
EP 2789951 · 2020 [cited by applicant]
GB 890372 · 1962 [cited by applicant]
GB 2446053 · 2008 [cited by applicant]
JP H04341694 · 1992 [cited by applicant]
JP H0510494 · 1993 [cited by applicant]
JP H07234067 · 1995 [cited by applicant]
JP H09145241 · 1997 [cited by applicant]
JP 11211334 · 1999 [cited by applicant]
JP H11335114 · 1999 [cited by applicant]
JP 2002243091A · 2002 [cited by applicant]
JP 2002340280 · 2002 [cited by applicant]
JP 2003106760 · 2003 [cited by applicant]
JP 2003269688 · 2003 [cited by applicant]
JP 2004044980 · 2004 [cited by applicant]
JP 2004196411 · 2004 [cited by applicant]
JP 2005214372A · 2005 [cited by applicant]
JP 2007218509 · 2007 [cited by applicant]
JP 2008045580 · 2008 [cited by applicant]
JP 2008249003 · 2008 [cited by applicant]
JP 2009078261A · 2009 [cited by applicant]
JP 2010008011 · 2010 [cited by applicant]
JP 2012087993 · 2012 [cited by applicant]
JP 2012255607 · 2012 [cited by applicant]
JP 2013119966A · 2013 [cited by applicant]
JP 2013195009 · 2013 [cited by applicant]
JP 2014037931 · 2014 [cited by applicant]
KR 1019920703942 · 1992 [cited by applicant]
KR 1020010073363 · 2001 [cited by applicant]
KR 100343719 · 2002 [cited by applicant]
KR 100411841 · 2003 [cited by applicant]
KR 1020050065088 · 2005 [cited by applicant]
KR 20070052156 · 2007 [cited by applicant]
KR 1020090111632 · 2009 [cited by applicant]
KR 1020100097410 · 2010 [cited by applicant]
KR 1020100099629 · 2010 [cited by applicant]
KR 1020100119937 · 2010 [cited by applicant]
KR 1020100136614 · 2010 [cited by applicant]
KR 1020110015322 · 2011 [cited by applicant]
KR 1020110015325 · 2011 [cited by applicant]
KR 1020110015327 · 2011 [cited by applicant]
KR 101041086 · 2011 [cited by applicant]
KR 1020110100440 · 2011 [cited by applicant]
KR 1020120044558A · 2012 [cited by applicant]
KR 1020120139648 · 2012 [cited by applicant]
KR 101227516 · 2013 [cited by applicant]
KR 1020130048528 · 2013 [cited by applicant]
KR 1020130048530A · 2013 [cited by applicant]
KR 1020130054213 · 2013 [cited by applicant]
KR 1020140129552 · 2014 [cited by applicant]
KR 1020150012712 · 2015 [cited by applicant]
KR 101506413 · 2015 [cited by applicant]
NL 1005962 · 1998 [cited by applicant]
RU 129188 · 2013 [cited by applicant]
WO WO9325843 · 1993 [cited by applicant]
WO WO2006003199 · 2006 [cited by applicant]
WO WO2011016693 · 2011 [cited by applicant]
WO WO2012084874 · 2012 [cited by applicant]
WO WO2012176880 · 2012 [cited by applicant]
WO WO2013007568 · 2013 [cited by applicant]
WO WO2014049969 · 2014 [cited by applicant]
WO WO2014175639 · 2014 [cited by applicant]
WO WO2016208193A1 · 2016 [cited by applicant]
WO WO2017023095 · 2017 [cited by applicant]
WO WO2017192121 · 2017 [cited by applicant]
WO WO2018044274 · 2018 [cited by applicant]
Chinese Office Action dated Aug. 30, 2023 issued in Application No. 202110718284.8. [cited by applicant]
European Search Report dated Nov. 3, 2022 issued in EP Application No. 22151005.0. [cited by applicant]
U.S. Notice of Allowance dated Oct. 23, 2023, issued in U.S. Appl. No. 17/072,231. [cited by applicant]
Korean Office Action dated Nov. 1, 2023 issued in Application No. 10-2023-0015566. [cited by applicant]
U.S. Office Action dated Apr. 27, 2023 issued in U.S. Appl. No. 17/072,231. [cited by applicant]
U.S. Notice of Allowance dated Mar. 23, 2023 issued in U.S. Appl. No. 16/953,846. [cited by applicant]
International Search Report and Written Opinion dated Oct. 12, 2016 issued in Application No. PCT/KR2016/008465. [cited by applicant]
International Search Report and Written Opinion dated Oct. 12, 2016 issued in Application No. PCT/KR2016/008507. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008466. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008468. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008469. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008470. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008501. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008502. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008505. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008519. [cited by applicant]
International Search Report and Written Opinion dated Nov. 21, 2016 issued in Application No. PCT/KR2016/008523. [cited by applicant]
International Search Report and Written Opinion dated Dec. 7, 2016 issued in Application No. PCT/KR2016/008516. [cited by applicant]
International Search Report and Written Opinion dated Dec. 23, 2016 issued in Application No. PCT/KR2016/008512. [cited by applicant]
International Search Report and Written Opinion dated Dec. 23, 2016 issued in Application No. PCT/KR2016/008514. [cited by applicant]
Russian Office Action dated Sep. 25, 2018 issued in Application No. 2018107646. [cited by applicant]
European Search Report dated Dec. 21, 2018 issued in Application No. 16833330.0. [cited by applicant]
European Search Report dated Feb. 13, 2019 issued in Application No. 16833309.4. [cited by applicant]
European Search Report dated Feb. 13, 2019 issued in Application No. 16833311.0. [cited by applicant]
European Search Report dated Feb. 20, 2019 issued in Application No. 16833313.6. [cited by applicant]
European Search Report dated Feb. 22, 2019 issued in Application No. 16833312.8. [cited by applicant]
European Search Report dated Feb. 26, 2019 issued in Application No. 16833324.3. [cited by applicant]
European Search Report dated Feb. 26, 2019 issued in Application No. 16833336.7. [cited by applicant]
European Search Report dated Mar. 1, 2019 issued in Application No. 16833338.3. [cited by applicant]
European Search Report dated Mar. 1, 2019 issued in Application No. 16833323.5. [cited by applicant]
European Search Report dated Mar. 13, 2019 issued in Application No. 16833331.8. [cited by applicant]
European Search Report dated Mar. 15, 2019 issued in Application No. 16833326.8. [cited by applicant]
European Search Report dated Apr. 3, 2019 issued in Application No. 16833325.0. [cited by applicant]
U.S. Office Action dated Jun. 13, 2019 issued in related U.S. Appl. No. 15/749,139. [cited by applicant]
U.S. Office Action dated Jun. 13, 2019 issued in related U.S. Appl. No. 15/749,142. [cited by applicant]
U.S. Office Action dated Jun. 13, 2019 issued in related U.S. Appl. No. 15/749,136. [cited by applicant]
Chinese Office Action (with English translation) dated Jul. 15, 2019 issued in CN Application No. 201680045949.0. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045869.5. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045899.6. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045908.1. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680045935.9. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680046042.6. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 5, 2019 issued in CN Application No. 201680046048.3. [cited by applicant]
Chinese Office Action (with English translation) dated Aug. 13, 2019 issued in CN Application No. 201680045950.3. [cited by applicant]
Chinese Office Action (with English translation) dated Sep. 19, 2019 issued in CN Application No. 201680045897. 7. [cited by applicant]
Chinese Office Action (with English translation) dated Sep. 19, 2019 issued in CN Application No. 201680045898.1. [cited by applicant]
Chinese Office Action (with English translation) dated Sep. 19, 2019 issued in CN Application No. 201680046047.9. [cited by applicant]
U.S. Office Action dated Sep. 20, 2019 issued in U.S. Appl. No. 15/749,149. [cited by applicant]
U.S. Office Action dated Oct. 4, 2019 issued in related U.S. Appl. No. 15/749,140. [cited by applicant]
U.S. Office Action dated Oct. 17, 2019 issued in U.S. Appl. No. 15/749,147. [cited by applicant]
U.S. Office Action dated Oct. 17, 2019 issued in U.S. Appl. No. 15/749,143. [cited by applicant]
U.S. Office Action dated Oct. 17, 2019 issued in U.S. Appl. No. 15/749,162. [cited by applicant]
U.S. Office Action dated Dec. 10, 2019 issued in U.S. Appl. No. 15/749,132. [cited by applicant]
United States Office Action dated Mar. 20, 2020 issued in co-pending related U.S. Appl. No. 15/749,162. [cited by applicant]
United States Office Action dated Mar. 24, 2020 issued in co-pending related U.S. Appl. No. 15/749,154. [cited by applicant]
United States Office Action dated May 25, 2020 issued in co-pending related U.S. Appl. No. 15/749,156. [cited by applicant]
United States Office Action dated Mar. 27, 2020 issued in co-pending related U.S. Appl. No. 15/749,149. [cited by applicant]
United States Office Action dated Apr. 15, 2020 issued in co-pending related U.S. Appl. No. 15/749,136. [cited by applicant]
United States Notice of Allowance dated Apr. 15, 2020 issued in co-pending related U.S. Appl. No. 15/749,140. [cited by applicant]
Korean Office Action dated Jun. 5, 2020 issued in Application 10-2017-0093784. [cited by applicant]
Extended European Search Report dated Jul. 10, 2020 issued in Application 20168389.3. [cited by applicant]
U.S. Office Action dated Sep. 1, 2020 issued in U.S. Appl. No. 15/749,156. [cited by applicant]
Australian Office Action dated Nov. 13, 2020 issued in AU Application No. 2020200641. [cited by applicant]
European Office Action dated Jan. 11, 2021 issued in Application 16 833 313.6. [cited by applicant]
U.S. Office Action dated Mar. 31, 2021 issued in co-pending U.S. Appl. No. 15/749,132. [cited by applicant]
Chinese Office Action dated Jun. 2, 2021 issued in CN Application No. 202010634146.7. [cited by applicant]
Chinese Office Action dated Apr. 6, 2021 issued in CN Application No. 202010248772.2. [cited by applicant]
Chinese Office Action dated Apr. 6, 2021 issued in CN Application No. 202010248789.8. [cited by applicant]
Chinese Office Action dated Apr. 6, 2021 issued in CN Application No. 202010248791.5. [cited by applicant]
Chinese Office Action dated Apr. 8, 2021 issued in CN Application No. 202010248891.8. [cited by applicant]
Chinese Office Action dated Jun. 23, 2021 issued in CN Application No. 202010669915.7. [cited by applicant]
Chinese Office Action dated Jun. 24, 2021 issued in CN Application No. 202010669926.5. [cited by applicant]
United States Office Action dated Jun. 28, 2021 issued in co-pending related U.S. Appl. No. 15/749,156. [cited by applicant]
Chinese Office Action and Search Report dated Jul. 20, 2021 issued in Application 20101067100.X. [cited by applicant]
Korean Office Action dated Aug. 1, 2021 issued in KR Application No. 10-2021-0085731. [cited by applicant]
Chinese Office Action dated Aug. 2, 2021 issued in CN Application No. 202010972409.5. [cited by applicant]
Chinese Office Action dated Aug. 3, 2021 issued in CN Application No. 202010972419.9. [cited by applicant]
Chinese Office Action dated Aug. 4, 2021 issued in CN Application No. 202010972442.8. [cited by applicant]
U.S. Office Action dated Oct. 5, 2021 issued in parent U.S. Appl. No. 16/942,262. [cited by applicant]
European Search Report dated Oct. 11, 2021 issued in EP Application No. 21185349.4. [cited by applicant]
European Search Report dated Oct. 11, 2021 issued in EP Application No. 21185362.7. [cited by applicant]
U.S. Office Action dated Oct. 19, 2021 issued in co-pending related U.S. Appl. No. 17/021,582. [cited by applicant]
U.S. Office Action dated Oct. 26, 2021 issued in co-pending related U.S. Appl. No. 16/942,213. [cited by applicant]
Chinese Office Action dated Dec. 3, 2021 issued in CN Application No. 202110032077.7. [cited by applicant]
European Search Report dated Feb. 8, 2022 issued in EP Application No. 21203498.7. [cited by applicant]
Chinese Office Action dated Feb. 15, 2022 issued in CN Application No. 202010671000.X. [cited by applicant]
Chinese Office Action dated Feb. 18, 2022 issued in CN Application No. 202010975466.9. [cited by applicant]
U.S. Office Action dated Mar. 2, 2022 issued in co-pending related U.S. Appl. No. 17/170,005. [cited by applicant]
U.S. Office Action dated Mar. 31, 2022 issued in co-pending related U.S. Appl. No. 16/929,523. [cited by applicant]
U.S. Non-Final Office Action dated Feb. 27, 2024 issued in U.S. Appl. No. 17/980,088. [cited by applicant]
Chinese Office Action dated May 18, 2022 issued in CN Application No. 202110718315.X. [cited by applicant]
United States Office Action dated Jun. 10, 2022 issued in co-pending related U.S. Appl. No. 16/942,213. [cited by applicant]
United States Office Action dated Jan. 18, 2023 issued in co-pending related U.S. Appl. No. 16/942,213. [cited by applicant]
United States Office Action dated Oct. 6, 2022 issued in co-pending related U.S. Appl. No. 17/072,231. [cited by applicant]
United States Office Action dated Dec. 22, 2022 issued in co-pending related U.S. Appl. No. 16/953,846. [cited by applicant]
Chinese Notice of Allowance dated Jun. 1, 2022 issued in CN Application No. 202110032072.4. [cited by applicant]
Korean Office Action dated Aug. 8, 2022 issued in KR Application No. 10-2015-0109622. [cited by applicant]
U.S. Office Action dated Jan. 24, 2024 issued in U.S. Appl. No. 17/582,596. [cited by applicant]
U.S. Office Action dated Nov. 22, 2023 issued in U.S. Appl. No. 17/939,507. [cited by applicant]
U.S. Office Action dated Mar. 20, 2023 issued in co-pending related U.S. Appl. No. 17/030,806. [cited by applicant]
Machine translation of EP 2 952 839. [cited by applicant]
Korean Notice of Allowance dated Jun. 1, 2022 issued in KR Application No. 10-2021-0085731. [cited by applicant]
U.S. Office Action dated Mar. 18, 2024, issued in U.S. Appl. No. 18/237,531. [cited by applicant]
Korean Office Action dated Nov. 13, 2023 issued in Application No. 10-2023-0014241. [cited by applicant]
Korean Office Action dated Jul. 31, 2023 issued in Application 10-2023-0020717. [cited by applicant]
Korean Notice of Allowance dated Nov. 2, 2022 issued in KR Application No. 10-2015-0109720. [cited by applicant]
European Office Action dated Nov. 21, 2022 issued in EP Application No. 20168389.3. [cited by applicant]
United States Office Action dated Nov. 25, 2022 issued in co-pending related U.S. Appl. No. 17/411,659. [cited by applicant]
U.S. Appl. No. 17/114,950, filed Dec. 8, 2020. [cited by applicant]
U.S. Appl. No. 16/942,213, filed Jul. 29, 2020. [cited by applicant]
U.S. Appl. No. 17/030,806, filed Sep. 24, 2020. [cited by applicant]
U.S. Appl. No. 16/929,523, filed Jul. 15, 2020. [cited by applicant]
U.S. Appl. No. 17/021,582, filed Sep. 15, 2020. [cited by applicant]
U.S. Appl. No. 17/072,231, filed Oct. 16, 2020. [cited by applicant]
U.S. Appl. No. 16/953,846, filed Nov. 20, 2020. [cited by applicant]
U.S. Appl. No. 17/155,430, filed Jan. 22, 2021. [cited by applicant]
U.S. Appl. No. 17/134,911, filed Dec. 28, 2020. [cited by applicant]
United States Office Action dated Jul. 7, 2022 issued in co-pending related U.S. Appl. No. 16/710,720. [cited by applicant]
United States Office Action dated Jul. 13, 2022 issued in co-pending related U.S. Appl. No. 17/134,911. [cited by applicant]
United States Office Action dated Jul. 26, 2022 issued in co-pending related U.S. Appl. No. 17/030,806. [cited by applicant]
U.S. Office Action dated Nov. 18, 2024 issued in U.S. Appl. No. 18/095,658. [cited by applicant]