Method of manufacturing a semiconductor device
View Patent ↗A method of manufacturing a semiconductor device, including: providing a substrate including a first cell and a second cell; forming a plurality of first metal strips on a first plane; forming a first trench over a boundary between the first cell and the second cell, wherein a bottom surface of the first trench is located on a second plane over the first plane; filling the first trench with a non-conductive material, resulting in a separating wall; and forming a plurality of second metal strips on a third plane over the second plane, wherein the plurality of second metal strips comprise a first second metal strip and a second second metal strip separated from each other by the separating wall.
1. A method of manufacturing a semiconductor device, the method comprising:
providing a substrate including a first cell and a second cell;
forming a plurality of first metal strips on a first plane;
forming a first trench over a boundary between the first cell and the second cell, wherein a bottom surface of the first trench is located on a second plane over the first plane;
filling the first trench with a non-conductive material, resulting in a separating wall; and
forming a plurality of second metal strips on a third plane over the second plane, wherein the plurality of second metal strips comprise a first second metal strip and a second second metal strip separated from each other by the separating wall.
2. The method of claim 1 , wherein the plurality of first metal strip includes a first first metal strip immediate adjacent to the boundary, and forming the plurality of second metal strips on the third plane comprises:
forming a second trench around the separating wall on the first first metal strip.
3. The method of claim 2 , wherein forming the plurality of second metal strips further comprises:
filling the second trench with a conductive material, resulting in a contact via and the first second metal strip;
wherein the contact via is connected between the first first metal strip and the first second metal strip.
4. The method of claim 3 , wherein a distance between the contact via and the wall is smaller than 5 nm.
5. The method of claim 1 , wherein the separating wall includes at least one of aluminum oxide, chromic oxide, erbium oxide, hafnium oxide, silicon oxide, silicon nitride, carbon oxidation silicon, and silicon oxynitride.
6. The method of claim 1 , wherein a width of the separating wall is smaller than 10 nm.
7. The method of claim 1 , further comprising:
forming a contact via on the first second metal strip; and
forming a third metal strip on the contact via.
8. The method of claim 7 , wherein a height of the contact via is in a range from 10 to 100 nm.
9. The method of claim 7 , wherein a height of the contact via is in a range from 100 to 200 nm.
10. A method of manufacturing semiconductor device, comprising:
providing a substrate including a first cell and a second cell;
forming a plurality of first metal strips on a first plane, wherein a first portion of the plurality of first metal strips are disposed above the first cell while a second portion of the first metal strips are disposed above the second cell;
forming a separating wall on a boundary between the first cell and the second cell, wherein the separating wall is formed on a second plane over the first plane; and
forming a plurality of second metal strips on a third plane over the second plane, wherein a first second metal strip and a second second metal strip are separated from each other by the separating wall.
11. The method of claim 10 , further comprising:
depositing a first contact via on a first first metal strip of the plurality of first metal strips, wherein the first first metal strip is formed immediate adjacent to the boundary;
wherein a distance between the first contact via and the separating wall is smaller than 5 nm.
12. The method of claim 10 , wherein the separating wall includes at least one of aluminum oxide, chromic oxide, erbium oxide, hafnium oxide, silicon oxide, silicon nitride, carbon oxidation silicon, and silicon oxynitride.
13. The method of claim 10 , wherein a width of the separating wall is less than 10 nm.
14. The method of claim 10 , further comprising:
depositing a second contact via on the first second metal strip; and
forming a third metal strip, wherein the third metal strip is disposed on the second contact via.
15. The method of claim 14 , wherein a height of the second contact via is located in a range from 10 nm to 100 nm.
16. The method of claim 14 , wherein a height of the second contact via is located in a range from 100 nm to 200 nm.
17. A method of manufacturing a semiconductor device, comprising:
forming a first cell and a second cell on a substrate;
forming a separating wall on a first plane along a boundary between the first cell and the second cell;
forming a plurality of first metal strips on a second plane below the first plane, wherein a first portion of the plurality of first metal strips are disposed above the first cell while a second portion of the first metal strips are disposed above the second cell; and
forming a plurality of second metal strips on a third plane over the second plane, wherein a first second metal strip and a second second metal strip are separated from each other by the separating wall.
18. The method of claim 17 , further comprising:
depositing a first contact via on a first first metal strip of the plurality of first metal strips, wherein the first first metal strip is formed immediate adjacent to the boundary;
wherein a distance between the first contact via and the separating wall is smaller than 5 nm.
19. The method of claim 17 , wherein the separating wall includes at least one of aluminum oxide, chromic oxide, erbium oxide, hafnium oxide, silicon oxide, silicon nitride, carbon oxidation silicon, and silicon oxynitride.
20. The method of claim 17 , wherein a width of the separating wall is less than 10 nm.