High-temperature stereolithography apparatus and methods of use thereof
In various aspects, top-down stereolithography apparatus and methods of use thereof are provided herein that allow for additive manufacturing of an article from a high-viscosity resin. The apparatus and methods can print resins having viscosities higher than conventional systems, e.g. viscosities up to about 100 Pa·s at the elevated temperature. The resin may have a room temperature viscosity of about 100 Pa·s, about 250 Pa·s, about 1000 Pa·s, or more. In some aspects, the resin is a solid at room temperature. The apparatus and methods do not rely upon solvents or other viscosity modifiers being added to the resin, and are capable of top-down additive manufacturing approaches which provide reduced stress on the printed article.
1. A top-down stereolithography apparatus for layer-by-layer additive manufacturing of an article from a high-viscosity resin, the top-down stereolithography apparatus comprising:
a vat for containing the high-viscosity resin, the vat having a first area comprising a lower surface, the vat further having at least one opening in the lower surface that opens to a second area of the vat that extends vertically below the lower surface;
a build platform within the second area, wherein the build platform is incrementally movable vertically by a plurality of increments with respect to the lower surface of the vat, and wherein each of the increments in the plurality of increments defines a layer thickness in the article;
a resin applicator within the vat, the resin applicator comprising at least one recoat blade that holds a portion of the resin within a portion of the first area of the vat comprising the lower surface so that the portion of the resin is positioned above the lower surface of the first area and away from the at least one opening, the at least one recoat blade of the resin applicator movable within the vat to scrape the portion of the resin across the at least one opening that opens to the second area in the vat and away from the at least one opening, wherein the scraping of the portion of the resin across the at least one opening forms a smooth resin layer within the at least one opening, wherein an upper surface of the smooth resin layer is level with the lower surface of the first area of the vat that holds the portion of the resin;
a light source positioned to project a patterned light onto the smooth resin layer to cure at least a portion of the resin in the smooth resin layer to form a layer of the article;
a heating apparatus enclosing at least the vat, the build platform, and the resin applicator to heat the resin, when the resin is in the vat, to an elevated temperature with respect to room temperature during the additive manufacturing; and
an optical window through which the patterned light is projected onto the smooth resin layer, wherein the light source is external to the heating apparatus.
2. The top-down stereolithography apparatus according to claim 1 , wherein the light source comprises an ultraviolet light source.
3. The top-down stereolithography apparatus according to claim 1 , wherein the light source comprises a pattern-forming element operatively associated with a controller.
4. The top-down stereolithography apparatus according to claim 1 , wherein the light source comprises a digital micromirror device (DMD), a spatial light modulator (SLM), a microelectromechanical system (MEMS) mirror array, a mask, a reticle, or a combination thereof.
5. The top-down stereolithography apparatus according to claim 1 , wherein the patterned light is projected onto the smooth resin layer from above during the additive manufacturing.
6. The top-down stereolithography apparatus according to claim 1 , wherein the elevated temperature is about 80° C. to about 250° C.
7. The top-down stereolithography apparatus according to claim 1 , wherein the layer thickness is about 10 μm to about 100 μm.
8. The top-down stereolithography apparatus according to claim 1 , wherein the resin applicator is configured to recoat a resin having a viscosity up to about 100 Pa·s at the elevated temperature.
9. The top-down stereolithography apparatus according to claim 1 , wherein the resin applicator comprises a revolving recoat blade rotatable about a central axis.
10. A method of manufacturing an article from a high-viscosity resin in a layer-by-layer approach, the method comprising:
providing a top-down stereolithography apparatus comprising:
a vat for containing the high-viscosity resin, the vat having a first area comprising a lower surface, the vat further having at least one opening in the lower surface that opens to a second area of the vat that extends vertically below the lower surface;
a build platform within the second area, wherein the build platform is incrementally movable vertically by a plurality of increments with respect to the lower surface of the vat, and wherein each of the increments in the plurality of increments defines a layer thickness in the article;
a resin applicator within the vat, the resin applicator comprising at least one recoat blade that holds a portion of the resin within a portion of the first area of the vat comprising the lower surface so that the portion of the resin is positioned above the lower surface of the first area and away from the at least one opening, the at least one recoat blade of the resin applicator movable within the vat to scrape the portion of the resin across the at least one opening that opens to the second area in the vat and away from the at least one opening;
a light source positioned to project a patterned light onto the smooth resin layer to cure at least a portion of the resin in the smooth resin layer to form a layer of the article;
a heating apparatus enclosing at least the vat, the build platform, and the resin applicator to heat the resin, when the resin is in the vat, to an elevated temperature with respect to room temperature during the additive manufacturing; and
an optical window through which the patterned light is projected onto the smooth resin layer, wherein the light source is external to the heating apparatus;
uniformly heating the high-viscosity resin to the elevated temperature with respect to room temperature to form a heated resin, wherein the heated resin is in the vat;
forming a first layer of the article by (i) positioning the build platform within the at least one opening at a distance below the lower surface of the vat, the distance defining a layer thickness, (ii) scraping the portion of the heated resin across the at least one opening to form a smooth resin layer within the at least one opening, wherein an upper surface of the smooth resin layer is level with the lower surface of the first area of the vat that holds the portion of the resin, the smooth resin layer having a thickness equal to the layer thickness, (iii) projecting the patterned light onto the smooth resin layer to cure at least a portion of the smooth resin layer to form the first layer of the article;
forming a subsequent layer of the article by (i) incrementally lowering the build platform in the opening the distance equal to the layer thickness, (ii) scraping the portion of the heated resin across the at least one opening to form another smooth resin layer within the at least one opening having a thickness equal to the layer thickness, (iii) projecting the patterned light source onto the smooth resin layer to cure at least a portion of the smooth resin layer to form the subsequent layer of the article on top of a previous layer of the article;
repeating the formation of a subsequent layer a number of times to form the article layer-by-layer.
11. The method according to claim 10 , wherein the elevated temperature is about 100° C. to about 250° C.
12. The method according to claim 10 , wherein the layer thickness is about 10 μm to about 100 μm.
13. The method according to claim 10 , wherein the resin is a solid at room temperature.
14. The method according to or claim 10 , wherein the heated resin has a viscosity of about 5 Pa·s or less at the elevated temperature.
15. The method according to claim 10 , wherein the heated resin has a viscosity of about 5 Pa·s to about 50 Pa·s at the elevated temperature.
16. The method according to claim 10 , wherein the resin comprises a polymer selected from the group consisting of a polyetherimide, a polyphenylene sulfide, a polyarylether ketone, a polyamide, a polyamide-imide, a thermoplastic polyimide, a copolymer thereof, and a blend thereof.
17. The method according to claim 10 , wherein the resin comprises a thermoplastic, a thermoset, a pseudo-thermoplastic, or a combination thereof.
18. The method according to claim 10 , wherein the resin is a solid at room temperature, and the method further comprises melting the solid resin and dissolving a photoinitiator in the melted resin.
19. The method according to claim 10 , wherein the resin is solvent-free.
20. The method according to claim 10 , wherein the article comprises features having dimensions of about 0.01 mm to about 1 mm.