Electronic device including heat transfer member
The electronic device includes a display including a first area and a second area, a first housing configured to support the first area and to form a first space, a second housing configured to support the second area and to form a second space, a hinge structure configured to foldably connect the first housing and the second housing based on a folding axis to be in a first state in which the first and second areas form substantially a same plane or in a second state in which the first and second areas face each other, and a heat transfer member provided to extend from the first space to the second space through the hinge structure and configured to perform a heat transfer between the first space and the second space.
1. An electronic device comprising:
a display comprising a first area and a second area foldable through a folding axis;
a first support plate positioned in a rear direction of the first area;
a second support plate positioned in a rear direction of the second area;
a hinge housing to which a hinge for rotating the first support plate and the second support plate based on the folding axis is fastened, provided along the folding axis, and connecting the first support plate and the second support plate;
a first printed circuit board (PCB) provided to face the first area based on the first support plate;
a second PCB provided to face the second area based on the second support plate; and
a heat transfer member comprising:
a first heat transfer area provided on a rear surface of the first area;
a second heat transfer area provided on the rear surface of the second area;
a connecting area connecting the first heat transfer area and the second heat transfer area across the hinge housing;
a heat transfer space internally formed and connected with the first heat transfer area and the second heat transfer area through the connecting area;
a cover configured to seal the heat transfer space; and
a first heat transfer area and a second heat transfer area of the cover comprise a metallic material and the connecting area comprises a flexible material.
2. The electronic device of claim 1 , wherein the heat transfer member further comprises:
a heat transfer fluid accommodated in the heat transfer space and undergoing a phase change according to a temperature; and
a wick structure provided in the heat transfer space and configured to move the heat transfer fluid in a liquid state.
3. The electronic device of claim 1 , further comprising:
a first front heat dissipation member and a second front heat dissipation member provided between the display and the heat transfer member and forming heat transfer paths between the first area and the second area and the heat transfer member, respectively.
4. The electronic device of claim 1 , further comprising:
a first rear heat dissipation member forming a heat transfer path between the first heat transfer area and the first PCB; and
a second rear heat dissipation member forming a heat transfer path between the second heat transfer area and the second PCB.