Heat dissipation sheet and heat dissipation sheet-attached device
An object of the present invention is to provide a heat dissipation sheet having an excellent heat dissipation property and a heat dissipation sheet-attached device in which the heat dissipation sheet is used. The heat dissipation sheet of the present invention contains a resin binder, and inorganic particles, in which the inorganic particles include at least inorganic particles B having a particle diameter of more than 100 μm, and an average height Rc of each of one and the other surfaces of the heat dissipation sheet is 0.1 μm or more and less than 2.0 μm.
1. A heat dissipation sheet comprising:
a resin binder; and
inorganic particles,
wherein the inorganic particles include at least inorganic particles B having a particle diameter of more than 100 μm and at least inorganic particles A having a particle diameter of 100 μm or less,
a total content of all inorganic particles A having a particle diameter of 100 μm or less is 5 to 150 parts by mass with respect to 100 parts by mass of the resin binder,
a total content of all inorganic particles B having a particle diameter of more than 100 μm is 50 to 500 parts by mass with respect to 100 parts by mass of the resin binder, and
an average height Rc of each surface of the heat dissipation sheet is 0.1 μm or more and less than 2.0 μm.
2. The heat dissipation sheet according to claim 1 ,
wherein a thickness of the heat dissipation sheet is 200 to 300 μm.
3. The heat dissipation sheet according to claim 2 ,
wherein the total content of all inorganic particles B having a particle diameter of more than 100 μm is 75 to 300 parts by mass with respect to 100 parts by mass of the resin binder.
4. The heat dissipation sheet according to claim 1 ,
wherein the inorganic particles A and the inorganic particles B are both at least one inorganic substance selected from the group consisting of an inorganic nitride and an inorganic oxide.
5. The heat dissipation sheet according to claim 2 ,
wherein the inorganic particles A and the inorganic particles B are both at least one inorganic substance selected from the group consisting of an inorganic nitride and an inorganic oxide.
6. The heat dissipation sheet according to claim 4 ,
wherein the inorganic nitride contains at least one selected from the group consisting of boron nitride and aluminum nitride.
7. The heat dissipation sheet according to claim 4 ,
wherein the inorganic oxide contains at least one selected from the group consisting of titanium oxide, aluminum oxide, and zinc oxide.
8. The heat dissipation sheet according to claim 1 ,
wherein the resin binder is a cured substance obtained by curing a curable composition containing a polymerizable monomer.
9. The heat dissipation sheet according to claim 8 ,
wherein the polymerizable monomer has at least one polymerizable group selected from the group consisting of an acryloyl group, a methacryloyl group, an oxiranyl group, and a vinyl group.
10. A heat dissipation sheet-attached device comprising:
a device; and
the heat dissipation sheet according to claim 1 disposed on the device.
11. A heat dissipation sheet-attached device comprising:
a device; and
the heat dissipation sheet according to claim 2 disposed on the device.
12. A heat dissipation sheet-attached device comprising:
a device; and
the heat dissipation sheet according to claim 4 disposed on the device.