IP Library › Granted Patent US 12,289,868
Granted Patent B2
US 12,289,868 · App. 18/435,866 · Granted Apr 29, 2025

Systems and methods for cooling a fluid circuit for cooling a rack of servers

Inventors: Chao-Jung Chen (Taoyuan, TW); Yu-Nien Huang (Taoyuan, TW); Sin-Hong Lien (Taoyuan, TW); Jen-Mao Chen (Taoyuan, TW)
Assignee: QUANTA COMPUTER INC.
H05K7/20663H05K7/20327H05K7/20354H05K7/202
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Quick Facts
Patent No.
US 12,289,868
App. No.
18/435,866
Granted
Apr 29, 2025
Kind
B2
Abstract

A system includes a rack of servers and a fluid circuit for cooling the rack of servers. The fluid circuit includes one or more cooling modules, a heat-exchanging module, and a pump. The one or more cooling modules are thermally connected to a conduit for flowing a coolant therethrough. Each cooling module includes a heat-exchanger thermally connected to the conduit and a chiller fluidly coupled to the heat-exchanger. The heat-exchanging module is fluidly connected to an outlet of the conduit. The pump is configured to drive the coolant from the heat-exchanging module to each server in the rack of servers.

Claims (42)

1. A rack of servers, the rack comprising:

a fluid conduit configured to flow a coolant therethrough, the fluid conduit being positioned with the rack and including portions in which the coolant flows distinctly as a heated coolant, a standby coolant, and a target coolant;

a plurality of heat-generating components in thermal communication with the fluid conduit, the plurality of heat-generating components being included in the servers and causing the heated coolant;

a heat-exchanging module fluidly coupled with the fluid conduit to receive the heated coolant from the plurality of heat-generating components, the heat-exchanging module being positioned within the rack and configured to cool the heated coolant into the standby coolant, the standby coolant having a cooler temperature than the heated coolant; and

a cooling module mounted within the rack and including

a heat-exchanger fluidly coupled with the heat exchanging module, the heat-exchanger receiving the standby coolant from the heat-exchanging module, and

a chiller fluidly coupled with the heat-exchanger to receive the standby coolant, the chiller being configured to cool the standby coolant into a target coolant, the target coolant having a lower temperature than the standby coolant, the chiller including

a manifold configured to circulate a refrigerant to cool the standby coolant into the target coolant,

a radiator coupled to the manifold and configured to remove heat from the refrigerant flowing through the manifold,

a compressor coupled to the manifold and configured to drive the refrigerant into the radiator, and

an expansion valve coupled to the manifold and configured to control flow of the refrigerant from the radiator to the compressor.

2. The rack of claim 1 , wherein the cooling module further has an inlet pipe for delivering the cooling fluid from the chiller to the heat-exchanger.

3. The rack of claim 2 , wherein the cooling module further has a pump fluidly coupled to the inlet pipe for driving the cooling fluid from the chiller to the heat-exchanger.

4. The rack of claim 2 , wherein the cooling module further has an outlet pipe for removing the cooling fluid from the heat-exchanger to the chiller.

5. The rack of claim 1 , wherein the cooling module further has an outlet pipe for removing the cooling fluid from the heat-exchanger to the chiller.

6. The rack of claim 1 , wherein the warm coolant is water delivered at a temperature of less than about 10 degrees Celsius.

7. The rack of claim 1 , further comprising a control unit communicatively coupled with the cooling module, the control unit being configured to execute operation of the cooling module.

8. The rack of claim 7 , wherein the control unit is physically located in a distribution unit of a server.

9. The rack of claim 7 , wherein the control unit is a baseboard management controller (BMC) in each server of a computing system.

10. The rack of claim 7 , wherein the control unit is configured to operate the chiller to cool down a coolant temperature if an inlet temperature of the heat-exchanger is greater than a starting temperature of the chiller.

11. A system comprising:

a rack of servers;

a fluid circuit configured to flow a coolant for cooling the rack of servers, the fluid circuit being positioned with the rack and including portions in which the coolant flows distinctly as a heated coolant, a standby coolant, and a target coolant;

a plurality of heat-generating components in thermal communication with the fluid circuit, the plurality of heat-generating components being included in the servers and causing the heated coolant;

a heat-exchanging module fluidly coupled with the fluid circuit to receive the heated coolant from the plurality of heat-generating components, the heat-exchanging module being positioned within the rack and configured to cool the heated coolant into the standby coolant, the standby coolant having a cooler temperature than the heated coolant;

one or more cooling modules mounted within the rack and thermally connected to the fluid circuit, each cooling module having

a heat-exchanger fluidly coupled with the heat-exchanging module, the heat-exchanger receiving the standby coolant from the heat-exchanging module,

a chiller fluidly coupled with the heat-exchanger to receive the standby coolant, the chiller being configured to cool the standby coolant into a target coolant, the target coolant having a lower temperature than the standby coolant, the chiller including

a manifold configured to circulate a refrigerant to cool the standby coolant into the target coolant,

a radiator coupled to the manifold and configured to remove heat from the refrigerant flowing through the manifold, and

a compressor coupled to the manifold and configured to drive the refrigerant into the radiator;

an inlet pipe for delivering the target coolant from the chiller to the heat exchanger; and

an outlet pipe for removing the standby coolant cooling fluid from the heat-exchanger to the chiller.

12. The system of claim 11 , further comprising:

a heat-exchanging module fluidly connected to an outlet of the fluid circuit; and

a pump configured to drive the target coolant from the heat-exchanging module to each server in the rack of servers.

13. The system of claim 11 , wherein the chiller further includes an expansion valve coupled to the manifold and configured to control flow of the refrigerant from the radiator to the compressor.

14. The system of claim 11 , further comprising a control unit communicatively coupled with the one or more cooling modules, the control unit being configured to execute operation of each one of the one or more cooling modules.

15. The system of claim 14 , wherein the control unit is physically located in a distribution unit of a server in the rack of servers.

16. The system of claim 14 , wherein the control unit is a baseboard management controller (BMC) in each server located in the rack of servers.

17. The system of claim 14 , wherein the control unit is configured to operate the chiller to cool down a coolant temperature if an inlet temperature of the heat-exchanger is greater than a starting temperature of the chiller.

18. The system of claim 11 , wherein the standby coolant is water delivered at a temperature of less than about 10 degrees Celsius.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2024
From: LIEN, SIN-HONG; HUANG, YU-NIEN; CHEN, CHAO-JUNG; CHEN, JEN-MAO
To: QUANTA COMPUTER INC.
Reel/Frame 066422/0495 →
Continuity (3)
Division 17387415 · Jul 28, 2021
Provisional Application 63182357 · Apr 30, 2021
Related Publication 20240179875A1 · May 30, 2024
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