Effect pigments having a reflective core and semiconductor layers
Disclosed herein is an effect pigment having a layer stack which comprises a highly reflective metallic flake having a first major interface and opposed to this first interface a second major interface, and at least one side surface and directly adjacent on one or of both of these major interfaces a layer of a semiconducting material having an average atomic composition of: a) Si (1-x) Sn x , wherein 0<x<0.90 or b) Ge (1-y) Sn y , wherein 0<y≤0.80 or c) Si (1-m-n) Ge m Sn n , wherein 0<m<1.00, 0<n<1.00 and with the proviso that m+n<1.00.
1. An effect pigment having a layer stack which comprises a highly reflective metallic flake having a first major interface and opposed to this first interface a second major interface, and at least one side surface and directly adjacent on one or of both of these major interfaces a layer of a semiconducting material having an average atomic composition of:
a) Si (1-x) Sn x , wherein 0<x<0.90 or
b) Ge (1-y) Sn y , wherein 0<y≤0.80 or
c) Si (1-m-n) Ge m Sn n , wherein 0<m<1.00, 0<n<1.00 and with the proviso that m+n<1.00.
2. An effect pigment according to claim 1 , wherein the highly reflective metallic flake is coated on both major interfaces with the semiconductor material and wherein additionally the semiconductor layers are coated with further dielectric, reflective or absorbing materials.
3. An effect pigment according to claim 1 , wherein the layer stack consists of the highly reflective metallic flake having a first major interface and opposed to this first interface a second major interface, and at least one side surface and directly adjacent on both of these major interfaces a layer of a semiconducting material having an average atomic composition of:
a) Si (1-x) Sn x , wherein 0<x<0.90 or
b) Ge (1-y) Sn y , wherein 0<y≤0.80 or
c) Si (1-m-n) Ge m Sn n , wherein 0<m<1.00, 0<n<1.00 and with the proviso that m+n<1.00.
4. The effect pigment of claim 1 , wherein the semiconducting layer or layers have a bandgap in a range of 0.1 to 2.5 eV.
5. The effect pigment of claim 1 , wherein the highly reflective metal flake is selected from the group consisting of aluminum, copper, chromium, titanium, zinc, silver, gold or alloys thereof.
6. The effect pigment according to claim 1 , wherein the average atomic composition of the semiconducting material is:
a) Si (1-x) Sn x , wherein 0.02≤x≤0.75 or
b) Ge (1-y) Sn y , wherein 0.02≤y≤0.60 or
c) Si (1-m-n) Ge m Sn n , wherein 0.02≤m≤0.8 and 0.02≤n≤0.75.
7. A flaky effect pigment according to claim 1 , wherein the average atomic composition of the semiconducting material is:
a) Si (1-x) Sn x , wherein 0.05≤x≤0.55 or
b) Ge (1-y) Sn y , wherein 0.05≤y≤0.50 or
c) Si (1-m-n) Ge m Sn n , wherein 0.05≤m≤0.65 and 0.05≤n≤0.55.
8. The effect pigment according to claim 1 , wherein the highly reflective metallic flake has an average thickness in the range from 5 to 500 nm.
9. The effect pigment according to claim 1 , wherein the layer of the semiconductor material has a mean thickness in the range from 5 to 200 nm.
10. The effect pigment according to claim 1 , wherein the effect pigment is further encapsulated with an outer layer.
11. The effect pigment according to claim 10 , wherein the further encapsulating layer consists of a layer of Mo-oxide, SiO 2 , AI 2 O 3 or a surface modifier.
12. The effect pigment according to claim 11 , wherein the further encapsulating layer consists of a surface modifier, the surface modifier comprising one or more of an organofunctional silane, a phosphate ester, a phosphonate esters, and a phosphite esters.
13. An ink composition comprising the effect pigment of claim 1 and a binder.
14. A product comprising the effect pigment of claim 1 in the form of a cosmetic composition.
15. A composition comprising a plastic and the effect pigment of claim 1 .
16. A method of manufacturing an effect pigment using a PVD process comprising:
a) coating a thin, flexible substrate with a release coat agent,
b) depositing a first semiconductor layer onto the flexible substrate using a roll-to-roll process,
c) depositing a layer of a highly reflective metal onto the first semiconductor layer,
d) depositing a second semiconductor layer onto the highly reflective metal layer, and
e) stripping the material stack from the flexible substrate in a solvent;
the resulting effect pigment having a layer stack which comprises a highly reflective metallic flake having a first major interface and opposed to this first interface a second major interface, and at least one side surface and directly adjacent on one or of both of these major interfaces a layer of a semiconducting material having an average atomic composition of:
a) Si (1-x) Sn x , wherein 0<x<0.90 or
b) Ge (1-y) Sn y , wherein 0<y≤0.80 or
c) Si (1-m-n) Ge m Sn n , wherein 0<m<1.00, 0<n<1.00 and with the proviso that m+n<1.00.
17. The method of manufacturing according to claim 16 , wherein the highly reflective metal has a thickness in a range of 5 to 500 nm.
18. The method of manufacturing according to claim 16 , wherein the first semiconductor layer and the second semiconductor layer are composed of the same material.
19. The method of claim 16 , further comprising one or more steps of particle sizing, particle classification and solvent dispersion.