IP Library › Granted Patent US 12,292,238
Granted Patent B2
US 12,292,238 · App. 17/802,127 · Granted May 6, 2025

Heat dissipation member

Inventor: Yuichi Abe (Satsumasendai, JP)
Assignee: KYOCERA Corporation
F28D15/0233F28D15/04H01L23/427H05K7/20
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Quick Facts
Patent No.
US 12,292,238
App. No.
17/802,127
Granted
May 6, 2025
Kind
B2
Abstract

A heat dissipation member includes an intermediate member, a first member and a second member, each with a plate shape and made of a ceramic. The intermediate member includes a plurality of through holes each penetrating through a first surface and a second surface, of the intermediate member, located opposite to each other. The first member includes a first groove portion on a third surface of the first member, facing the first surface of the intermediate member. The second member includes a plurality of second grooves on a fourth surface facing the second surface of the intermediate member, and a heat source is arranged on a fifth surface located opposite to the fourth surface.

Claims (31)

1. A heat dissipation member comprising:

an intermediate member with a plate shape made of a ceramic and comprising a plurality of through holes, each of the plurality of through holes penetrating through a first surface and a second surface of the intermediate member, located opposite to each other;

a first member with a plate shape made of a ceramic and comprising a first groove portion on a third surface facing the first surface of the intermediate member; and

a second member with a plate shape made of a ceramic and comprising a plurality of second groove portions on a fourth surface facing the second surface of the intermediate member, wherein

a surface roughness of an inner surface of each of the plurality of second groove portions is larger than a surface roughness of an inner surface of each of the plurality of through holes in the intermediate member.

2. The heat dissipation member according to claim 1 , wherein

the intermediate member has a surface roughness of an inner surface of each of the plurality of through holes larger than a surface roughness of the first surface.

3. The heat dissipation member according to claim 1 , wherein

each of the plurality of through holes decreases in diameter from the first surface side toward the second surface side.

4. The heat dissipation member according to claim 1 , wherein

a surface roughness of the inner surface of each of the plurality of second groove portions is larger than a surface roughness of the second surface of the intermediate member.

5. The heat dissipation member according to claim 1 , wherein

the first groove portion and the plurality of second groove portions are respectively lattice-shaped.

6. The heat dissipation member according to claim 1 , wherein

the intermediate member comprises at least one chamfered portion between the first surface and the plurality of through holes.

7. The heat dissipation member according to claim 1 , wherein

the first groove portion comprises a first recessed portion recessed with respect to the third surface and a plurality of first protruding portions located within the first recessed portion, and

a gap is provided between at least one of the plurality of first protruding portions and the first surface.

8. The heat dissipation member according to claim 1 , wherein

at least one of the second groove portions comprises a second recessed portion recessed with respect to the fourth surface and a plurality of second protruding portions located within the second recessed portion, and

a gap is provided between at least one of the plurality of second protruding portions and the second surface.

9. The heat dissipation member according to claim 1 , wherein

the intermediate member comprises an edge portion, a center portion, and a plurality of connecting portions located between the center portion and the edge portion and connecting the center portion and the edge portion, and

the plurality of through holes comprises:

a plurality of first through holes located at the plurality of connecting portions; and

at least one second through hole located at the center portion, each of the at least one second through hole having an opening area larger than each of the plurality of first through holes.

10. The heat dissipation member according to claim 9 , wherein

the density of the at least one second through hole at the center portion is smaller than the density of the plurality of first through holes at the plurality of connecting portions.

11. The heat dissipation member according to claim 1 , wherein

the intermediate member comprises an edge portion, a center portion, and a plurality of connecting portions located between the center portion and the edge portion and connecting the center portion and the edge portion, and

the first groove portion and the plurality of second groove portions each overlap the edge portion in plan view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2022
From: ABE, YUICHI
To: KYOCERA CORPORATION
Reel/Frame 060897/0916 →
Priority Claims (3)
JP 2020-031035 · Feb 26, 2020 · national
JP 2020-031049 · Feb 26, 2020 · national
JP 2020-031059 · Feb 26, 2020 · national
Continuity (1)
Related Publication 20230080077A1 · Mar 16, 2023
References Cited (35)
US 7775261B2 · Valenzuela · 2010 [cited by examiner]
US 8534348B2 · Ohsawa · 2013 [cited by examiner]
US 9835383B1 · Roper · 2017 [cited by examiner]
US 11013145B1 · Naito · 2021 [cited by examiner]
US 20070056711A1 · Ohsawa · 2007 [cited by applicant]
US 20070227704A1 · Nagai et al. · 2007 [cited by applicant]
US 20090020274A1 · Kawabata · 2009 [cited by examiner]
US 20090056917A1 · Majumdar · 2009 [cited by examiner]
US 20110308772A1 · Tsuruta et al. · 2011 [cited by applicant]
US 20120211207A1 · Ohsawa et al. · 2012 [cited by applicant]
US 20130133864A1 · Yang · 2013 [cited by examiner]
US 20130269913A1 · Ueda · 2013 [cited by examiner]
US 20160091258A1 · Ahamed · 2016 [cited by examiner]
US 20190186840A1 · Chiang · 2019 [cited by applicant]
US 20190242654A1 · Machida · 2019 [cited by examiner]
US 20190277574A1 · Kurashima · 2019 [cited by examiner]
US 20190285357A1 · Sheng · 2019 [cited by examiner]
US 20200103175A1 · Ben-Menahem · 2020 [cited by examiner]
US 20200103176A1 · Ben-Menahem · 2020 [cited by examiner]
CN 108882644A · 2018 [cited by applicant]
DE 10253457B3 · 2004 [cited by examiner]
JP 53043464U · 1978 [cited by applicant]
JP 5360755A · 1978 [cited by applicant]
JP 53095146U · 1978 [cited by applicant]
JP 53145471U · 1978 [cited by applicant]
JP 59173690A · 1984 [cited by applicant]
JP 2007212028A · 2007 [cited by applicant]
JP 2007266153A · 2007 [cited by applicant]
JP 4112602B1 · 2008 [cited by applicant]
JP 2010060243A · 2010 [cited by applicant]
JP 2011038700A · 2011 [cited by applicant]
JP 2011096994A · 2011 [cited by applicant]
JP 2015094491A · 2015 [cited by applicant]
JP 2019113232A · 2019 [cited by applicant]
WO 2007113942A1 · 2007 [cited by applicant]
Cited By (1)
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