Electronic component, manufacturing method thereof, and electronic apparatus
A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.
1. A manufacturing method of an electronic component, the method comprising:
preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate;
preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate; and
curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member,
wherein at least one of the first electrode and the second electrode includes a window portion, and in the curing, the bonding member is cured by irradiating the bonding member with light through the window portion,
wherein the bonding member includes:
a first portion arranged in a first region not sandwiched between the first electrode and the second electrode; and
a second portion arranged in a second region sandwiched between the first electrode and the second electrode, and
wherein the curing includes:
curing the first portion after a fluidity of the first portion is increased by selectively irradiating the first portion with the light; and
curing the second portion after a fluidity of the second portion is increased by selectively irradiating, with the light through the window portion, a portion of the second portion where the window portion exists, after the curing of the first portion.
2. The method according to claim 1 , wherein the window portion is an opening portion.
3. The method according to claim 1 , wherein an absorption rate of the light by the bonding member is higher than an absorption rate of the light by one of the first electrode and the second electrode which includes the window portion.
4. The method according to claim 1 , wherein the first structure includes a plurality of the first electrodes, and the plurality of the first electrodes are arranged along a predetermined direction,
wherein the second structure includes a plurality of the second electrodes, and the plurality of the second electrodes are arranged along the predetermined direction, and
wherein the curing of the bonding member includes:
irradiating, with the light, a central portion of the bonding member in the predetermined direction; and
irradiating, with the light, a peripheral portion of the bonding member in the predetermined direction after the irradiating of the central portion.