Carbon-nanotubes copper composite conductors
Provided herein are composite conductors, characterized by having copper deposits inside the bulk rather than on the outer surface of a non-metallic conductive porous matrix, such as CNT fabric, as well as a process for obtaining the same. The composite conductors provided herein are also characterized by a low specific weight and a high ampacity compared to metal conductors of similar size and shape.
1. A composite conductor element, comprising a non-metallic conductive porous matrix and a plurality of metallic copper particles incorporated therein, wherein:
said non-metallic conductive porous matrix is a randomly oriented matrix;
said copper particles are incorporated within a bulk of said non-metallic conductive porous matrix, and
said copper particles are arranged in clusters of metallic copper crystals having a size that ranges from 1 nm to 150 μm, and being connected to each other by metallic copper threads forming a metallic copper network on and within said bulk of said non-metallic conductive porous matrix;
the composite conductor element is characterized by an ampacity of at least 100 A/cm 2 over at least 100 μm of the element, and is scalable and capable of forming macroscopic conductive elements.
2. The composite element of claim 1 , characterized by a specific gravity that ranges from 1.5 g/cm 3 to 8.5 g/cm 3 .
3. The element of claim 1 , wherein said non-metallic conductive porous matrix is formable, ductile and scalable.
4. The element of claim 1 , wherein said non-metallic conductive porous matrix is a non-oriented matrix.
5. The element of claim 1 , wherein said non-metallic conductive porous matrix is selected form the group consisting of a carbon nanotube fabric, a carbon microfiber matrix, a graphene fiber fabric, a Buckminsterfullerene matrix, a carbon nanofoam matrix, and carbon nanobuds matrix.
6. A process of manufacturing the element of claim 1 , comprising submerging a non-metallic conductive porous matrix in an aqueous electrolyte that comprises copper ions, and applying a current/potential to effect copper deposition, wherein said electrolyte characterized by a throwing power of at least 15%, and/or comprises an organic additive.
7. The process of claim 6 , wherein said organic additive is a suppressing agent and/or a leveling agent.
8. The process of claim 6 , wherein said organic additive is selected from the group consisting of polyethylene glycol, benzotriazole, thiourea, acetonitrile, a polyether, a polyoxyether, a thiol, an azole, an imidazole, and any combination thereof.
9. The process of claim 6 , wherein said aqueous electrolyte comprises copper cyanide, copper pyrophosphate and copper fluoborate.
10. The process of claim 9 , wherein said aqueous electrolyte is essentially devoid of said organic additive.
11. The process of claim 6 , wherein said copper deposition comprises:
when using said acidic aqueous electrolyte, applying about −0.2 VSEC to −0.35 VSEC for a time period of 1 minute to 1 hour;
when using said basic aqueous electrolyte, applying about −0.5 VSEC to −1.3 VSEC for a time period of 1 minute to 1 hour; or
when using said acidic or basic aqueous electrolyte, applying a constant current of about −5 to −15 mA/cm 2 for a time period of 1 minute to 1 hour.
12. The process of claim 11 , wherein when using said acidic aqueous electrolyte, applying a constant potential at a level that causes hydrolysis and hydrogen evolution.
13. The process of claim 11 , wherein when using said basic aqueous electrolyte, applying a pulse potential.
14. An electric device, comprising the composite conductor element of claim 1 .
15. The device of claim 14 , selected from the group consisting of a micro-electronic circuit board, and an ultra-fast charging cable.
16. The element of claim 1 , wherein said macroscopic conductive elements are selected from the group consisting of sheets, cables, yarns, fibers, and strips.