Manufacturing method of wireless charging module
The present disclosure disclosed a wireless charging module manufacturing method. The method includes the following steps: forming a first heat dissipating layer on a surface of a coil; and securing a magnetic shield part to the surface of the coil away from the first heat dissipating layer. A wireless charging module is manufactured by the method. By completely cover the coil with the first heat dissipating layer in the present disclosure, the first heat dissipating layer possesses excellent heat radiation, effectively improving the heat dissipation of the coil. The thickness of the first heat dissipating layer is controllable. Therefore, an effective and highly stable heat dissipating performance can be provided without increasing the thickness and cost of the wireless charging module.
1. A manufacturing method for a wireless charging module, comprising:
forming a first heat dissipating layer directly on a second surface of a coil by physical vapor deposition; and
securing a magnetic shield part to a first surface of the coil away from the first heat dissipating layer;
wherein the step of securing the magnetic shield part to the first surface of the coil away from the first heat dissipating layer comprises:
forming a first adhesive member on the first surface of the coil away from the first heat dissipating layer, wherein the first adhesive member is a non-solid material and is a thermal conductive film; and
attaching the magnetic shield part to the first adhesive member;
wherein the first adhesive member is filled to gaps between the coil, the first adhesive member and the magnetic shield part;
wherein heat is dissipated from the second surface of the coil by the first heat dissipating layer and from the first surface of the coil by the first adhesive member and the magnetic shield part.
2. The manufacturing method according to claim 1 , wherein the step of forming the first heat dissipating layer on the second surface of the coil comprises forming the first heat dissipating layer on the second surface of the coil by evaporation or sputtering.
3. The manufacturing method according to claim 2 , wherein the step of forming the first heat dissipating layer on the second surface of the coil by evaporation or sputtering comprises forming the first heat dissipating layer directly on the second surface of the coil by evaporation or sputtering.
4. The manufacturing method according to claim 1 , wherein after the step of securing the magnetic shield part to the first surface of the coil away from the first heat dissipating layer, further comprising:
forming a second heat dissipating layer on other surface of the magnetic shield part away from the coil.
5. The manufacturing method according to claim 4 , wherein the step of forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil comprises disposing the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by a second adhesive member.
6. The manufacturing method according to claim 4 , wherein the step of forming the second heat dissipating layer on the other surface of magnetic shield part away from the coil comprises forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by spraying, coating, or physical vapor deposition.
7. The manufacturing method according to claim 6 , wherein the step of forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by spraying, coating, or physical vapor deposition comprises forming the second heat dissipating layer directly on the other surface of the magnetic shield part away from the coil by spraying, coating, or physical vapor deposition.
8. The manufacturing method according to claim 4 , wherein the step of forming the second heat dissipating layer on the other surface of magnetic shield part away from the coil comprises forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by evaporation or sputtering.
9. The manufacturing method according to claim 8 , wherein the step of forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by evaporation or sputtering comprises forming the second heat dissipating layer directly on the other surface of the magnetic shield part away from the coil by evaporation or sputtering.
10. The manufacturing method according to claim 1 , wherein after the step of securing the magnetic shield part to the first surface of the coil away from the first heat dissipating layer, further comprising:
forming a second heat dissipating layer on other surface of the magnetic shield part away from the coil.
11. The manufacturing method according to claim 10 , wherein the step of forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil comprises forming the second heat dissipating layer directly on the other surface of the magnetic shield part away from the coil.
12. The manufacturing method according to claim 10 , wherein the step of forming the second heat dissipating layer on the other surface of magnetic shield part away from the coil comprises forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by spraying, coating, or physical vapor deposition.
13. The manufacturing method according to claim 12 , wherein the step of forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by spraying, coating, or physical vapor deposition comprises forming the second heat dissipating layer directly on the other surface of the magnetic shield part away from the coil by spraying, coating, or physical vapor deposition.
14. The manufacturing method according to claim 10 , wherein the step of forming the second heat dissipating layer on the other surface of magnetic shield part away from the coil comprises forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by evaporation or sputtering.
15. The manufacturing method according to claim 14 , wherein the step of forming the second heat dissipating layer on the other surface of the magnetic shield part away from the coil by evaporation or sputtering comprises forming the second heat dissipating layer directly on the other surface of the magnetic shield part away from the coil by evaporation or sputtering.