Electronic device
An electronic device includes: a body, including opposite outer and inner surfaces, and a through opening passing through the outer and inner surfaces; a fan, disposed on the outer surface and having an air outlet; a heat sink assembly, disposed at the air outlet and corresponding to the through opening; a first thermal tube, having one end assembled on the heat sink assembly and located on the side of the outer surface; a first heat source, disposed corresponding to the other end of the first thermal tube; a thermal plate, disposed in the body and corresponding to the through opening, having one side abutting against the heat sink assembly and the inner surface; a second thermal tube, having one end connected to the other side of the thermal plate; and a second heat source, disposed corresponding to the other end of the second thermal tube.
1. An electronic device, comprising:
a body, comprising a through opening, and an outer surface and an inner surface opposite to each other, wherein the through opening passes through the outer surface and the inner surface;
a fan, disposed on the outer surface of the body, the fan having an air outlet;
a heat sink assembly, disposed at the air outlet and corresponding to the through opening, wherein:
the heat sink assembly comprises a plurality of cooling fins, an upper plate, and a lower plate,
each of the plurality of cooling fins has a first side, a second side, a third side, and a fourth side,
the first side and the second side are parallel and opposite to each other,
the third side and the fourth side are parallel and opposite to each other,
the third side and the fourth side are respectively connected between the first side and the second side,
the first side is adjacent to the fan,
the upper plate is perpendicular to the plurality of cooling fins and is disposed on the third side,
the lower plate is perpendicular to the plurality of cooling fins and is disposed on the fourth side,
the fourth side comprises a first section, a second section, and a third section,
the first section is perpendicularly connected to the first side,
the third section is perpendicularly connected to the second side,
the second section is perpendicularly connected to the first section and the third section, and
a position of the first section corresponds to a position of the through opening;
a first thermal tube, having one end thereof assembled on the heat sink assembly, and located on a side of the outer surface;
a first heat source, disposed at a position corresponding to a second end of the first thermal tube;
a thermal plate, disposed in the body and corresponding to the through opening, one side of the thermal plate abutting against the heat sink assembly and the inner surface;
a second thermal tube, having one end thereof connected to a second side of the thermal plate such that the first thermal tube is separated from the second thermal tube by the heat sink assembly and the thermal plate that are disposed between the first thermal tube and the second thermal tube; and
a second heat source, disposed at a position corresponding to a second end of the second thermal tube.
2. The electronic device according to claim 1 , wherein the first heat source and the second heat source are disposed in the body and are not coplanar.
3. The electronic device according to claim 1 , wherein:
the body further comprises a sidewall,
the outer surface of the body comprises a first portion, a second portion, and a third portion,
the second portion is connected at an angle to the first portion and the third portion,
the first portion and the third portion are not coplanar,
the sidewall is connected to the first portion, the second portion, and the third portion,
the second portion, the third portion, and the sidewall define a recess therebetween, and
the fan is disposed in the recess.
4. The electronic device according to claim 3 , wherein the first heat source, the second heat source, and the second thermal tube are located between the sidewall and the inner surface.
5. The electronic device according to claim 3 , wherein the sidewall comprises a plurality of through holes which are in communication with the recess.
6. The electronic device according to claim 1 , wherein:
the thermal plate comprises a contacting portion and an abutting portion connected to each other,
the contacting portion passes through the through opening and abuts against the heat sink assembly, and
the abutting portion abuts against the inner surface.
7. The electronic device according to claim 6 , further comprising:
a waterproof ring, disposed on the inner surface and encircling the through opening, wherein,
the contacting portion passes through the waterproof ring to abut against the heat sink assembly, and
one side of the abutting portion abuts against the waterproof ring.
8. The electronic device according to claim 7 , wherein the waterproof ring protrudes from the inner surface.
9. The electronic device according to claim 1 , wherein:
the first thermal tube is assembled on the third side of each of the plurality of cooling fins, and
the thermal plate is assembled on the fourth side of each of the plurality of cooling fins.
10. The electronic device according to claim 9 , wherein;
the first thermal tube is connected to the upper plate, and
the thermal plate is connected to the lower plate.
11. The electronic device according to claim 1 , wherein:
the lower plate comprises a first lower plate and a second lower plate,
the first lower plate is disposed on the first section,
the second lower plate is disposed on the third section, and
the thermal plate abuts against the first lower plate.
12. The electronic device according to claim 1 , wherein the body further comprises:
an expansion port, disposed on the outer surface and used to expansion connect to another body.
13. An electronic device, comprising:
a body, comprising a through opening;
a fan, disposed in the body, the fan having an air outlet;
a heat sink assembly, disposed at the air outlet, wherein:
the heat sink assembly comprises a plurality of cooling fins, an upper plate, and a lower plate,
each of the plurality of cooling fins has a first side, a second side, a third side, and a fourth side,
the first side and the second side are parallel and opposite to each other,
the third side and the fourth side are parallel and opposite to each other,
the third side and the fourth side are respectively connected between the first side and the second side,
the first side is adjacent to the fan,
the upper plate is perpendicular to the plurality of cooling fins and is disposed on the third side,
the lower plate is perpendicular to the plurality of cooling fins and is disposed on the fourth side,
the fourth side comprises a first section, a second section, and a third section,
the first section is perpendicularly connected to the first side,
the third section is perpendicularly connected to the second side,
the second section is perpendicularly connected to the first section and the third section, and
a position of the first section corresponds to a position of the through opening;
a first thermal tube, having one end thereof assembled on one side of the heat sink assembly;
a first heat source, disposed in the body at a position corresponding to a second end of the first thermal tube;
a thermal plate, wherein one side of the thermal plate abuts against the heat sink assembly;
a second thermal tube, having one end thereof connected to a second side of the heat sink assembly, wherein the first thermal tube and the second thermal tube are disposed on opposite sides of the thermal plate such that the first thermal tube is separated from the second thermal tube by the heat sink assembly and the thermal plate that are disposed between the first thermal tube and the second thermal tube; and
a second heat source, disposed in the body at a position corresponding to a second end of the second thermal tube, wherein the second heat source and the first heat source are not coplanar.
14. The electronic device according to claim 13 , wherein the body has a recess in which the fan and the heat sink assembly are disposed.
15. The electronic device according to claim 14 , wherein the through opening passes through the recess and corresponds to the heat sink assembly.
16. The electronic device according to claim 15 , wherein the first thermal tube is located on an outer surface of the body, and the second thermal tube is located on an inner surface of the body.
17. The electronic device according to claim 16 , further comprising:
a waterproof ring, encircling the through opening and sandwiched between the inner surface of the body and the second thermal tube.
18. The electronic device according to claim 17 , wherein a portion of the heat sink assembly passes through the waterproof ring and abuts against the second thermal tube.
19. The electronic device according to claim 14 , wherein the body further comprises a plurality of through holes which are in communication with the recess.
20. The electronic device according to claim 13 , wherein:
the first thermal tube is assembled on the third side of each of the plurality of cooling fins,
the thermal plate is assembled on the fourth side of each of the plurality of cooling fins,
the first thermal tube is connected to the upper plate, and
the thermal plate is connected to the lower plate.