Pre-package for a smartcard, a smartcard and a method of forming the same
When forming smartcards or pre-forms thereof additional functionality may be implemented by, for instance, incorporating components, such as a display device, and the like, by preparing pre-packages separately from the rest of the pre-forms and subsequently inserting the pre-packages into the pre-forms, thereby achieving superior process robustness and production yield.
1. A pre-package for a smartcard, comprising
a flexible printed circuit board including at least one non-planar circuit portion; and
a stack of material layers that accommodates said flexible printed circuit board to provide a top surface and a bottom surface of said stack of material layers that are planar.
2. The pre-package of claim 1 , wherein pre-package has pre-determined lateral dimensions that are defined by said top surface and bottom surface.
3. The pre-package of claim 1 , wherein said pre-package has a height dimension orthogonal to said lateral dimensions, and wherein said height dimension is less than 0.8 mm.
4. The pre-package of claim 1 , wherein at least a material forming portions of at least one of said top surface and said bottom surface is a material as used for smartcards.
5. The pre-package of claim 4 , wherein said material forming portions of at least one of said top surface and said bottom surface comprises at least one of PVC, polycarbonate, PET-G, ABS and PET.
6. The pre-package of claim 1 , wherein said flexible printed circuit board comprises at least one of a display, a keyboard, a sensor, a battery, an optical component and an electronic component.
7. The pre-package of claim 1 , wherein said stack of layers comprises a frame layer that surrounds at least a portion of said at least one non-planar circuit portion.
8. The pre-package of claim 7 , wherein at least one of said top layer and said bottom layer includes a window portion that is aligned to at least a portion of an opening of said frame layer.
9. The pre-package of claim 1 , wherein said stack of material layers includes a top layer forming at least a portion of said planar top surface and a bottom layer forming at least a portion of said planar bottom surface.
10. The pre-package of claim 1 , further comprising a frame sidewall structure that laterally encloses a central portion of said stack of material layers and that is laterally aligned to said top surface and said bottom surface to define said pre-determined lateral dimension throughout a height direction of said pre-package.
11. A precursor sheet material for forming smartcards, comprising
an array of pre-packages of claim 1 ; and
a substrate material mechanically interconnecting said pre-packages of said array.
12. The precursor sheet material of claim 11 , wherein said precursor sheet material is provided in the form of a roll.
13. A smartcard, comprising
a stack of card layers; and
a pre-package of claim 1 that is embedded in said stack of card layers.
14. The smartcard of claim 13 , wherein said stack of card layers includes a printed portion formed of a first material and wherein a portion of said pre-package positioned adjacent to said printed portion is formed of a second material that has substantially same thermal characteristics as said first material.
15. The smartcard of claim 14 , wherein said first and second materials are substantially identical in their basic chemical composition.
16. The smartcard of claim 13 , wherein said pre-package has a window and said smartcard includes a card window that is at least partially aligned with said window.
17. The smartcard of claim 16 , wherein said card window is configured to enable at least one of a mechanical interaction, optical interaction, visibility and electromagnetic interaction with said window of the pre-package.
18. A method of forming pre-packages for smartcards, the method comprising
providing an array of flexible printed circuit boards mechanically interconnected by a carrier material, each of said flexible printed circuit boards including at least one non-planar circuit portion;
attaching said array of flexible printed circuit boards to a first layer of a smartcard compatible material;
laterally enclosing at least said non-planar circuit portion of each of said flexible printed circuit boards in said array by attaching, for each of said non-planar circuit portions, a respective frame layer to said first layer, each of said frame layers having an opening so as to accommodate at least said respective non-planar circuit portion and level, at least partially, a non-planarity of said respective non-planar circuit portion;
attaching a second layer formed of said smartcard compatible material to said first layer so as to form a planar bottom surface; and
attaching a third layer formed of said smartcard compatible material to said frame layers so as to form a planar top surface.
19. The method of claim 18 , further comprising preparing in advance said frame layers in accordance with lateral and height dimensions of said flexible printed circuit boards.
20. The method of claim 18 , wherein said array of said flexible printed circuit boards is provided in the form of a roll material and wherein said first, second and third layers formed of said smartcard compatible material are provided in the form of a roll material.