IP Library › Granted Patent US 12,298,814
Granted Patent B2
US 12,298,814 · App. 17/957,896 · Granted May 13, 2025

Bracket, bracket manufacturing method and electronic device, including the same

Inventors: Heesung Lee (Suwon-si, KR); Goeun Kim (Suwon-si, KR); Inkyu Kim (Suwon-si, KR); Hyunsoo Kim (Suwon-si, KR); Hyesun Park (Suwon-si, KR); Youngjun Heo (Suwon-si, KR); Youngsoo Jung (Suwon-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
G06F1/1656H05K5/0243H05K5/04Y10T29/49888Y10T29/49986Y10T29/49995
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Quick Facts
Patent No.
US 12,298,814
App. No.
17/957,896
Granted
May 13, 2025
Kind
B2
Abstract

An electronic device according to various embodiments of the disclosure may include: a cover glass configured to protect a display; and a bracket, wherein the bracket includes: a first area in contact with the cover glass; and a second area extending from the first area, the first area includes a first surface layer to which a first texture and a first color are applied, the second area includes a second surface layer to which a second texture different from the first texture is applied, the first color is substantially the same color as the cover glass, and the first texture is substantially the same texture as the cover glass.

Claims (16)

1. A method for manufacturing a bracket of an electronic device, the method comprising:

polishing a surface of a metal member that forms at least a portion of the bracket, wherein the surface comprise a first area and a second area of the metal member;

disposing a masking layer on the first area of the metal member;

forming a second texture on the second area of the metal member, wherein the second texture is different from that of the first area;

removing the masking layer from the first area; and

forming an oxide film layer on the first area and the second area.

2. The method of claim 1 , wherein the metal member of the bracket comprises aluminum.

3. The method of claim 1 , wherein the method further comprises processing the metal member of the bracket through at least one of a cutting process or an injection joining process.

4. The method of claim 1 , wherein the masking layer comprises a resin having viscosity.

5. The method of claim 4 , wherein the resin of the masking layer has a viscosity of 15000 cP or more and 100000 cP or less.

6. The method of claim 1 , wherein the polishing comprises removing a grain of the material of the metal member.

7. The method of claim 1 , wherein the second texture is matte or semi-glossy and different from a cover glass of the electronic device.

8. The method of claim 1 , wherein the formation of the second texture comprises at least one of sand blasting, hairline, or barrel processes.

9. The method of claim 1 , further comprising gloss-etching of the second area to adjust a glossiness thereof after the formation of the second texture.

10. The method of claim 1 , wherein the formation of oxide film layer is performed only once.

11. The method of claim 1 , wherein the formation of the oxide film layer is performed at a temperature of 5° C. or higher and 30° C. or lower.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2022
From: LEE, HEESUNG; KIM, GOEUN; KIM, INKYU; KIM, HYUNSOO; PARK, HYESUN; HEO, YOUNGJUN; JUNG, YOUNGSOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 061291/0580 →
Priority Claims (1)
KR 10-2021-0130066 · Sep 30, 2021 · national
Continuity (2)
Continuation PCTKR2022014637 · Sep 29, 2022
Related Publication 20230102327A1 · Mar 30, 2023
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