Granted Patent B2

US 12,300,521 · App. 17/774,467 · Granted May 13, 2025

Inventors: Frédéric Mayer (Voiron, FR); Frédéric Mercier (Saint Nicolas de Macherin, FR); Ivan-Christophe Robin (Grenoble, FR); Xavier Hugon (Teche, FR)

Assignee: Aledia

H01L21/67144H01L21/6835H01L25/18H01L27/14634H01L27/1469H01L24/05H01L24/06H01L24/08H01L2221/68327H01L2224/0557H01L2224/06181H01L2224/08145

Abstract

Claims (12)

1. A method of protecting optoelectronic devices against electrostatic discharges, each optoelectronic device comprising an optoelectronic circuit comprising at least one optoelectronic component from among a light-emitting diode or a photodiode, the method comprising forming a first wafer, comprising a plurality of copies of the optoelectronic circuit, bonding the first wafer to a support, separating the optoelectronic devices from one another, and removing from the support a plurality of optoelectronic devices among said optoelectronic devices by means of a gripping system, wherein the gripping system comprises at least one protection system for protecting optoelectronic devices against electrostatic discharges, wherein before the step of removal of said plurality of optoelectronic devices from the support by the gripping system, one of the optoelectronic devices other than said plurality of optoelectronic devices, called sacrificial device, is placed into contact with the gripping system before said plurality of optoelectronic devices comes into contact with the gripping system.

2. A method according to claim 1 , wherein the gripping system comprises a gripper comprising housings adapted to receiving the optoelectronic devices.

3. A method according to claim 2 , wherein the gripping system comprises an element protruding from to the gripper coming into contact with the sacrificial device while the gripper and the support are relatively brought towards each other before said plurality of optoelectronic devices comes into contact with the gripper.

4. A method according to claim 3 , wherein the protection system comprises a plate coupled to the gripper by an elastic link.

5. A method according to claim 4 , wherein the elastic link is electrically conductive.

6. A method according to claim 2 , comprising the local deformation of the support to bring said sacrificial device towards the gripper with respect to said plurality of optoelectronic devices.

7. A method according to claim 6 , wherein the protection system comprises an actuator adapted to locally deforming the support.

8. A method according to claim 1 , wherein the first wafer is bonded to the support via conductive glue.

9. A method according to claim 1 , wherein each optoelectronic device comprises an electronic circuit comprising at least one electronic component, the optoelectronic circuit being bonded to the electronic circuit.

10. A gripping system for the implementation of the method according to claim 1 , comprising the system for protecting optoelectronic devices against electrostatic discharges.

11. A gripping system according to claim 10 , wherein the protection system comprises a plate coupled to the gripper by an elastic link.

12. A gripping system according to claim 10 , wherein the protection system comprises an actuator adapted to locally deforming the support.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (15)