Camera module and optical device
The present embodiment relates to a camera module comprising: a first substrate; a second substrate spaced from the first substrate in the optical axis direction on the first substrate; an image sensor electrically connected to the second substrate; a housing arranged on the second substrate; and a passive element arranged between the first substrate and the second substrate, wherein the passive element is arranged at a position lower than that of the lower end of the housing.
1. A camera module comprising:
a first substrate;
a second substrate disposed on the first substrate and spaced from the first substrate in an optical axis direction;
an image sensor electrically connected with the second substrate;
a housing disposed on the second substrate;
a passive element disposed between the first substrate and the second substrate; and
a plurality of first conductive members disposed between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate,
wherein the passive element is disposed lower than a lower end of the housing,
wherein the first substrate comprises a first side and a second side disposed to be opposite to each other, and a third side and a fourth side connecting the first side and the second side and disposed to be opposite to each other,
wherein the plurality of first conductive members comprises first to third unit conductive members disposed between the first side of the first substrate and the image sensor, and
wherein the passive element comprises a first passive element disposed between the first and second unit conductive members and a second passive element disposed between the second and third unit conductive members.
2. The camera module of claim 1 , wherein the passive element is disposed between the plurality of first conductive members.
3. The camera module of claim 1 , further comprising a second conductive member electrically connecting an upper surface of the image sensor and a lower surface of the second substrate.
4. The camera module of claim 3 , wherein the passive element is overlapped with the housing in the optical axis direction.
5. The camera module of claim 1 , wherein the passive element is overlapped with the image sensor in a direction perpendicular to the optical axis direction.
6. The camera module of claim 1 , wherein the passive element is not overlapped with the housing in a direction perpendicular to the optical axis direction.
7. The camera module of claim 1 , further comprising:
a lens holder disposed in the housing;
a lens coupled to the lens holder; and
a filter disposed on the second substrate and disposed between the lens and the image sensor.
8. The camera module of claim 7 , wherein the filter is not overlapped with the passive element in the optical axis direction.
9. The camera module of claim 7 , wherein the filter is overlapped with the housing in a direction perpendicular to the optical axis direction.
10. The camera module of claim 7 , wherein the lens comprises a plurality of lenses comprising an upmost lens, and
wherein the upmost lens is disposed higher than an upper end of the housing.
11. The camera module of claim 1 , further comprising a reinforcing plate coupled to a lower surface of the first substrate.
12. The camera module of claim 1 , wherein, in the optical axis direction, a thickness of the passive element is greater than a thickness of the image sensor.
13. The camera module of claim 1 , wherein the passive element and the first conductive member are disposed along with an edge of an upper surface of the first substrate.
14. The camera module of claim 1 , wherein the first passive element and the second passive element are opposite to each other about the image sensor, and
wherein, in a direction perpendicular to the optical axis direction, the image sensor is disposed between the first passive element and the second passive element.
15. An optical device comprising the camera module of claim 1 .
16. The camera module of claim 1 , further comprising a filter disposed on the second substrate,
wherein the second substrate comprises a hole disposed between the filter and the image sensor.
17. A camera module comprising:
a first substrate;
a second substrate spaced apart from the first substrate in an optical axis direction;
an image sensor electrically connected with the second substrate;
a housing disposed on the second substrate;
a lens holder disposed in the housing;
a lens coupled to the lens holder and disposed on the image sensor;
a passive element disposed between the first substrate and the second substrate; and
a plurality of first conductive members disposed between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate,
wherein the passive element is overlapped with the housing in the optical axis direction,
wherein the first substrate comprises a first side and a second side disposed to be opposite to each other, and a third side and a fourth side connecting the first side and the second side and disposed to be opposite to each other,
wherein the plurality of first conductive members comprises first to third unit conductive members disposed between the first side of the first substrate and the image sensor, and
wherein the passive element comprises a first passive element disposed between the first and second unit conductive members and a second passive element disposed between the second and third unit conductive members.
18. The camera module of claim 17 , wherein the passive element is not overlapped with the housing in a direction perpendicular to the optical axis direction.
19. The camera module of claim 17 , wherein the image sensor is not overlapped with the housing in a direction perpendicular to the optical axis direction.
20. A camera module comprising:
a first substrate;
a second substrate disposed on the first substrate and spaced from the first substrate in an optical axis direction;
an image sensor electrically connected with the second substrate;
a lens holder disposed on the second substrate;
a passive element disposed between the first substrate and the second substrate; and
a plurality of first conductive members disposed between the first substrate and the second substrate and electrically connecting the first substrate and the second substrate,
wherein the first substrate comprises a first side and a second side disposed to be opposite to each other, and a third side and a fourth side connecting the first side and the second side and disposed to be opposite to each other,
wherein the plurality of first conductive members comprises first to third unit conductive members disposed between the first side of the first substrate and the image sensor, and
wherein the passive element comprises a first passive element disposed between the first and second unit conductive members and a second passive element disposed between the second and third unit conductive members.