Laser-cutting using selective polarization
A method of cutting a semiconductor wafer by selectively controlling and utilising the polarization of incident laser beam or beams that includes irradiating the semiconductor wafer with laser light having a first polarization state, and subsequently irradiating the semiconductor wafer with laser light having a second polarization state, the second polarization state being different from the first polarization state.
1. A method of cutting a semiconductor wafer, comprising the steps of:
a) providing a laser source for directing laser light to an irradiation region of a laser cutting apparatus,
b) supporting the semiconductor wafer within the laser cutting apparatus such that the irradiation region is coincident with a point on a cut line of the semiconductor wafer,
c) cutting the semiconductor wafer along the cut line by irradiating the irradiation region of the semiconductor wafer with laser light having a first polarization state and relatively moving the semiconductor wafer and the irradiation region in a direction parallel to the plane of the semiconductor wafer such that the irradiation region follows the cut line of the wafer, so that the semiconductor wafer is cut along the cut line to form a groove; and
annealing the cut semiconductor wafer by subsequently irradiating the irradiation region of the semiconductor wafer with laser light having a second polarization state that is different from the first polarization state and relatively moving the semiconductor wafer and the irradiation region in a direction parallel to the plane of the semiconductor wafer such that the irradiation region follows the cut line of the wafer, so that the semiconductor wafer is annealed along the cut line.
2. The method of claim 1 , wherein the first polarization state comprises one of the group consisting of: linear polarization perpendicular to the direction of relative movement, linear polarization parallel to the direction of relative movement, circular polarization, elliptical polarization and non-polarization.
3. The method of claim 1 , wherein the second polarization state comprises one of the group consisting of: linear polarization perpendicular to the direction of relative movement, linear polarization parallel to the direction of relative movement, circular polarization, elliptical polarization and non-polarization.
4. The method of claim 1 , wherein step c) is repeated at least once.
5. The method of claim 1 , wherein the laser source produces an array of laser beams, each laser beam of the array being directed to a different respective part of the irradiation region, and at least a first laser beam of the array has the first polarization state and at least one other laser beam of the array, which trails the first beam in the direction of relative movement, has the second polarization state.
6. The method of claim 1 , comprising an initial step of determining an optimum polarization state for the laser light to achieve cutting, and in step c), polarizing the laser light to the first polarization state in accordance with the determined optimum polarization state.