IP Library › Granted Patent US 12,307,062
Granted Patent B2
US 12,307,062 · App. 18/665,295 · Granted May 20, 2025

Coil shield of a capacitance module

Inventor: Paul Glad (Sandy, UT)
Assignee: Cirque Corporation
G06F3/0446G06F3/016G06F2203/04105G06F2203/04107
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Quick Facts
Patent No.
US 12,307,062
App. No.
18/665,295
Filed
May 15, 2024
Granted
May 20, 2025
Kind
B2
Art Unit
2626
USPC
345/174
Abstract

A capacitance module may include at least one touch electrode on a first surface of the capacitance module; a first portion of an inductance coil deposited on a second surface of the capacitance module; a second portion of the inductance coil deposited on a third surface of the capacitance module; a first coil shield deposited on the second surface of the capacitance module; and a second coil shield deposited on the third surface of the capacitance module; where the first portion of the inductance coil and the second portion of the inductance coil are electrically connected; where the inductance coil is positioned to interact with a magnet adjacent to the inductance coil; and where the first coil shield and the second coil shield are positioned to reduce electromagnetic interference between the inductance coil and other electronic components of the capacitance module.

Claims (43)

1. A capacitance module, comprising:

a touch electrode on a first surface of the capacitance module;

a first portion of an inductance coil deposited on a second surface of the capacitance module;

a second portion of the inductance coil deposited on a third surface of the capacitance module;

a first coil shield deposited on the second surface of the capacitance module; and

a second coil shield deposited on the third surface of the capacitance module;

wherein the first portion of the inductance coil and the second portion of the inductance coil are electrically connected;

wherein the inductance coil is positioned to interact with a magnet adjacent to the inductance coil;

wherein the first coil shield and the second coil shield are positioned to reduce electromagnetic interference between the inductance coil and other electronic components of the capacitance module.

2. The capacitance module of claim 1 , wherein the magnet is configured to provide a haptic effect on the capacitance module by moving the inductance coil with a change in a magnetic force.

3. The capacitance module of claim 1 , wherein at least one of the first coil shield and the second coil shield is arranged in a ring-like structure around the inductance coil.

4. The capacitance module of claim 3 , wherein the ring-like structure is a discontinuous ring.

5. The capacitance module of claim 1 , wherein at least one of the first coil shield and the second coil shield is deposited in at least two segments.

6. The capacitance module of claim 1 , further comprising processing resources located on the second surface of the capacitance module; wherein the first coil shield is located between the first portion of the inductance coil and the processing resources.

7. The capacitance module of claim 1 , further comprising a controller and memory;

the memory having programmed instructions that, when executed, cause the controller to detect an applied force on the capacitance module by measuring a change in a distance between the inductance coil and the magnet.

8. The capacitance module of claim 1 , further comprising a controller and memory;

the memory having programmed instructions that, when executed, cause the controller to impose a varying signal on the inductance coil that interacts with the magnet to provide a haptic effect on the capacitance module.

9. The capacitance module of claim 1 , wherein the first surface is on a first substrate;

the second surface is on a second substrate;

the third surface is also on the second substrate; and

another coil shield on a third substrate, the third substrate being located between the first surface and the second surface.

10. The capacitance module of claim 1 , wherein at least one of the first coil shield and the second coil shield is comprised of a conductive material.

11. The capacitance module of claim 1 , wherein the first coil shield and the second coil shield are aligned with each other while being on different layers of the capacitance module.

12. The capacitance module of claim 1 , wherein the first coil shield is electrically connected to the second coil shield.

13. The capacitance module of claim 1 , wherein the first coil shield and the second coil shield are positioned to focus electromagnetic energy of the inductance coil towards the magnet.

14. The capacitance module of claim 1 , further comprising:

a third portion of the inductance coil deposited on a fourth surface of the capacitance module; and

another coil shield is deposited on the fourth surface of the capacitance module;

wherein the another coil shield is positioned to reduce the electromagnetic interference between the inductance coil and the other electronic components of the capacitance module.

15. The capacitance module of claim 1 , wherein the first portion of the inductance coil and the second portion of the inductance coil are connected in series.

16. The capacitance module of claim 1 , wherein the first portion of the inductance coil and the second portion of the inductance coil are connected in parallel.

17. The capacitance module of claim 1 , wherein the inductance coil and at least one of the first coil shield and the second coil shield are located near a corner of the second surface.

18. The capacitance module of claim 1 , wherein the first coil shield is electrically connected to the second coil shield.

19. A capacitance module, comprising:

at least one touch electrode on a first surface of the capacitance module;

a first inductance coil;

a second inductance coil; and

wherein a first portion of the first inductance coil is deposited on a second surface of the capacitance module and a second portion of the first inductance coil is deposited on a third surface of the capacitance module;

wherein a first portion of the second inductance coil is deposited on the second surface of the capacitance module and a second portion of the second inductance coil is deposited on the third surface of the capacitance module;

a first coil shield is deposited on the second surface and a second coil shield is deposited on the third surface of the capacitance module, the first coil shield and the second coil shield being positioned to reduce electromagnetic interference between the first inductance coil, the second inductance coil, and other electronic components of the capacitance module;

wherein the first inductance coil is positioned to interact with a first magnet adjacent to the first inductance coil; and

wherein the second inductance coil is positioned to interact with a second magnet adjacent to the second inductance coil.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2024
From: GLAD, PAUL, MR.
To: CIRQUE CORPORATION
Reel/Frame 067511/0574 →
Continuity (2)
Continuation In Part 18203118 · May 30, 2023
Related Publication 20240402854A1 · Dec 5, 2024
References Cited (5)
US 10296091B2 · Heubel · 2019 [cited by applicant]
US 10866642B2 · Rosenberg · 2020 [cited by applicant]
US 20220011868A1 · Junus · 2022 [cited by applicant]
US 20220334645A1 · Junus · 2022 [cited by examiner]
US 20230315214A1 · Lochun · 2023 [cited by examiner]