IP Library Granted Patent US 12,308,540
Granted Patent B2
US 12,308,540 · App. 17/881,031 · Granted May 20, 2025

Wire-to-circuit board connection structure and a circuit board-attached cable

Inventor: Masanori Sagawa (Tokyo, JP)
Assignee: Proterial, Ltd.
H01R12/7005H01R12/75
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Quick Facts
Patent No.
US 12,308,540
App. No.
17/881,031
Granted
May 20, 2025
Kind
B2
Abstract

A wire-to-circuit board connection structure between wires including conductive cores, respectively covered with insulative coatings, and a circuit board to which the respective cores of the wires are connected, is provided with a guide member attached to the circuit board. The guide member includes guide holes into which the respective cores of the wires are inserted. The circuit board includes through-holes into which the respective cores of the wires passed through the guide holes are inserted. The guide holes include tapered holes configured in such a manner that each inner diameter is reduced as being closer to the circuit board. A circuit board-attached cable is composed of a cable including the wires, the circuit board, and the guide member.

Claims (19)

1. A wire-to-circuit board connection structure between wires including conductive cores, respectively covered with insulative coatings, and a circuit board to which the respective cores of the wires are connected, comprising:

a guide member attached to the circuit board, the guide member including guide holes into which the respective cores of the wires are inserted,

a sheath covering the wires collectively, wherein an end of the sheath is held by a holder together with portions of the respective wires, and the wires are led from the holder,

wherein the circuit board includes through-holes into which the respective cores of the wires passed through the guide holes are inserted,

wherein the guide holes include tapered holes configured in such a manner that each inner diameter is reduced as being closer to the circuit board, and

wherein the cores of the wires are led from the holder in a state where the cores are covered by the insulative coatings, respectively, and a window section, through which the insulative coatings can be visually observed, is provided between the holder and the guide member.

2. The wire-to-circuit board connection structure according to claim 1 , wherein a length of each of the guide holes is greater than a thickness of the circuit board.

3. The wire-to-circuit board connection structure according to claim 1 , wherein a maximum inner diameter of each of the tapered holes is larger than an outer diameter of each of the insulative coatings, and a minimum inner diameter of each of the tapered holes is smaller than an outer diameter of each of the insulative coatings and an inner diameter of each of through holes.

4. The wire-to-circuit board connection structure according to claim 1 ,

wherein the guide holes include cylindrical holes, which are located closer to the circuit board than the tapered holes, and

wherein the cylindrical holes are configured in such a manner that each inner diameter is equal to a minimum inner diameter of each of the tapered holes on a side of the circuit hoard.

5. The wire-to-circuit board connection structure according to claim 1 , wherein a gap is provided between the circuit board and an open-end surface for the guide holes in the guide member on a side of the circuit board.

6. A circuit board-attached cable, comprising:

wires including conductive cores respectively covered with insulative coatings;

a circuit board to which the respective cores of the wires are connected;

a guide member attached to the circuit board, the guide member including guide holes into which the respective cores of the wires are inserted, and

a sheath covering the wires collectively, wherein an end of the sheath is held by a holder together with portions of the respective wires, and the wires are led from the holder,

wherein the circuit board includes through-holes into which the respective cores of the wires passed through the guide holes are inserted, and

wherein the guide holes include tapered holes configured in such a manner that each inner diameter is reduced as being closer to the circuit board, and wherein the cores of the wires are led from the holder in a state where the cores are covered by the insulative coatings, respectively, and a window section, through which the insulative coatings can be visually observed, is provided between the holder and the guide member.

Assignments (2)
CHANGE OF NAME Recorded Feb 21, 2023
From: HITACHI METALS, LTD.
To: PROTERIAL, LTD.
Reel/Frame 062819/0890 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2022
From: SAGAWA, MASANORI
To: HITACHI METALS, LTD.
Reel/Frame 060722/0312 →
Priority Claims (1)
JP 2021-129784 · Aug 6, 2021 · national
Continuity (1)
Related Publication 20230040942A1 · Feb 9, 2023
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