Structure for optimal XPU socket compression
An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.
1. An assembly, comprising:
a printed circuit board (“PCB”) including an aperture therethrough;
an array of pins that extends around a perimeter of the aperture;
a processor package extending over the aperture and pressed against the array of pins by a first compressive force couple; and
a socket that includes the array of pins and a socket board from which the array of pins extends.
2. The assembly of claim 1 , wherein the socket lacks walls at its periphery.
3. The assembly of claim 1 , wherein the aperture is a PCB aperture and the socket board includes a socket aperture extending over the first aperture.
4. The assembly of claim 1 , wherein the socket board is bonded to the PCB.
5. The assembly of claim 1 , wherein the processor package includes a die, a substrate, and a high speed electrical channel extending from the die across a surface of the board.
6. The assembly of claim 1 , comprising a block bonded to the processor package and extending into the aperture.
7. The assembly of claim 6 , wherein the block is a voltage regulator.
8. The assembly of claim 7 , wherein the block is biased toward the processor package.
9. The assembly of claim 1 , wherein the processor package includes a die compressed by a second force couple that is parallel to and independent of the first force couple.
10. The assembly of claim 9 , comprising a base plate and a heat sink, wherein the second force couple is compression of the die between the base plate and the heat sink.
11. The assembly of claim 10 , wherein force from the base plate is transferred to the processor package by an object that extends into the aperture.
12. The assembly of claim 11 , comprising a bolster plate on an opposite side of the PCB from a lid, wherein the aperture is a PCB aperture, the bolster plate includes a bolster plate aperture aligned with the PCB aperture, and the lid includes a lid aperture aligned with the PCB aperture and into which the heat sink extends, and the first force couple is compression of the PCB and the processor package between the lid and the base plate.
13. An assembly, comprising:
a PCB;
an array of pins that extend from the PCB surrounding an area that is free of pins;
a lid;
a processor package clamped between the PCB and the lid, the processor package including a die, a package board, and a high speed electrical channel extending from the die and along the package board; and
a high speed electrical connector mounted to the package board at an end of the high speed electrical channel.
14. The assembly of claim 13 , comprising a heat sink extending through an aperture in the lid to contact the die and a base plate loaded against the heat sink to compress the die.
15. The assembly of claim 13 , comprising a voltage regulator connected to an underside of the processor package extending into an aperture in the PCB.
16. The assembly of claim 15 , wherein the array of pins extends around a perimeter of the aperture.
17. The assembly of claim 13 , wherein the aperture is a lid aperture, the PCB includes a PCB aperture, and load on the base plate is transferred to the processor package by an object disposed through the PCB aperture.
18. The assembly of claim 17 , comprising a bolster plate, wherein the processor package and PCB are clamped between the bolster plate and the lid.
19. The assembly of claim 18 , wherein the bolster plate includes a bolster plate aperture aligned with the PCB aperture and force from the base plate is transferred to the processor package through the bolster plate aperture and the PCB aperture.