IP Library › Granted Patent US 12,309,911
Granted Patent B2
US 12,309,911 · App. 17/861,584 · Granted May 20, 2025

Printed circuit board (PCB) cooling

Inventors: Yongduk Lee (Vernon, CT); Parag M. Kshirsagar (South Windsor, CT); Ankit Gupta (Willimantic, CT)
Assignee: Hamilton Sundstrand Corporation
H05K1/0209H05K1/144H05K2201/042H05K2201/064
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Quick Facts
Patent No.
US 12,309,911
App. No.
17/861,584
Granted
May 20, 2025
Kind
B2
Abstract

A printed circuit board (PCB) assembly includes a first PCB including at least one heat generating component. A second PCB is mounted to the first PCB. The second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. A plurality of power pillars extend from the first PCB and across the cooling path.

Claims (16)

1. A printed circuit board (PCB) assembly comprising:

a first PCB including at least one heat generating component;

a second PCB mounted to the first PCB, wherein the second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path;

a plurality of power pillars extending from the first PCB and across the cooling path; and

a third PCB, wherein the third PCB is mounted to the second PCB opposite from the first PCB, wherein the cooling path is enclosed between the first and third PCBs and a perimeter of the second PCB.

2. The assembly as recited in claim 1 , wherein the first PCB, second PCB, and third PCB are joined together with fasteners passing through aligned fastener bores of the first PCB, second PCB, and third PCB, wherein the fasteners are in fluid isolation from the cooling path.

3. The assembly as recited in claim 1 , wherein the power pillars extend through the first PCB, across the cooling path, and through the third PCB for conducting heat from the at least one heat generating component of the first PCB and from at least one heat generating component of the third PCB into the cooling path.

4. The assembly as recited in claim 3 , wherein the power pillars are electrically insulated from the at least one heat generating component of the first PCB and from the at least one heat generating component of the third PCB.

5. The assembly as recited in claim 4 , wherein the power pillars are polymer coated.

6. The assembly as recited in claim 4 , wherein the power pillars are ceramic.

7. The assembly as recited in claim 4 , further comprising a dielectric coolant in the cooling path insulating against electrical conduction between the power pillars.

8. The assembly as recited in claim 3 , wherein at least some of the power pillars are electrically conductive and form part of circuitry electrically connecting the at least one heat generating component of the first PCB to the at least one heat generating component of the third PCB.

9. The assembly as recited in claim 8 , wherein the power pillars are copper.

10. The assembly as recited in claim 8 , wherein the power pillars are aluminum.

11. The assembly as recited in claim 8 , further comprising a dielectric coolant in the cooling path.

12. The assembly as recited in claim 1 , wherein the second PCB is an assembly of a plurality of PCB elements including copper-lining elements bounding the cooling path.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2024
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 066971/0466 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 29, 2023
From: RTX CORPORATION
To: HAMILTON SUNDSTRAND CORPORATION
Reel/Frame 065698/0968 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2022
From: LEE, YONGDUK; KSHIRSAGAR, PARAG M.; GUPTA, ANKIT
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 060635/0832 →
Continuity (1)
Related Publication 20240015881A1 · Jan 11, 2024
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