Semiconductor device
A semiconductor device including a field insulating layer, which surrounds at least a part of side walls of each of first and second active patterns on a substrate, the field insulating layer including a protrusion protruding upwardly in a vertical direction between the first active pattern and second active pattern, respectively.
1. A semiconductor device comprising:
a substrate;
a first active pattern extending in a first horizontal direction on the substrate;
a second active pattern extending in the first horizontal direction on the substrate, the second active pattern being spaced apart from the first active pattern in a second horizontal direction, the second horizontal direction being different from the first horizontal direction;
a field insulating layer surrounding at least a part of side walls of each of the first and second active patterns on the substrate, the field insulating layer including a protrusion protruding upwardly in a vertical direction between the first active pattern and second active pattern;
a first source/drain region on the first active pattern;
a second source/drain region on the second active pattern; and
a source/drain contact electrically connecting the first source/drain region and the second source/drain region with each other, the source/drain contact including a first portion and a second portion, the first portion extending toward the field insulating layer between the first source/drain region and the second source/drain region, the second portion on the first portion,
wherein a lower surface of the first portion of the source/drain contact includes a recess which is recessed upwardly in the vertical direction,
wherein at least a part of the protrusion is inside the recess,
wherein the field insulating layer includes,
a first upper surface between the first active pattern and the protrusion, and
a second upper surface between the second active pattern and the protrusion, and
wherein the second upper surface of the field insulating layer is higher than the first upper surface of the field insulating layer.
2. The semiconductor device of claim 1 , wherein an upper end of the protrusion is lower than an upper surface of the first active pattern that is in contact with the first source/drain region.
3. The semiconductor device of claim 1 , wherein the first portion of the source/drain contact is in contact with the protrusion.
4. The semiconductor device of claim 1 , wherein the source/drain contact further includes a third portion that protrudes upwardly in the vertical direction from the second portion of the source/drain contact, and
wherein a width of the third portion of the source/drain contact in the second horizontal is narrower than a width of the second portion of the source/drain contact in the second horizontal direction.
5. The semiconductor device of claim 4 , wherein the third portion overlaps the protrusion in the vertical direction.
6. The semiconductor device of claim 1 , wherein the lower surface of the first portion of the source/drain contact is lower than an upper surface of the first active pattern that is in contact with the first source/drain region.
7. The semiconductor device of claim 1 , further comprising:
an interlayer insulating layer surrounding the first source/drain region and the source/drain contact on the field insulating layer; and
an etching stop layer being between the field insulating layer and the interlayer insulating layer, and being between the first source/drain region and the interlayer insulating layer.
8. The semiconductor device of claim 7 , wherein at least a part of the interlayer insulating layer is between the lower surface of the first portion of the source/drain contact and each of the first and second upper surfaces of the field insulating layer.
9. The semiconductor device of claim 7 , wherein at least a part of the etching stop layer is between the protrusion and the interlayer insulating layer.
10. The semiconductor device of claim 1 , wherein the first portion of the source/drain contact includes a first lower surface facing the first upper surface of the field insulating layer, and a second lower surface facing the second upper surface of the field insulating layer, and
wherein the second lower surface of the first portion of the source/drain contact is on a same plane as the first lower surface of the first portion of the source/drain contact.
11. The semiconductor device of claim 1 , wherein the lower surface of the first portion of the source/drain contact is in contact with each of the first and second upper surfaces of the field insulating layer.
12. The semiconductor device of claim 1 , wherein the first portion of the source/drain contact includes a first lower surface facing the first upper surface of the field insulating layer, and a second lower surface facing the second upper surface of the field insulating layer, and
wherein the second lower surface of the first portion of the source/drain contact is higher than the first lower surface of the first portion of the source/drain contact.
13. The semiconductor device of claim 1 , wherein the substrate includes an NMOS region and a PMOS region, and
wherein the first active pattern is formed on the NMOS region, the second active pattern is formed on the PMOS region.
14. The semiconductor device of claim 13 , wherein the protrusion is on a boundary line between the NMOS region and the PMOS region.
15. A semiconductor device comprising:
a substrate;
a first active pattern extending in a first horizontal direction on the substrate;
a second active pattern extending in the first horizontal direction on the substrate, the second active pattern being spaced apart from the first active pattern in a second direction, the second horizontal direction being different from the first horizontal direction;
a first plurality of nanosheets stacked to be spaced apart from each other in a vertical direction on the first active pattern;
a second plurality of nanosheets stacked to be spaced apart from each other in the vertical direction on the second active pattern;
a gate electrode extending in the second horizontal direction on the first and second active patterns, the gate electrode surrounding each of the first plurality of nanosheets and each of the second plurality of nanosheets;
a field insulating layer surrounding at least a part of side walls of each of the first and second active patterns on the substrate, the field insulating layer including a protrusion protruding upwardly in the vertical direction between the first active pattern and second active pattern;
a first source/drain region on at least one side of the gate electrode on the first active pattern;
a second source/drain region on at least one side of the gate electrode on the second active pattern; and
a source/drain contact electrically connecting the first source/drain region and the second source/drain region with each other, the source/drain contact including a first portion and a second portion, the first portion extending toward the field insulating layer between the first source/drain region and the second source/drain region, the second portion on the first portion,
wherein the first portion of the source/drain contact is in contact with the protrusion.
16. The semiconductor device of claim 15 , wherein a lower surface of the first portion of the source/drain contact includes a recess which is recessed upwardly in the vertical direction, and
wherein at least a part of the protrusion is inside the recess.
17. The semiconductor device of claim 15 , wherein the source/drain contact further includes a third portion that protrudes upwardly in the vertical direction from the second portion of the source/drain contact, and
wherein a width of the third portion of the source/drain contact in the second horizontal is narrower than a width of the second portion of the source/drain contact in the second horizontal direction.
18. The semiconductor device of claim 15 , further comprising:
an interlayer insulating layer surrounding the first source/drain region and the source/drain contact on the field insulating layer; and
an etching stop layer being between the field insulating layer and the interlayer insulating layer, and being between the first source/drain region and the interlayer insulating layer.
19. The semiconductor device of claim 18 , wherein at least a part of the interlayer insulating layer is between a lower surface of the first portion of the source/drain contact and an upper surface of the field insulating layer.
20. The semiconductor device of claim 15 , wherein the substrate includes an NMOS region and a PMOS region, and
wherein the first active pattern is formed on the NMOS region, the second active pattern is formed on the PMOS region.