Granted Patent B2

US 12,310,225 · App. 17/764,440 · Granted May 20, 2025

Inventors: Xiaoyan Zhu (Beijing, CN); Jinxiang Xue (Beijing, CN)

Assignee: BOE Technology Group Co., Ltd.

H10K77/111H10K50/844H10K71/00

Abstract

Claims (36)

1. A method for manufacturing a stretchable display panel, comprising:

forming an organic protective structure and an inorganic protective structure which are laminated on a rigid substrate;

forming a flexible substrate on the inorganic protective structure;

forming a plurality of pixel islands and inter-island connectors for connecting adjacent pixel islands on the flexible substrate, wherein the plurality of pixel islands and the inter-island connectors define hollow structures, and an orthographic projection of the hollow structure on the rigid substrate is within an orthographic projection of the organic protective structure on the rigid substrate and within an orthographic projection of the inorganic protective structure on the rigid substrate;

forming an encapsulation layer on the plurality of pixel islands and the inter-island connectors; and

stripping off the rigid substrate; and

wherein the hollow structure extends to the inorganic protective structure and is not in contact with the organic protective structure.

2. The method according to claim 1 , wherein the hollow structure comprises:

a first opening, and a second opening communicated with the first opening, wherein the first opening is closer to the rigid substrate than the second opening is, and an orthographic projection of the first opening on the rigid substrate is within an orthographic projection of the second opening on the rigid substrate.

3. The method according to claim 2 , wherein the first opening is sleeved in the second opening.

4. The method according to claim 2 , wherein a slope angle of a sidewall of the first opening is greater than a slope angle of a sidewall of the second opening.

5. The method according to claim 1 , wherein forming the organic protective structure and the inorganic protective structure which are laminated on the rigid substrate comprises:

forming an organic protective film and an inorganic protective film in sequence on the rigid substrate; and

performing a single patterning process on the inorganic protective film to form the organic protective structure and the inorganic protective structure on the rigid substrate.

6. The method according to claim 5 , wherein performing the single patterning process on the inorganic protective film to form the organic protective structure and the inorganic protective structure on the rigid substrate comprises:

forming a photoresist film on the inorganic protective film;

performing exposure and development on the photoresist film to form a photoresist pattern;

performing first etching on the inorganic protective film to form the inorganic protective structure with the photoresist pattern;

performing second etching on the organic protective film to form the organic protective structure with the photoresist pattern and the inorganic protective structure; and

removing the photoresist pattern to form the organic protective structure and the inorganic protective structure.

7. The method according to claim 1 , wherein stripping off the rigid substrate comprises:

stripping off the rigid substrate after carbonizing the organic protective structure and the flexible substrate.

8. The method according to claim 7 , wherein when the rigid substrate is stripped off, the organic protective structure, or the organic protective structure and the inorganic protective structure are also stripped off.

9. The method according to claim 1 , wherein forming the plurality of pixel islands and the inter-island connectors for connecting adjacent pixel islands on the flexible substrate comprises:

forming a plurality of functional layers on the flexible substrate; and

forming openings in the plurality of functional layers to form the plurality of pixel islands and the inter-island connectors, wherein the hollow structures penetrate the plurality of functional layers and the flexible substrate.

10. The method according to claim 9 , wherein the flexible substrate comprises a pixel region, and the pixel island is disposed in the pixel region; and

forming the plurality of functional layers on the flexible substrate comprises:

forming a plurality of display functional layers in the pixel region of the flexible substrate, the plurality of display functional layers being configured to form light-emitting devices in the plurality of pixel islands and drive circuits connected to the light-emitting devices; and

forming a plurality of connection functional layers in a region, other than the pixel region, of the flexible substrate, the plurality of connection functional layers being configured to form connection traces and trace protective structures in the inter-island connectors.

11. The method according to claim 10 , wherein the flexible substrate further comprises a connection region, and an inter-island connector is disposed in the connection region; and

forming the openings in the plurality of functional layers to form the plurality of pixel islands and the inter-island connectors comprises:

removing portions, other than the connection region, of the plurality of connection functional layers, and removing portions, other than the connection region and the pixel region, of the flexible substrate, to form the plurality of pixel islands and the island inter-connectors.

12. The method according to claim 1 , wherein after stripping off the rigid substrate, the method further comprises:

forming a protective film on a side, away from the encapsulation layer, of the flexible substrate.

13. The method according to claim 1 , wherein the inorganic protective structure is made of a metal material.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (16)

Cited By (1)

US 12,557,542