Implantable medical device system with multi-band antenna arrangement
Embodiments presented herein are generally directed to techniques that provide a medical device component with the ability to communicate in both the near-field and far-field via a single antenna arrangement. More specifically, a medical device component includes an electronics circuit, a coil driver, an antenna arrangement, and an isolation circuit. The isolation circuit operates to extract far-field signals received at the antenna arrangement and provide these signals to the electronics circuit. The electronics circuit is protected from near-field signals received at the antenna arrangement via the isolation circuit.
1. A medical device component, comprising:
an electronics circuit, including far-field wireless circuitry;
an antenna arrangement configured to receive near-field signals via an inductive coupling with a second medical device component and far-field signals from one or more external devices;
a coil driver disposed between the electronics circuit and the antenna arrangement and configured to provide the near-field signals to the electronics circuit;
an isolation circuit disposed between the electronics circuit and the antenna arrangement and configured to provide the far-field signals to the electronics circuit; and
first and second capacitors connected in series with a primary side of the isolation circuit, and wherein the first and second capacitors are disposed on opposing sides of the primary side of the isolation circuit.
2. The medical device component of claim 1 , wherein the isolation circuit is an isolation coupler.
3. The medical device component of claim 2 , wherein the isolation coupler comprises a directional coupler having a first transmission line and a second transmission line that is physically separated from the first transmission line.
4. The medical device component of claim 2 , wherein the isolation coupler is configured to electrically isolate the electronics circuit from direct current at the antenna arrangement.
5. The medical device component of claim 1 , wherein the medical device component is an external component of an implantable medical device system.
6. The medical device component of claim 1 , wherein the medical device component is an external component of a cochlear implant system.
7. The medical device component of claim 1 , wherein the antenna arrangement is a coil.
8. The medical device component of claim 1 , wherein the far-field wireless circuitry is configured to operate at a frequency that is greater than 50 Megahertz (MHz).
9. The medical device component of claim 1 , wherein the far-field wireless circuitry is configured to operate at a frequency on the greater 1 Gigahertz (GHz).
10. A method, comprising:
receiving near-field signals and far-field signals at a coil arrangement of a medical device component;
providing the near-field signals to an electronics circuit of the medical device component via an isolation circuit; and
providing the far-field signals to the electronics circuit via a coil driver.
11. The method of claim 10 , further comprising:
simultaneously receiving the near-field signals and the far-field signals at the coil arrangement.
12. The method of claim 10 , wherein providing the near-field signals to the electronics circuit via an isolation circuit, comprises:
high-pass filtering signals received at the coil arrangement to generate high-pass filtered signals; and
providing the high-pass filtered signals to the isolation circuit that is electrically connected to the electronics circuit.
13. The method of claim 12 , wherein high-pass filtering signals received at the coil arrangement, comprises:
filtering the signals received at the coil arrangement with first and second capacitors connected in series with a primary side of the isolation circuit, and wherein the first and second capacitors are disposed on opposing sides of the primary side of the isolation circuit.
14. The method of claim 12 , wherein the coil arrangement comprises a primary inductive coil and a dampening inductive coil, wherein first and second capacitors are connected between the isolation circuit and first and second terminals, respectively, of the dampening inductive coil, and wherein high-pass filtering signals received at the coil arrangement to generate high-pass filtered signals, comprises:
high-pass filtering signals received at the dampening inductive coil.
15. The method of claim 12 , wherein the coil arrangement comprises a primary inductive coil and a dampening inductive coil, and wherein first and second capacitors are connected between the isolation circuit and first and second terminals, respectively, of the primary inductive coil, and wherein high-pass filtering signals received at the coil arrangement to generate high-pass filtered signals, comprises:
high-pass filtering signals received at the primary inductive coil.
16. The method of claim 12 , wherein the coil arrangement comprises a primary inductive coil, and wherein first and second capacitors are connected between the isolation circuit and first and second terminals, respectively, of the primary inductive coil, and wherein high-pass filtering signals received at the coil arrangement to generate high-pass filtered signals, comprises:
high-pass filtering signals received at the primary inductive coil.
17. The method of claim 10 , wherein the isolation circuit is an isolation coupler.
18. The method of claim 17 , wherein the isolation coupler comprises a directional coupler having a first transmission line and a second transmission line that is physically separated from the first transmission line.
19. The method of claim 17 , wherein the isolation coupler is configured to electrically isolate the electronics circuit from direct current at the coil arrangement.
20. A method, comprising:
receiving near-field signals at a coil arrangement of a medical device component; and
providing the near-field signals to an electronics circuit of the medical device component via an isolation circuit,
wherein providing the near-field signals to the electronics circuit via an isolation circuit, comprises:
high-pass filtering signals received at the coil arrangement to generate high-pass filtered signals; and
providing the high-pass filtered signals to the isolation circuit that is electrically connected to the electronics circuit.