IP Library › Granted Patent US 12,327,951
Granted Patent B2
US 12,327,951 · App. 17/826,079 · Granted Jun 10, 2025

Rugged retainer mounting point system

Inventors: Kwang Jin Gooi (Pulau Pinang, MY); Satyanarayan Iyer (Fremont, CA); Muhammad Annuar Bin Johani (Pulau Pinang, MY); Ali Akbar Bin Abdu Aziz (Pulau Pinang, MY)
Assignee: Smart Modular Technologies, Sdn. Bhd
H01R13/639H01R12/737H01R25/006
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,327,951
App. No.
17/826,079
Granted
Jun 10, 2025
Kind
B2
Abstract

A memory module operation system for operating in high stress environments with strong vibration. The application and use of a retainer to reduce and dampen the effects of system vibration and the application of dynamic loads can retain a memory module in place in a memory socket. Further, the retainer can operate to reduce the effects of electromagnetic interference and can act as a heat transport system to reduce thermal stress on components.

Claims (16)

1. A method of operation of a memory module retention system comprising:

mounting a memory module in a memory socket;

attaching a retainer to the memory module and the memory socket, the retainer configured to secure the memory module to the memory socket by retaining the memory module in an x-direction, a y-direction, and a z-direction during operation, wherein the retainer comprises a hooked retainer tip; and

engaging, with the hooked retainer tip, a latch head of the memory socket, wherein the latch head of the memory socket is also engaging a notch in the memory module.

2. The method as claimed in claim 1 , wherein attaching the retainer includes:

attaching a retainer tab of the retainer directly on the memory module.

3. The method as claimed in claim 1 , wherein attaching the retainer includes attaching a module tongue of the memory module in a retainer groove of the retainer to resist movement in the z-direction.

4. The method as claimed in claim 1 , wherein attaching the retainer includes attaching the memory module between two retainer arms positioned at opposite ends of a retainer base.

5. The method as claimed in claim 1 , wherein attaching the retainer includes attaching retainer ribs to a front side of the memory module.

6. A memory module retention apparatus comprising:

a retainer base configured to extend across a top side of a memory module;

two retainer arms extending perpendicular from the retainer base, the retainer arms positioned at opposite ends of the retainer base, wherein the retainer arms comprise a hooked retainer tip that is configured to engage a latch head of a memory socket that is engaging a notch in the memory module.

7. The apparatus as claimed in claim 6 , wherein the retainer includes a retainer tab extending from the retainer and a lever latch tip of the retainer engaged to the memory socket for resisting movement in the y-direction.

8. The apparatus as claimed in claim 6 , wherein the retainer includes a retainer groove on an inner side of a retainer arm and a module tongue of the memory module is in the retainer groove of the retainer for resisting movement in the z-direction.

9. The apparatus as claimed in claim 6 , wherein the retainer includes retainer arms attached directly on the memory module for resisting movement in the x-direction.

10. The apparatus as claimed in claim 6 , wherein the retainer includes retainer ribs across a front side of the memory module for resisting movement in the z-direction.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2022
From: GOOI, KWANG JIN; IYER, SATYANARAYAN; BIN JOHANI, MUHAMMAD ANNUAR; AZIZ, ALI AKBAR BIN ABDUL
To: SMART MODULAR TECHNOLOGIES SDN. BHD.
Reel/Frame 060033/0211 →
Priority Claims (1)
MY PI2021003206 · Jun 9, 2021 · national
Continuity (1)
Related Publication 20220399682A1 · Dec 15, 2022
References Cited (25)
US 6188576B1 · Ali · 2001 [cited by examiner]
US 6353538B1 · Ali · 2002 [cited by examiner]
US 6362966B1 · Ali · 2002 [cited by examiner]
US 10211572B1 · M R · 2019 [cited by examiner]
US 10734763B2 · M R · 2020 [cited by examiner]
US 10763606B1 · Esmaily · 2020 [cited by examiner]
US 10955881B2 · Gopalakrishna · 2021 [cited by examiner]
US 20020072263A1 · Fumikura · 2002 [cited by examiner]
US 20100015820A1 · Wang · 2010 [cited by examiner]
US 20110053391A1 · Vrenna · 2011 [cited by examiner]
US 20110059654A1 · Zhu · 2011 [cited by examiner]
US 20130078862A1 · Kato · 2013 [cited by examiner]
US 20140080343A1 · Wang · 2014 [cited by examiner]
US 20140080345A1 · Xu · 2014 [cited by examiner]
US 20140368988A1 · Tobias · 2014 [cited by examiner]
US 20170069985A1 · Schulze · 2017 [cited by examiner]
US 20180102608A1 · Sun · 2018 [cited by examiner]
US 20180321715A1 · Gopalakrishna · 2018 [cited by examiner]
CN 2329095Y · 1999 [cited by examiner]
CN 2556705Y · 2003 [cited by examiner]
CN 201327888Y · 2009 [cited by examiner]
CN 201408859Y · 2010 [cited by examiner]
CN 102957011B · 2015 [cited by examiner]
JP 3371248B2 · 2003 [cited by examiner]
Office Action for Malaysian Patent Application No. PI2021003206, mailed Dec. 26, 2023, 5 pages. [cited by applicant]