Electronic device
According to one embodiment, an electronic device includes a first substrate and a second substrate. The first substrate includes a first insulating base, a wiring layer and a sensor electrode. The first insulating base is made into a mesh-like form. The wiring layer is disposed over a first band portion of the first insulating base. The sensor electrode is disposed over a first island-shaped portion of the first insulating base. The second substrate includes a second insulating base, a common electrode and a sensor sheet. The second insulating base is made into a mesh-like form. The common electrode is made into a mesh-like form. The sensor sheet overlaps a second island-shaped portion of the second insulating base in plan view and is disposed below the common electrode.
1. An electronic device comprising:
a first substrate; and
a second substrate opposing the first substrate,
the first substrate comprising:
a first insulating base including a plurality of first island-shaped portions and a plurality of first band portions each connecting a respective pair of first island-shaped portions adjacent to each other, and made into a mesh-like form,
a wiring layer disposed over the first band portion, and
a sensor electrode disposed over the first island-shaped portion and electrically connected to the wiring layer, and
the second substrate comprising:
a second insulating base including a plurality of second island-shaped portions and a plurality of second band portions connecting a respective pair of second island-shaped portions adjacent to each other, and made into a mesh-like form,
a common electrode disposed below the second island-shaped portion and the second band portion, and made into a mesh-like form, and
a sensor sheet overlapping the second island-shaped portion in plan view and disposed below the common electrode.
2. The electronic device of claim 1 , wherein
the sensor electrode and the sensor sheet oppose each other, and
a space is provided between the sensor electrode and the sensor sheet.
3. The electronic device of claim 1 , wherein
the first island-shaped portion and the second island-shaped portion overlap each other in plan view, and
the first band portion and the second band portion overlap each other in plan view.
4. The electronic device of claim 1 , further comprising an adhesive layer disposed in a position overlapping the first band portion and the second band portion in plan view, to bond the sensor electrode and the sensor sheet together.
5. The electronic device of claim 1 , further comprising an adhesive layer disposed in a position overlapping an outer circumference of each of the first island-shaped portions and the second island-shaped portions in plan view, to bond the sensor electrode and the sensor sheet together.
6. The electronic device of claim 1 , wherein the common electrode is formed of an organic conductive material.
7. The electronic device of claim 1 , wherein the common electrode is formed of a metal material.
8. An electronic device comprising:
a first substrate;
a second substrate opposing the first substrate; and
an elastic member sealing the first substrate and the second substrate,
the first substrate comprising:
a first insulating base including a plurality of first island-shaped portions and a plurality of first band portions each connecting a respective pair of first island-shaped portions adjacent to each other, and made into a mesh-like form,
a wiring layer disposed over the first band portion, and
a sensor electrode disposed over the first island-shaped portion and electrically connected to the wiring layer, and
the second substrate comprising:
a second insulating base including a plurality of second island-shaped portions and a plurality of second band portions connecting a respective pair of second island-shaped portions adjacent to each other and made into a mesh-like form,
a common electrode disposed below the second island-shaped portion and the second band portion and made into a mesh-like form, and
a pressure-sensitive layer overlapping the second island-shaped portion and the second band portion in plan view, disposed below the common electrode, and made into a mesh-like form.
9. The electronic device of claim 8 , wherein the pressure-sensitive layer is disposed between the sensor electrode and the common electrode.
10. The electronic device of claim 8 , wherein
the first island-shaped portion and the second island-shaped portion overlap each other in plan view, and
the first band portion and the second band portion respectively overlap each other in plan view.
11. The electronic device of claim 8 , wherein the common electrode is formed of an organic conductive material.
12. The electronic device of claim 8 , wherein the common electrode is formed of a metal material.