Granted Patent B2

US 12,328,817 · App. 18/215,469 · Granted Jun 10, 2025

Inventors: Eon Jong Lee (Seoul, KR); Dong Chan Kim (Seoul, KR); Ki Tae Park (Seoul, KR)

Assignee: LG INNOTEK CO., LTD.

H05K1/118H05K1/028H05K1/111H05K1/189H05K2201/10136

Abstract

Claims (40)

1. A flexible printed circuit board comprising:

a substrate; and

a circuit pattern disposed on the substrate,

wherein the substrate includes a chip mounting region, and

wherein the circuit pattern includes:

a first circuit pattern including a first-first pad portion disposed inside the chip mounting region of the substrate, a first-second pad portion disposed outside the chip mounting region of the substrate, and a first wiring portion that connects the first-first pad portion and the first-second pad portion, and the first wiring portion extending in a first direction;

a second circuit pattern including a second-first pad portion disposed inside the chip mounting region of the substrate, a second-second pad portion disposed outside the chip mounting region of the substrate, and a second wiring portion that connects the second-first pad portion and the second-second pad portion, and the second wiring portion extending in a second direction opposite to the first direction; and

a third circuit pattern including a plurality of third pad portions disposed inside the chip mounting region of the substrate, and a third wiring portion connecting the plurality of third pad portions inside the chip mounting region of the substrate,

wherein the plurality of third pad portions include a third-first pad portion and a third-second pad portion spaced apart from each other inside the chip mounting region of the substrate, and

wherein third wiring portion connects between the third-first pad portion and the third-second pad portion inside of the chip mounting region of the substrate.

2. The flexible printed circuit board of claim 1 , wherein the third circuit pattern includes a plurality of third circuit patterns spaced apart from each other.

3. The flexible printed circuit board of claim 1 , wherein the third wiring portion includes a third-first wiring portion and a third-second wiring portion that extend in different directions, and

wherein the third-first wiring portion and the third-second wiring portion are integrally formed.

4. The flexible printed circuit board of claim 1 , wherein the plurality of third pad portions further includes an additional pad portion disposed between the third-first pad portion and the third-second pad portion inside the chip mounting region of the substrate.

5. The flexible printed circuit board of claim 1 , wherein the third wiring portion includes ten or more of bent parts.

6. The flexible printed circuit board of claim 5 , wherein the third wiring portion includes a concave part pattern concave in the first direction or the second direction by the bent part.

7. The flexible printed circuit board of claim 1 , wherein the third circuit pattern includes a plurality of third circuit patterns spaced apart from each other,

wherein each third wiring portion of the third circuit patterns includes a concave part pattern concave in the first direction or the second direction by a bent part, and

wherein the concave part patterns overlap in the first direction or the second direction.

8. The flexible printed circuit board of claim 3 , wherein the third-first wiring portion and the third-second wiring portion include an intersection region intersecting with each other, and a non-intersection region other than the intersection region, and

wherein a width of the intersection region is greater than a width of the non-intersection region.

9. The flexible printed circuit board of claim 4 , wherein the third wiring portion includes a plurality of bent parts and a plurality of non-bent parts, and

wherein at least one of the plurality of third pad portions is disposed on the non-bent part.

10. The flexible printed circuit board of claim 1 , wherein a number of the third pad portions is smaller than a number of first pad portions and a number of second pad portions.

11. The flexible printed circuit board of claim 1 , wherein a number of the third wiring portions is smaller than a number of first wiring portions and a number of second wiring portions.

12. The flexible printed circuit board of claim 1 , wherein the third wiring portion includes a region in which a width varies.

13. The flexible printed circuit board of claim 2 , wherein the third wiring portion include a region in which a spacing varies.

14. The flexible printed circuit board of claim 1 , wherein the substrate includes a first surface and a second surface opposite to the first surface, and

the first to third circuit patterns are disposed on the first surface.

15. The flexible printed circuit board of claim 1 , wherein

the third circuit pattern includes an extension wiring portion connected to the third pad portion and extending outside the chip mounting region of the substrate, and

wherein at least a portion of the extension wiring portion is disposed inside the chip mounting region of the substrate and is connected to the third-first pad portion or the third-second pad portion.

16. A chip on film (COF) module comprising:

the flexible printed circuit board according to claim 1 ; and

a chip disposed in the chip mounting region of the substrate.

17. The chip on film module according to claim 16 , wherein the third circuit pattern is connected to the chip.

18. An electronic devise comprising:

the COF module according to claim 16 ;

a display panel connected to the first circuit pattern; and

a printed circuit board connected to the second circuit pattern.

Priority Claims (1)

Continuity (2)

References Cited (23)