Electronic component module and method of manufacturing electronic component module
An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.
1. An electronic component module comprising:
a substrate having a first main surface;
an electronic component including a housing having an outer surface with an insulation property, at least a first external electrode arranged on the outer surface of the housing, and a second external electrode, the electronic component being mounted on the first main surface of the substrate;
a sealing resin having an insulation property and covering the electronic component and the first main surface side of the substrate;
a conductive film covering an outer surface of the sealing resin; and
a conductive auxiliary layer provided on a side of the electronic component opposite to the substrate in a normal direction of the first main surface, and covering a part of the first external electrode and being not connected to the second external electrode, wherein:
the sealing resin has a recessed portion exposing the conductive auxiliary layer,
the conductive film has a conductive portion provided in the recessed portion, the conductive portion being connected to the conductive auxiliary layer,
the housing has a top surface and a side surface orthogonal to the top surface, and
the conductive auxiliary layer is positioned so as to go around the side surface of the housing from the top surface.
2. The electronic component module according to claim 1 , wherein the conductive auxiliary layer is provided to be wider than the first external electrode and the housing.
3. The electronic component module according to claim 1 , wherein the conductive auxiliary layer covers an outer edge of a side surface of the recessed portion.
4. The electronic component module according to claim 1 , further comprising:
an insulating auxiliary layer provided on the side of the electronic component opposite to the substrate in the normal direction of the first main surface, and covering a part of the housing and a part of the second external electrode.
5. The electronic component module according to claim 1 , wherein the conductive film is connected to a grounding conductor of the substrate.
6. The electronic component module according to claim 1 , wherein a part of the conductive film connected to the conductive auxiliary layer is a wiring electrode to another electronic component module.
7. The electronic component module according to claim 1 , wherein a part of the conductive film connected to the conductive auxiliary layer is a functional element of the electronic component module.
8. The electronic component module according to claim 2 , wherein the conductive auxiliary layer covers an outer edge of a side surface of the recessed portion.
9. The electronic component module according to claim 2 , further comprising:
an insulating auxiliary layer provided on the side of the electronic component opposite to the substrate in the normal direction of the first main surface, and covering a part of the housing and a part of the second external electrode.
10. The electronic component module according to claim 3 , further comprising:
an insulating auxiliary layer provided on the side of the electronic component opposite to the substrate in the normal direction of the first main surface, and covering a part of the housing and a part of the second external electrode.
11. The electronic component module according to claim 4 , wherein in plan view of the electronic component, the conductive auxiliary layer overlaps the insulating auxiliary layer on a side of the insulating auxiliary layer opposite to the electronic component in the normal direction of the first main surface.
12. The electronic component module according to claim 4 , wherein in plan view of the electronic component, a bottom of the recessed portion does not overlap the insulating auxiliary layer.
13. The electronic component module according to claim 7 , wherein the functional element is an antenna.
14. The electronic component module according to claim 11 , wherein in plan view of the electronic component, a bottom of the recessed portion does not overlap the insulating auxiliary layer.
15. A method of manufacturing an electronic component module comprising:
a step of mounting an electronic component on a substrate;
a step of forming a conductive auxiliary layer on a surface of a first external electrode of the electronic component on a side opposite to the substrate side;
a step of covering a mounting surface side of the electronic component on the substrate with a sealing resin having an insulation property;
a step of forming a recessed portion exposing the conductive auxiliary layer from the sealing resin; and
a step of forming a conductive film covering an outer surface of the sealing resin including the recessed portion, wherein:
the electronic component includes a housing having an outer surface with an insulation property,
the housing has a top surface and a side surface orthogonal to the top surface, and
the conductive auxiliary layer is formed so as to go around the side surface from the top surface.
16. The method of manufacturing an electronic component module according to claim 15 , further comprising a step of forming an insulating auxiliary layer on a surface of a second external electrode of the electronic component opposite to the substrate side before forming the conductive auxiliary layer.