IP Library › Granted Patent US 12,330,478
Granted Patent B2
US 12,330,478 · App. 17/762,824 · Granted Jun 17, 2025

Heating arrangement

Inventors: Andreas Bernhardt (Munich, DE); Frank Baur (Munich, DE)
Assignee: Vitesco Technologies GmbH
B60H1/2215H05B3/06H05B3/46H05K1/147H05B2203/003H05B2203/013H05B2203/017
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Quick Facts
Patent No.
US 12,330,478
App. No.
17/762,824
Granted
Jun 17, 2025
Kind
B2
Abstract

A heating arrangement has a coolant housing with an inflow connection and an outflow connection for a coolant. Heating elements are arranged on opposite housing walls and include connections for the supply of power. Three circuit-board pieces of a circuit board are arranged in a row and connected to one another via flexible regions. Power electronic components and connections for connecting to the power-supply connections of the heating elements are arranged on the two edge circuit-board pieces. The circuit board is bent in flexible regions such that the two edge circuit-board pieces lie opposite one another. The coolant housing lies between the opposite edge circuit-board pieces. The power-supply connections of the heating elements and the connections on the edge circuit-board pieces are in electrical contact.

Claims (9)

1. A heating arrangement, comprising:

a coolant housing having an inflow connection and an outflow connection for a coolant;

heating elements arranged on at least two opposite housing walls of said coolant housing, said heating elements having power supply connections;

a circuit board with at least three circuit board pieces, said circuit-board pieces being disposed in a row and being connected to one another via flexible regions, said circuit board pieces including two edge circuit-board pieces carrying power electronic components and connections for connecting to said power-supply connections of said heating elements;

said circuit board being bent at said flexible regions to arrange said two edge circuit-board pieces to lie opposite one another; and

wherein said coolant housing is disposed between said edge circuit-board pieces, and wherein said power-supply connections of said heating elements and said connections on said edge circuit-board pieces are in electrical contact with one another.

2. The heating arrangement according to claim 1 , wherein said at least three circuit-board pieces include a central circuit-board piece carrying a logic circuit on said central circuit-board piece.

3. The heating arrangement according to claim 1 , wherein said heating elements are heating rods.

4. The heating arrangement according to claim 1 , wherein said heating elements are formed by spray-applied resistive meanders.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2022
From: BERNHARDT, ANDREAS; BAUR, FRANK
To: VITESCO TECHNOLOGIES GMBH
Reel/Frame 059490/0819 →
Priority Claims (1)
DE 10 2019 214 566.3 · Sep 24, 2019 · national
Continuity (1)
Related Publication 20220339990A1 · Oct 27, 2022
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