Electronic component and method of manufacturing the same
A coil component according to one aspect of the invention includes an insulating base body, an external electrode provided on the base body, and a functional part electrically connected to the external electrode. The external electrode includes a metal portion, glass, and metal oxide, the metal portion being made of a metal material and having electric conductivity, the metal oxide being electrically non-conductive.
1. An electronic component comprising:
an insulating base body;
an external electrode provided on the base body and including a metal portion, glass, and metal oxide, the metal portion being made of a metal material and having electric conductivity, the metal oxide being electrically non-conductive; and
a functional part made of a metal and electrically connected to the external electrode,
wherein the external electrode includes a glass aggregation region made of an aggregation of the glass,
wherein the glass aggregation region surrounds the metal oxide, and
wherein the glass aggregation region is disposed apart from the insulating base body.
2. The electronic component of claim 1 ,
wherein the external electrode has an inner peripheral surface and an outer peripheral surface, the inner peripheral surface faces a surface of the base body, the outer peripheral surface is opposite to the inner peripheral surface, and the metal portion is exposed from the outer peripheral surface, and
wherein the electronic component includes a glass layer disposed in contact with the surface of the base body and the inner peripheral surface of the external electrode.
3. The electronic component of claim 2 , wherein the metal portion is exposed in three-fourth or larger of an area of the outer peripheral surface.
4. The electronic component of claim 1 , wherein the metal oxide is oxide of a transition metal.
5. The electronic component of claim 2 , further comprising a plating layer disposed on the outer peripheral surface of the external electrode.
6. The electronic component of claim 1 , wherein the functional part includes a conductor wound around a coil axis.
7. The electronic component of claim 1 , wherein the functional part includes a pair of electrodes for generating a capacitance.
8. The electronic component of claim 1 , wherein the glass does not contain lead, and a melting point of the glass is 500° C. or lower.
9. The electronic component of claim 1 , wherein the base body includes oxide.
10. A circuit board comprising the electronic component of claim 1 .
11. An electronic device comprising the circuit board of claim 10 .