Electronic component, electronic component manufacturing method, capacitor, and capacitor manufacturing method
View Patent ↗An electronic component includes an electronic component element and a barrier film. The electronic component element has external electrodes at both ends thereof. The barrier film covers at least a part of a periphery of the electronic component element. The barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.
1. An electronic component comprising:
an electronic component element including external electrodes at both ends of the electronic component element;
a barrier film covering at least a part of a periphery of the electronic component element; and
an outer packaging resin layer covering the electronic component element and the barrier film, wherein:
the barrier film includes an insulating film having electrical insulating property and a clay layer containing clay, and
only the clay layer in the barrier film contains the clay.
2. The electronic component according to claim 1 , wherein the clay layer in the barrier film faces the electronic component element.
3. The electronic component according to claim 1 , wherein the barrier film covers a periphery of each of the external electrodes.
4. The electronic component according to claim 1 , wherein each of the external electrodes is formed by thermal spraying and contains tin at a proportion of more than or equal to 50 wt %.
5. The electronic component according to claim 1 , further comprising another barrier film covering at least a part of the outer packaging resin layer.
6. The electronic component according to claim 1 , wherein each of the external electrodes has a plurality of layers, and at least one of the plurality of layers contains tin at a proportion of more than or equal to 50 wt %.
7. A capacitor comprising the electronic component element according to claim 1 , the electronic component element including a capacitor element.
8. The electronic component according to claim 1 , wherein the clay layer contains particles each having an aspect ratio of more than or equal to 20.
9. The electronic component according to claim 1 , wherein a thickness of the clay layer is smaller than a thickness of the insulating film.
10. The electronic component according to claim 1 , wherein:
a thickness of the clay layer ranges from 0.5 μm to 5 μm, inclusive, and
a thickness of the insulating film ranges from 10 μm to 30 μm, inclusive.
11. A method for manufacturing an electronic component, the method comprising:
forming an electronic component element; and
winding a barrier film around at least a part of a periphery of the electronic component element,
wherein the barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.
12. A method for manufacturing a capacitor, the method comprising:
winding a metalized film to form a wound body;
winding a barrier film around at least a part of a periphery of the wound body; and
thermally spraying a metallic material on both ends of the wound body to form external electrodes after the winding of the barrier film, wherein:
the barrier film includes an insulating film having electrical insulating property and a clay layer containing clay, the clay layer being formed on the insulating film, and
in the winding of the barrier film, the barrier film is wound so that the clay layer faces the wound body.
13. The method for manufacturing a capacitor according to claim 12 , wherein the metallic material contains tin at a proportion of more than or equal to 50 wt %.
14. An electronic component comprising:
an electronic component element including external electrodes at both ends of the electronic component element; and
a barrier film wound around at least a part of a periphery of the electronic component element,
wherein the barrier film includes an insulating film having electrical insulating property and a clay layer containing clay.
15. The electronic component according to claim 14 , wherein the clay layer in the barrier film faces the electronic component element.
16. The electronic component according to claim 14 , wherein the barrier film covers a periphery of each of the external electrodes.
17. The electronic component according to claim 14 , wherein each of the external electrodes is formed by thermal spraying and contains tin at a proportion of more than or equal to 50 wt %.
18. The electronic component according to claim 14 , further comprising an outer packaging resin layer covering the electronic component element and the barrier film.
19. The electronic component according to claim 18 , further comprising another barrier film covering at least a part of the outer packaging resin layer.
20. The electronic component according to claim 14 , wherein each of the external electrodes has a plurality of layers, and at least one of the plurality of layers contains tin at a proportion of more than or equal to 50 wt %.
21. A capacitor comprising the electronic component element according to claim 14 , the electronic component element including a capacitor element.
22. An electronic component comprising:
an electronic component element including external electrodes at both ends of the electronic component element;
a barrier film covering at least a part of a periphery of the electronic component element; and
an outer packaging resin layer covering the electronic component element and the barrier film, wherein:
the barrier film includes:
an insulating film having electrical insulating property, and
a first layer containing particles each having an aspect ratio of more than or equal to 20, and
only the first layer in the barrier film contains the particles each having an aspect ratio of more than or equal to 20.
23. The electronic component according to claim 22 , wherein:
the particles are mineral particles, and
the mineral particles include at least one selected from the group consisting of mica, vermiculite, montmorillonite, iron montmorillonite, beidellite, saponite, hectorite, stevensite, and nontronite.
24. The electronic component according to claim 22 , wherein:
the first layer includes a maze structure constituted by the particles.
25. The electronic component according to claim 22 , wherein the first layer in the barrier film faces the electronic component element.
26. A capacitor comprising the electronic component element according to claim 22 , the electronic component element including a capacitor element.
27. An electronic component comprising:
an electronic component element including external electrodes at both ends of the electronic component element; and
a barrier film wound around at least a part of a periphery of the electronic component element,
wherein the barrier film includes:
an insulating film having electrical insulating property, and
a first layer containing particles each having an aspect ratio of more than or equal to 20.
28. The electronic component according to claim 27 , wherein:
the particles are mineral particles, and
the mineral particles include at least one selected from the group consisting of mica, vermiculite, montmorillonite, iron montmorillonite, beidellite, saponite, hectorite, stevensite, and nontronite.
29. The electronic component according to claim 27 , wherein:
the first layer includes a maze structure constituted by the particles.
30. The electronic component according to claim 27 , wherein the first layer in the barrier film faces the electronic component element.
31. The electronic component according to claim 27 , further comprising an outer packaging resin layer covering the electronic component element and the barrier film.
32. A capacitor comprising the electronic component element according to claim 27 , the electronic component element including a capacitor element.