IP Library › Granted Patent US 12,334,355
Granted Patent B2
US 12,334,355 · App. 17/785,352 · Granted Jun 17, 2025

Pressure control device

Inventors: Kaoru Hirata (Osaka, JP); Kouji Nishino (Osaka, JP); Katsuyuki Sugita (Osaka, JP); Shinya Ogawa (Osaka, JP); Keisuke Ideguchi (Osaka, JP)
Assignee: FUJIKIN INCORPORATED
H01L21/3065G05D16/20H01L22/26G01F1/34G01F1/48Y10T137/7759Y10T137/7761
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,334,355
App. No.
17/785,352
Granted
Jun 17, 2025
Kind
B2
Abstract

A pressure control device includes a pressure control valve, a flow resistance provided downstream of the pressure control valve, a first pressure sensor for measuring a gas pressure between the pressure control valve and the flow resistance, a second pressure sensor for measuring a gas pressure downstream of the flow resistance, and a calculation control circuit connected to the first pressure sensor and the second pressure sensor, wherein the pressure control device controls the gas pressure downstream of the flow resistance by adjusting an opening degree of the pressure control valve based on an output of the second pressure sensor regardless of an output of the first pressure sensor control, and calculates the flow rate of the gas downstream of the flow resistance, based on the outputs of the first and the second pressure sensors.

Claims (25)

1. A pressure control device comprising:

a pressure control valve provided in a flow path;

a flow resistance for restricting a gas flow provided downstream of the pressure control valve;

a first pressure sensor for measuring a gas pressure of the flow path between the pressure control valve and the flow resistance;

a second pressure sensor for measuring a gas pressure of the flow path downstream of the flow resistance; and

an arithmetic control circuit connected to the first pressure sensor and the second pressure sensor,

wherein the arithmetic control circuit is configured to control a gas pressure downstream of the flow resistance by adjusting an opening degree of the pressure control valve based on an output of the second pressure sensor regardless of an output of the first pressure sensor and calculate a flow rate of the gas flowing downstream from the flow resistance based on the outputs of the first pressure sensor and the second pressure sensor,

wherein the flow resistance is a laminar flow element comprising a columnar member and a capillary structure provided in a hole penetrating an axis direction of the columnar member, and

the columnar member has a recess on its end surface for accommodating an enlarged diameter portion of the capillary structure, and a resin gasket is provided between a bottom surface of the recess of the columnar member and a bottom surface of the enlarged diameter portion of the capillary structure.

2. The pressure control device according to claim 1 , wherein the pressure control valve is a piezoelectric element driven valve; each of the first pressure sensor and the second pressure sensor is a diaphragm type pressure sensor having a diaphragm as a pressure-sensing portion and an elongated hole communicating to the diaphragm; and any one of diameters of the pressure control valve, the first pressure sensor, the second pressure sensor, and the flow resistance is 10 mm or less.

3. The pressure control device according to claim 1 , wherein the pressure control device is connected to a supply flow path for supplying gas to a back surface of a substrate placed in a process chamber, and is configured to control a gas pressure on the back surface of the substrate to a predetermined pressure, and to detect a leakage of gas from the back surface of the substrate into the process chamber based on a calculated flow rate.

4. The pressure control device according to claim 1 , being configured so that a controlled gas pressure is to be between 1 and 100 Torr.

5. The pressure control device according to claim 1 comprising:

a flow path block formed with flow paths by drilling, wherein the pressure control valve and the first pressure sensor are arranged to face each other across the flow path block,

wherein the flow paths formed in the flow path block include a first flow path extending from a central portion of a valve element of the pressure control valve toward the first pressure sensor, and a second flow path extending branched from the first flow path along a direction intersecting the first flow path, and

the flow resistance is provided in the second flow path.

6. A pressure control device comprising:

a pressure control valve provided in a flow path;

a flow resistance for restricting a gas flow provided downstream of the pressure control valve;

a first pressure sensor for measuring a gas pressure of the flow path between the pressure control valve and the flow resistance;

a second pressure sensor for measuring a gas pressure of the flow path downstream of the flow resistance;

a flow path block formed with flow paths by drilling; and

an arithmetic control circuit connected to the first pressure sensor and the second pressure sensor,

wherein the arithmetic control circuit is configured to control a gas pressure downstream of the flow resistance by adjusting an opening degree of the pressure control valve based on an output of the second pressure sensor regardless of an output of the first pressure sensor and calculate a flow rate of the gas flowing downstream from the flow resistance based on the outputs of the first pressure sensor and the second pressure sensor, and

wherein the pressure control valve and the first pressure sensor are arranged to face each other across the flow path block, the flow paths formed in the flow path block include a first flow path extending from a central portion of a valve element of the pressure control valve toward the first pressure sensor, and a second flow path extending branched from the first flow path along a direction intersecting the first flow path, and the flow resistance is provided in the second flow path.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2022
From: HIRATA, KAORU; NISHINO, KOUJI; SUGITA, KATSUYUKI; OGAWA, SHINYA; IDEGUCHI, KEISUKE
To: FUJIKIN INCORPORATED
Reel/Frame 060197/0121 →
Priority Claims (1)
JP 2019-235252 · Dec 25, 2019 · national
Continuity (1)
Related Publication 20230011244A1 · Jan 12, 2023
References Cited (43)
US 4858643A · Vavra · 1989 [cited by examiner]
US 5669408A · Nishino · 1997 [cited by examiner]
US 5816285A · Ohmi · 1998 [cited by examiner]
US 6539968B1 · White · 2003 [cited by examiner]
US 6964279B2 · Ohmi · 2005 [cited by examiner]
US 9494947B2 · Hirata · 2016 [cited by examiner]
US 9690301B2 · Mudd · 2017 [cited by examiner]
US 9733649B2 · Nagase · 2017 [cited by examiner]
US 9791867B2 · Nagase · 2017 [cited by examiner]
US 9921089B2 · Ohmi · 2018 [cited by examiner]
US 10054959B2 · Somani · 2018 [cited by examiner]
US 10503179B2 · Hayashi · 2019 [cited by examiner]
US 10663337B2 · Penley · 2020 [cited by examiner]
US 11585444B2 · Kovacic · 2023 [cited by examiner]
US 11639865B2 · Penley · 2023 [cited by examiner]
US 11841036B2 · Penley · 2023 [cited by examiner]
US 11899477B2 · Barros · 2024 [cited by examiner]
US 20120209436A1 · Takijiri et al. · 2012 [cited by applicant]
US 20120227955A1 · Koshimizu · 2012 [cited by applicant]
US 20140182692A1 · Hirata · 2014 [cited by examiner]
US 20160349763A1 · Hirose et al. · 2016 [cited by applicant]
US 20170212531A1 · Nagase et al. · 2017 [cited by applicant]
US 20170299456A1 · Suzuki et al. · 2017 [cited by applicant]
US 20180173249A1 · Hayashi et al. · 2018 [cited by applicant]
US 20180253111A1 · Goto · 2018 [cited by applicant]
US 20180328812A1 · Fukushima et al. · 2018 [cited by applicant]
JP S58101213U · 1983 [cited by applicant]
JP H05233068A · 1993 [cited by applicant]
JP H0863235A · 1996 [cited by applicant]
JP H11353032A · 1999 [cited by applicant]
JP 2011119433A · 2011 [cited by applicant]
JP 2012168823A · 2012 [cited by applicant]
JP 5710600B2 · 2015 [cited by applicant]
JP 2015109022A · 2015 [cited by applicant]
JP 6237923B2 · 2017 [cited by applicant]
JP 6335229B2 · 2018 [cited by applicant]
JP WO2017057129A1 · 2018 [cited by applicant]
JP WO2017104643A1 · 2018 [cited by applicant]
KR 100173535B1 · 1999 [cited by applicant]
TW 201823901A · 2018 [cited by applicant]
WO 2010132589A2 · 2010 [cited by applicant]
WO 2016013172A1 · 2016 [cited by applicant]
International Search Report issued in PCT/JP2020/045060; mailed Jan. 19, 2021. [cited by applicant]