Electronic device comprising printed circuit board
An electronic device includes a microphone module and a printed circuit board on which the microphone module is disposed. The printed circuit board includes a first layer having at least one first microphone pad coupled to the microphone module, a first ground spaced apart from the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and a second layer disposed under the first layer and having a second ground opposite to the first microphone pad and at least a part of the first ground.
1. An electronic device comprising:
an antenna structure;
a microphone module spaced apart from the antenna structure; and
a printed circuit board on which the microphone module is disposed,
wherein the printed circuit board includes:
a first layer including a first microphone pad coupled to the microphone module, a first ground surrounding the first microphone pad, and a second microphone pad coupled to the microphone module and connected to the first ground; and
a second layer disposed under the first layer and including a second ground facing at least a portion of the first ground and the at least one first microphone pad,
wherein the first ground comprises:
a ground shield spaced apart from the first microphone pad;
a first ground wire connecting the ground shield and the second microphone pad; and
a second ground wire extending around the first microphone pad and connecting the first ground wire and the ground shield,
wherein the ground shield, the first ground wire, and the second ground wire surround the first microphone pad.
2. The electronic device of claim 1 , wherein the first microphone pad comprises a (1-1)th microphone pad surrounded by the ground shield, the first ground wire, and the second ground wire, and a (1-2)th microphone pad,
wherein the first layer comprises a third ground wire extending around the (1-2)th microphone pad and connecting the first ground wire and the ground shield, and
wherein the ground shield, the first ground wire, and the third ground wire surround the (1-2)th microphone pad.
3. The electronic device of claim 2 , wherein the second ground includes a second ground shield extending from an end of the second ground to the second ground wire and the third ground wire.
4. The electronic device of claim 3 , wherein at least a portion of the first ground and the second ground shield surround the first microphone pad.
5. The electronic device of claim 2 , further comprising:
a via hole electrically connected to the ground shield of the first ground and the second ground.
6. The electronic device of claim 1 , further comprising:
a processor configured to control an operation of the microphone module,
wherein the first microphone pad is connected to a driving wire configured to operate the processor.
7. The electronic device of claim 1 ,
wherein the antenna structure comprises an antenna pattern,
wherein the printed circuit board includes a first region in which the microphone module is disposed and a second region which is disposed adjacent to the first region, and wherein at least a portion of the antenna structure overlaps at least a portion of the second region.
8. The electronic device of claim 7 , wherein at least a portion of the antenna structure overlaps at least a portion of the first region.
9. The electronic device of claim 1 , further comprising:
a housing including a microphone hole configured to direct external sound of the electronic device to the microphone module,
wherein the printed circuit board includes a through hole corresponding to the microphone hole.
10. The electronic device of claim 9 , wherein the second microphone pad surrounds the through hole.
11. The electronic device of claim 1 , wherein the electronic device is a wireless communication ear set.
12. The electronic device of claim 1 , wherein a thickness of the second ground wire is smaller than a thickness of the first ground wire.