Radio frequency module and communication device
A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an engraved portion provided on the top surface of the resin member. When the main surface is viewed in plan, the engraved portion does not overlap the first circuit component.
1. A radio frequency module comprising:
a module substrate having a main surface;
a first circuit component on the main surface;
a resin on the main surface and covering a side surface of the first circuit component;
a metal layer in contact with a top surface of the resin and a top surface of the first circuit component; and
an engraved portion on a top surface of the resin,
wherein the engraved portion does not overlap the first circuit component in a plan view of the module substrate.
2. The radio frequency module according to claim 1 ,
comprising a plurality of circuit components on the main surface, the plurality of circuit components comprising the first circuit component,
wherein the engraved portion does not overlap any of the plurality of circuit components on the main surface in the plan view.
3. The radio frequency module according to claim 1 , further comprising a second circuit component that is not in contact with the metal layer,
wherein a top surface of the second circuit component is covered with the resin, and
a distance between the engraved portion and the first circuit component is shorter than a distance between the engraved portion and the second circuit component in the plan view.
4. The radio frequency module according to claim 1 ,
comprising a plurality of circuit components on the main surface, the plurality of circuit components comprising the first circuit component,
wherein, among all of the plurality of circuit components, the first circuit component is closest to the engraved portion in the plan view.
5. The radio frequency module according to claim 1 , further comprising a second circuit component that is not in contact with the metal layer,
wherein a top surface of the second circuit component is covered with the resin, and
wherein a part of the engraved portion overlaps the second circuit component in the plan view.
6. The radio frequency module according to claim 5 , wherein the second circuit component comprises a filter having a pass band in a radio frequency band.
7. The radio frequency module according to claim 1 , wherein the first circuit component comprises a filter having a pass band in a radio frequency band.
8. The radio frequency module according to claim 1 , wherein the first circuit component comprises a power amplifier configured to amplify a transmission signal.
9. The radio frequency module according to claim 1 , wherein the engraved portion is closer to an end of the main surface than to a center of the main surface in the plan view.
10. The radio frequency module according to claim 1 , wherein a top surface of the first circuit component is flush with a top surface of the resin.
11. The radio frequency module according to claim 1 , wherein the engraved portion comprises an engraving of a character, a figure, a symbol, or a two-dimensional code.
12. A communication device comprising:
a radio frequency (RF) signal processing circuit configured to process a radio frequency signal transmitted and received by an antenna; and
the radio frequency module according to claim 1 , configured to pass the radio frequency signal between the antenna and the RF signal processing circuit.