Method of printed circuit board dielectric molding or machining and electrolytic metallization
A method for making a printed circuit board (PCB) with a tridimensional (3D) dielectric substrate having opposite sides and made of fiber-reinforced polymer. Each side comprises channels and pockets formed by molding or machining a dielectric laminate, and the channels and pockets define a layout for conductive traces and pads of the PCB. The channels and pockets in a same side of the 3D dielectric substrate have a uniform depth. Side walls of the channels and pockets have a draft angle in a range of at least about 5 degrees to at least about 15 degrees.
1. A method of manufacturing a printed circuit board (PCB) stator for an axial field rotary energy device, the method comprising:
forming a PCB panel as a tridimensional (3D) dielectric substrate comprising fiber-reinforced polymer with opposite sides;
forming each side with channels and pockets by molding the 3D dielectric substrate, and the channels and pockets define a layout for conductive traces and pads, respectively, of the PCB panel;
forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth that is equal to or greater than 140 μm;
forming side walls of the channels and pockets of the 3D dielectric substrate at a draft angle in a range of about 5 degrees to about 15 degrees;
depositing by electrolytic metallization and forming the conductive traces and pads into the channels and pockets, respectively, of the 3D dielectric substrate; and
making the outer surfaces of the conductive traces and pads flush with respective sides of the 3D dielectric substrate.
2. The method of claim 1 , wherein the channels and pockets of a first side of the sides of the 3D dielectric substrate are formed at a first depth, and the channels and pockets of a second side of the sides of the 3D dielectric substrate are formed at a second depth.
3. The method of claim 2 , wherein the first and second depths are the same or within 25 μm of each other.
4. The method of claim 2 , wherein the first depth differs from the second depth.
5. A method of manufacturing a printed circuit board (PCB) stator for an axial field rotary energy device, the method comprising:
forming a PCB panel as a tridimensional (3D) dielectric substrate comprising fiber-reinforced polymer with opposite sides;
forming each side with channels and pockets by machining the 3D dielectric substrate, and the channels and pockets define a layout for conductive traces and pads, respectively, of the PCB panel;
forming the channels and pockets in a same side of the 3D dielectric substrate at a uniform depth that is equal to or greater than 140 μm;
forming side walls of the channels and pockets of the 3D dielectric substrate at a draft angle in a range of at least about 5 degrees to about 15 degrees;
depositing by electrolytic metallization and forming the conductive traces and pads into the channels and pockets, respectively, of the 3D dielectric substrate; and
making the outer surfaces of the conductive traces and pads flush with respective sides of the 3D dielectric substrate.
6. The method of claim 5 , wherein the channels and pockets of a first side of the sides of the 3D dielectric substrate are formed at a first depth, and the channels and pockets of a second side of the sides of the 3D dielectric substrate are formed at a second depth.
7. The method of claim 6 , wherein the first and second depths are the same or within 25 μm of each other.
8. The method of claim 6 , wherein the first depth differs from the second depth.