Granted Patent B2

US 12,336,147 · App. 17/956,799 · Granted Jun 17, 2025

Inventors: Christopher M. Helberg (Austin, TX); Christopher M. Jaggers (Austin, TX); Robert Edward Radke (Austin, TX); Mustansir M. Pratapgarhwala (Austin, TX); Michael J. Austin (Austin, TX); Sukesh Shenoy (Austin, TX)

Assignee: ADVANCED MICRO DEVICES, INC.

H05K7/20336G06F1/20H01L23/427H01L23/473H05K7/20254H05K7/20327G06F2200/201H01L23/38

Abstract

Claims (23)

1. An apparatus for component cooling, comprising:

a first heat transfer element configured to be thermally coupled to a heat-generating electronic component;

a second heat transfer element;

a plurality of heat pipes thermally coupled between the first heat transfer element and the second heat transfer element, wherein each of the heat pipes provides a separate heat conduction path from the first heat transfer element to the second heat transfer element via a first heat transfer fluid within a respective one of the heat pipes; and

a manifold including a first fluid passage providing a first portion of a second heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the second heat transfer fluid in thermal contact with the second heat transfer element.

2. The apparatus of claim 1 , wherein the heat-generating electronic component comprises a processor, and wherein the first fluid passage and the second fluid passage are separate from each of the plurality of heat pipes.

3. The apparatus of claim 1 , wherein the first heat transfer element includes a first base plate and a second base plate.

4. The apparatus of claim 3 , wherein a portion of the plurality of heat pipes are disposed between the first base plate and the second base plate.

5. The apparatus of claim 1 , further comprising a first thermoelectric cooler thermally coupled to the first heat transfer element.

6. The apparatus of claim 5 , further comprising a first cold plate fluidly coupled to the first fluid passage of the manifold, wherein the first thermoelectric cooler is configured to transfer heat from the first heat transfer element to the first cold plate.

7. The apparatus of claim 1 , wherein the second heat transfer element includes a third base plate and a fourth base plate.

8. The apparatus of claim 7 , wherein a portion of the plurality of heat pipes are disposed between the third base plate and the fourth base plate.

9. The apparatus of claim 1 , further comprising a second thermoelectric cooler thermally coupled to the second heat transfer element.

10. The apparatus of claim 9 , further comprising a second cold plate fluidly coupled to the second fluid passage of the manifold, wherein the second thermoelectric cooler is configured to transfer heat from the second heat transfer element to the second cold plate.

11. An apparatus for component cooling, comprising:

a first heat transfer element configured to be thermally coupled to a heat-generating electronic component;

a second heat transfer element;

a plurality of heat pipes thermally coupled between the first heat transfer element and the second heat transfer element, wherein each of the heat pipes provides a separate heat conduction path from the first heat transfer element to the second heat transfer element via a heat transfer fluid within a respective one of the heat pipes;

a cooling block including a fluid inlet, a fluid outlet, and a fluid passage within the cooling block that allows a heat transfer fluid in thermal contact with the first heat transfer element to flow between the fluid inlet and the fluid outlet; and

a first thermoelectric cooling device positioned between the cooling block and the first heat transfer element, the first thermoelectric cooling device having a first side facing the first heat transfer element and a second side facing the cooling block, wherein the first side is configured to absorb heat from the first heat transfer element and the second side is configured to release the heat to the cooling block.

12. The apparatus of claim 11 , further comprising a cooling fan assembly coupled to the second heat transfer element.

13. The apparatus of claim 11 , wherein the first heat transfer element includes a first base plate and a second base plate, and wherein the first thermoelectric cooling device is positioned between the second base plate and the cooling block.

14. The apparatus of claim 11 further comprising a second thermoelectric cooling device in contact with the second heat transfer element.

Assignments (1)

Continuity (1)

References Cited (62)