IP Library › Granted Patent US 12,339,234
Granted Patent B2
US 12,339,234 · App. 17/755,747 · Granted Jun 24, 2025

Laser analysis device

Inventors: Aya Takeda (Kyoto, JP); Seiji Higuchi (Kyoto, JP)
Assignee: HORIBA, LTD.
G01N21/65G01J3/0291G01J3/44G01J2001/0285G01N2201/022
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Quick Facts
Patent No.
US 12,339,234
App. No.
17/755,747
Granted
Jun 24, 2025
Kind
B2
Abstract

A laser analysis device includes a laser analysis unit that a sample is irradiated with laser light, a cover that covers a periphery of the laser analysis unit, so as to prevent the laser light from being emitted to outside, and has a slit in at least a part of the cover, a fastener configured to open and close the slit, and an interlock mechanism including a key provided on the fastener and a detector that detects a state in which the fastener is fully closed, in which in a state where the detector has detected that the fastener is fully closed, laser light having a predetermined intensity or more is introduced into the laser analysis unit.

Claims (20)

1. A laser analysis device comprising:

a laser analysis unit in which a sample is irradiated with laser light;

a cover that covers a periphery of the laser analysis unit so as to prevent the laser light from being emitted to outside, and has a slit in at least a part of the cover, wherein the cover is a black shielding cloth having flexibility;

a fastener comprising a slider configured to open and close the slit by moving the slider along a direction in which the slit extends; and

an interlock mechanism including a detector that detects a state in which the fastener is fully closed, wherein

in a state where the detector has detected that the fastener is fully closed, laser light having a predetermined intensity or more is introduced into the laser analysis unit.

2. The laser analysis device according to claim 1 , wherein

the laser analysis unit is placed on a surface plate, and

the detector is placed on the surface plate as a separate body from the laser analysis unit.

3. The laser analysis device according to claim 1 , wherein

the cover has the slit extending in an up-down direction at a plurality of locations, and

the slit is respectively provided with the fastener.

4. The laser analysis device according to claim 1 , wherein the laser analysis unit includes at least one opening that communicates with outside from a point where a sample is irradiated with laser light.

5. The laser analysis device according to claim 1 , wherein the fastener includes elements that mesh with one another by a movement of the slider toward a fully closed position to close the slit.

6. The laser analysis device according to claim 1 , wherein the detector of the interlock mechanism detects a state of the slider to determine when the fastener is fully closed.

7. A laser analysis device comprising:

a laser analysis unit that a sample is irradiated with laser light;

a cover that has flexibility, covers a periphery of the laser analysis unit near the laser analysis unit so as to prevent the laser light from being emitted to outside, and has a slit in at least a part of the laser analysis unit, wherein the cover is a black shielding cloth having flexibility; and

a fastener comprising a slider configured to open and close the slit by moving the slider along a direction in which the slit extends.

8. The laser analysis device according to claim 7 , wherein the laser analysis unit further includes a probe disposed to be in contact with or in proximity to the sample.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL: 059864 FRAME: 0952. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . Recorded Jun 19, 2022
From: TAKEDA, AYA; HIGUCHI, SEIJI
To: HORIBA, LTD.
Reel/Frame 060509/0682 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2022
From: TAKEDA, AYA; HIGUCHI, SEIJI
To: HORIBA, LTD.
Reel/Frame 059864/0952 →
Priority Claims (1)
JP 2019-202915 · Nov 8, 2019 · national
Continuity (1)
Related Publication 20220390373A1 · Dec 8, 2022
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