Assembly for an eye tracking system and a corresponding head-mounted device utilizing the same
The invention is related to an assembly for an eye-tracking system, the assembly comprising a substantially ring-shaped carrier, a seat in the carrier, a plurality of light emitting devices disposed on a substrate, wherein the substrate is positioned against the seat, an alignment window comprising an opening extending through the carrier, an imaging device provided within and supported by the alignment window, wherein the imaging device is facing inwardly, and wherein the carrier is configured to guide light emitted from the plurality of light emitting devices towards an eye of a user when the assembly is used with the eye tracking system. The invention also relates to a corresponding head-mounted device utilizing the assembly.
1. An assembly for an eye-tracking system, the assembly comprising:
a substantially ring-shaped carrier;
a seat in the carrier;
a plurality of light emitting devices disposed on a substrate, wherein the substrate is positioned against the seat;
an alignment window comprising an opening extending through the carrier;
an imaging device provided within and supported by the alignment window, wherein the imaging device is facing inwardly; and
wherein the carrier is configured to guide light emitted from the plurality of light emitting devices towards an eye of a user when the assembly is used with the eye tracking system.
2. The assembly according to claim 1 , wherein the substantially ring-shaped carrier has the shape with a varying local radius of curvature.
3. The assembly according to claim 1 , wherein the light emitting devices are light emitting diodes, LEDs.
4. The assembly according to claim 1 , wherein the light emitting devices are disposed on a printed circuit board, PCB.
5. The assembly according to claim 4 , wherein the substrate is a strip of the PCB.
6. The assembly according to claim 4 , wherein the substrate, on which the plurality of light emitting devices are disposed, comprises at least a top and a bottom adhesive layer sandwiching the PCB.
7. The assembly according to claim 1 , wherein the carrier is made of a near infra-red, NIR transparent material.
8. The assembly according to claim 1 , wherein the assembly further comprises a cover adjacent to the imaging device.
9. The assembly according to claim 1 , wherein the assembly further comprises an optical filter adjacent to the imaging device such that the imaging device is arranged behind the optical filter.
10. The assembly according to claim 1 further comprising a lens mounted in the carrier.
11. A head-mounted device, HMD, for extended reality, XR, applications, the device comprising at least one assembly according to claim 10 , and a head-mounted display.