Semiconductor structure and method for fabricating same
Embodiments relate to the field of semiconductors, and provide a semiconductor structure and a method for fabricating the same. The semiconductor structure includes a first wafer and a second wafer. A surface of the first wafer has a first electrode plate, a first dielectric layer and a first dummy pad stacked in sequence to constitute a capacitor; and the surface of the first wafer further has a first functional pad, and the first functional pad and the first dummy pad are arranged on a same layer. The second wafer is bonded to the first wafer, and a surface of the second wafer has a second dummy pad and a second functional pad arranged on a same layer. The first dummy pad is bonded to the second dummy pad, and the first functional pad is bonded to the second functional pad.
1. A semiconductor structure, comprising:
a first wafer, a surface of the first wafer having a first electrode plate, a first dielectric layer and a first dummy pad stacked in sequence to constitute a capacitor; and the surface of the first wafer further having a first functional pad, and the first functional pad and the first dummy pad being arranged on a same layer; and
a second wafer bonded to the first wafer, a surface of the second wafer having a second dummy pad and a second functional pad arranged on a same layer; the first dummy pad being bonded to the second dummy pad, and the first functional pad being bonded to the second functional pad.
2. The semiconductor structure according to claim 1 , wherein the first wafer is internally provided with a first wiring layer, a first conductive plug and a second conductive plug, the first conductive plug being positioned between the first electrode plate and the first wiring layer and being connected to the first electrode plate and the first wiring layer, and the second conductive plug being positioned between the first wiring layer and the first functional pad and being connected to the first wiring layer and the first functional pad; and
wherein the second wafer is internally provided with a second wiring layer, a third conductive plug and a fourth conductive plug, the third conductive plug being positioned between the second wiring layer and the second dummy pad and being connected to the second wiring layer and the second dummy pad, and the fourth conductive plug being positioned between the second wiring layer and the second functional pad and being connected to the second wiring layer and the second functional pad.
3. The semiconductor structure according to claim 2 , wherein the semiconductor structure comprises at least one capacitor bank, the same capacitor bank comprising a plurality of capacitors in parallel.
4. The semiconductor structure according to claim 3 , wherein there are a plurality of first electrode plates and a plurality of first dummy pads, and the plurality of first electrode plates are arranged in one-to-one correspondence to the plurality of first dummy pads.
5. The semiconductor structure according to claim 3 , wherein there is one first electrode plate and a plurality of first dummy pads, and the plurality of first dummy pads are arranged opposite to the one first electrode plate.
6. The semiconductor structure according to claim 3 , wherein the plurality of first dummy pads of the plurality of capacitors in the same capacitor bank surround one or more of the first functional pads; and the plurality of second dummy pads of the plurality of capacitors in the same capacitor bank surround one or more of the second functional pads.
7. The semiconductor structure according to claim 3 , wherein there are a plurality of capacitor banks, and the plurality of capacitors in the same capacitor bank are arranged in a same direction.
8. The semiconductor structure according to claim 7 , wherein the plurality of capacitor banks are arranged in parallel, and the first functional pad and the second functional pad are both positioned between adjacent two of the plurality of capacitor banks.
9. The semiconductor structure according to claim 1 , wherein an area of the first electrode plate is greater than or equal to an area of the first dummy pad.
10. The semiconductor structure according to claim 1 , wherein an area of the first dummy pad is greater than or equal to an area of the second dummy pad.
11. The semiconductor structure according to claim 1 , wherein an area of the first dummy pad is equal to an area of the first functional pad, and an area of the second dummy pad is equal to an area of the second functional pad.
12. The semiconductor structure according to claim 11 , wherein the area of the first dummy pad is 0.01 um 2 to 100 um 2 , the area of the second dummy pad being 0.01 um 2 to 100 um 2 , the area of the first functional pad being 0.01 um 2 to 100 um 2 , and the area of the second functional pad being 0.01 um 2 to 100 um 2 .
13. The semiconductor structure according to claim 1 , wherein the surface of the second wafer further has a second electrode plate, a second dielectric layer and a second connection layer; the second electrode plate, the second dielectric layer and the second dummy pad are sequentially stacked on the surface of the second wafer; and the second connection layer is connected to the second electrode plate and is spaced apart from the second dummy pad;
the surface of the first wafer further has a first connection layer, the first connection layer being further connected to the first electrode plate and being spaced apart from the first dummy pad; and
the first connection layer is connected to the second connection layer, both the first connection layer and the second connection layer extending in a direction perpendicular to an upper surface of the first wafer.
14. A method for fabricating a semiconductor structure, comprising:
providing a first wafer;
forming, on a surface of the first wafer, a first electrode plate, a first dielectric layer and a first dummy pad stacked in sequence to constitute a capacitor; and forming a first functional pad on the surface of the first wafer, the first functional pad and the first dummy pad being arranged on a same layer;
providing a second wafer;
forming, on a surface of the second wafer, a second dummy pad and a second functional pad arranged on a same layer; and
bonding the first dummy pad to the second dummy pad, and bonding the first functional pad to the second functional pad, such that the first wafer is bonded to the second wafer.
15. The method for fabricating the semiconductor structure according to claim 14 , wherein before forming the first electrode plate, the method further comprises:
forming a first wiring layer in the first wafer;
forming, in the first wafer, a first conductive plug and a second conductive plug connected to the first wiring layer;
forming the capacitor comprises:
removing the first wafer by a part of thickness to form a groove in the first wafer, the groove being positioned directly above the first conductive plug;
forming a first electrode plate in the groove, the first electrode plate being connected to the first conductive plug;
forming a first dielectric layer in the groove, the first dielectric layer further covering the first electrode plate;
forming a first surface dielectric layer on the surface of the first wafer; and
forming a first dummy pad and a first functional pad in the first surface dielectric layer, the first dummy pad being positioned directly above the first electrode plate, and the first functional pad being connected to the second conductive plug.