Unscanned optical inspection system using a micro camera array
An arrangement of one or more micro cameras are used in conjunction with computer controlled illumination to create a high-throughput microscope able to operate without the need of expensive scanning stages. A single unit contains a plurality of sensors, lenses tiled in such a way to cover a significant fraction of the desired field of view in a digital single acquisition. Mechanical stages and patterned illumination can then be used in conjunction with the system to enhanced the imaged depth of field, or create an acquisition stack to enhance the information acquired. Multiple units can be combined to obtain images of a single sample from different angles. The absence of mechanical stages makes the imaging system ideal for use in scenarios that require the sample to be in a climate and/or environmentally controlled chamber.
1. An inspection system comprising
a digital camera subsystem,
wherein the digital camera subsystem comprises an array of multiple micro-cameras mounted on a printed circuit board,
wherein each micro-camera comprises a digital image sensor and a lens system that is configured to image a fraction of an item at an image resolution of 20 micrometers or smaller, and
wherein the digital camera subsystem is configured to detect optical radiation over a field-of-view of 100 mm or more in a diagonal dimension in a single snapshot,
wherein the printed circuit board comprises a steering device coupled to a sensor of at least a micro-camera of the multiple micro-cameras, with the steering device configured to move the sensor axially to change a plane of focus of the at least a micro-camera;
a control subsystem configured to control an image data acquisition process by the digital camera subsystem.
2. The system of claim 1 , further comprising
a frame configured for supporting the item,
wherein the frame comprises actuators,
wherein the actuators are configured to move the item relative to the digital camera subsystem.
3. The system of claim 1 ,
wherein the printed circuit board comprises an actuator coupled to at least a second micro-camera of the multiple micro-cameras, with the actuator configured to change the field of view of the at least a second micro-camera.
4. The system of claim 1 ,
wherein at least a third micro-camera of the multiple micro-cameras comprises a focusable optical element, with the focusable optical element electrically tunable to change a plane of focus of the at least a third micro-camera.
5. The system in claim 1 ,
wherein the printed circuit board is coupled to a linking plate configured to steer and align the multiple micro-cameras as a whole unit.
6. The system in claim 1 ,
wherein at least a micro-camera within the digital camera subsystem contains a refocusing mechanism.
7. The system in claim 1 ,
wherein the digital camera subsystem comprises multiple arrays of multiple micro-cameras,
wherein the multiple arrays are disposed above, below, from sides, or at different angles from the sides of the item.
8. The system in claim 1 ,
wherein the digital camera subsystem comprises an illumination unit,
wherein the illumination unit is coupled to the printed circuit board to be an integrated part of the digital camera subsystem.
9. The system in claim 1 ,
wherein the inspection system comprises an illumination unit,
wherein the illumination unit is remote from the digital camera subsystem,
wherein the illumination unit is distributed or complementary to an integrated illumination unit coupled to the digital camera subsystem.
10. The system in claim 1
wherein the inspection system comprises an illumination unit,
wherein illumination of the illumination unit is configured to change between image acquisitions of the digital camera subsystem.
11. The system in claim 1 ,
wherein the digital camera subsystem is mounted on a motion apparatus,
wherein the motion apparatus is configured to move the digital camera subsystem to multiple viewing angles to capture images above and from opposite sides of the inspected item.
12. The system in claim 1 , further comprising
am image analysis subsystem comprising one or more computational processors to process the images acquired from the multiple digital image sensors to extract relevant features comprising defects, or to detect a sample depth map, or to optimize detected image information for a particular viewing purpose either by a human operator or another computer algorithm.
13. The system in claim 1 ,
wherein the inspection system is located inside an Equipment Front End Module (EFEM),
wherein the inspection system is configured to inspect wafers supported by a robotic arm inside the EFEM during a transfer between a Front Opening Unit Pod (FOUP) and a process chamber, with the FOUP and the process chamber coupled to the EFEM.
14. The system of claim 1 , further comprising
a manually or digitally actuated positioner coupled to the printed circuit board to position or align the micro-camera array as a whole unit.
15. The system of claim 1 ,
wherein the printed circuit board comprises an actuator coupled to at least a second micro-camera of the multiple micro-cameras, with the actuator configured to change the field of view of the at least a second micro-camera,
wherein the printed circuit board is coupled to a linking plate configured to steer and align the multiple micro-cameras as a whole unit.
16. An inspection system comprising
a digital camera subsystem,
wherein the digital camera subsystem comprises an array of multiple micro-cameras mounted on a printed circuit board,
wherein each micro-camera comprises a digital image sensor and a lens system that is configured to image a fraction of an item at an image resolution of 20 micrometers or smaller, and
wherein the digital camera subsystem is configured to detect optical radiation over a field-of-view of 100 mm or more in a diagonal dimension in a single snapshot;
wherein the printed circuit board comprises an actuator coupled to at least a micro-camera of the multiple micro-cameras, with the actuator configured to change the field of view of the at least a micro-camera;
a control subsystem configured to control an image data acquisition process by the digital camera subsystem,
wherein the printed circuit board comprises a steering device coupled to a sensor of at least a second micro-camera of the multiple micro-cameras, with the steering device configured to move the sensor axially to change a plane of focus of the at least a second micro-camera,
wherein at least a third micro-camera of the multiple micro-cameras comprises a focusable optical element, with the focusable optical element electrically tunable to change a plane of focus of the at least a third micro-camera,
wherein the printed circuit board is coupled to a linking plate configured to steer and align the multiple micro-cameras as a whole unit.
17. An inspection system comprising
a digital camera subsystem,
wherein the digital camera subsystem comprises an array of multiple micro-cameras mounted on a printed circuit board,
wherein each micro-camera comprises a digital image sensor and a lens system that is configured to image a fraction of an item at an image resolution of 20 micrometers or smaller, and
wherein the digital camera subsystem is configured to detect optical radiation over a field-of-view of 100 mm or more in a diagonal dimension in a single snapshot,
wherein at least a micro-camera of the multiple micro-cameras comprises a focusable optical element, with the focusable optical element electrically tunable to change a plane of focus of the at least a micro-camera,
wherein the printed circuit board comprises an actuator coupled to at least a third micro-camera of the multiple micro-cameras, with the actuator configured to change the field of view of the at least a third micro-camera,
wherein the printed circuit board is coupled to a linking plate configured to steer and align the multiple micro-cameras as a whole unit.