Gradient encapsulation of waveguide gratings
Gradient encapsulation of waveguide outcoupler gratings for control of diffraction efficiency and directionality includes a first grating formed over a substrate, the first grating having a plurality of first structures extending away from the substrate, the first grating corresponding to an outcoupler. The device includes a first encapsulant disposed in one or more gaps formed between adjacent first structures, where a fill ratio of the first encapsulant decreases along the first grating. Also described herein are methods for fabricating the device.
1. A device comprising:
a first grating formed on a surface of a substrate, the first grating having a plurality of first structures slanted in a first direction at a slant angle relative to normal to the surface of the substrate, the first grating corresponding to an outcoupler; and
a first encapsulant disposed in one or more gaps formed between adjacent first structures, wherein a fill ratio of the first encapsulant decreases from 1 to 0 along the first grating in the first direction.
2. The device of claim 1 , wherein the first encapsulant has a refractive index contrast of about 0.2 or less relative to the first grating.
3. The device of claim 1 , wherein the first encapsulant has a refractive index of from about 1.8 to about 2.2.
4. The device of claim 1 , wherein the first encapsulant includes one or more of polyimides, polyimide blends, or metal-organic polyimide blends.
5. The device of claim 1 , wherein the fill ratio decreases linearly.
6. The device of claim 1 , wherein the fill ratio decreases stepwise.
7. The device of claim 1 , wherein the fill ratio decreases non-linearly.
8. The device of claim 1 , further comprising a second grating formed over the substrate, the second grating having a plurality of second structures extending away from the substrate, the second grating corresponding to an incoupler.
9. A device comprising:
a first grating formed on a first surface of a substrate, the first grating having a plurality of first structures slanted in a first direction at a first slant angle relative to normal to the first surface of the substrate, the first grating corresponding to an outcoupler;
a first encapsulant disposed in one or more first gaps formed between adjacent first structures, wherein a fill ratio of the first encapsulant decreases from 1 to 0 along the first grating in the first direction; and
a second grating formed on a second surface of the substrate, the second grating having a plurality of second structures slanted in a second direction at a second slant angle relative to normal to the second surface of the substrate, the second grating corresponding to an incoupler.
10. The device of claim 9 , wherein the first encapsulant is disposed in one or more second gaps formed between adjacent second structures.
11. The device of claim 9 , wherein the first surface and the second surface are each a frontside of the substrate.
12. The device of claim 9 , wherein the first surface is a frontside of the substrate, and the second surface is a backside of the substrate facing opposite the frontside.
13. The device of claim 12 , further comprising a second encapsulant disposed over the backside of the substrate, wherein the second encapsulant is disposed in one or more second gaps formed between adjacent second structures.
14. A method, comprising:
forming a first grating on a first surface of a substrate, the first grating having a plurality of first structures slanted in a first direction at a first slant angle relative to normal to the first surface of the substrate, the first grating corresponding to an outcoupler;
forming a second grating on a second surface of the substrate, the second grating having a plurality of second structures slanted in a second direction at a second slant angle relative to normal to the second surface of the substrate, the second grating corresponding to an incoupler;
depositing a first encapsulant over the first and second gratings;
curing the first encapsulant;
forming a patterned photoresist layer over the first and second gratings;
etching the first encapsulant via the patterned photoresist layer, wherein a fill ratio of the first encapsulant decreases from 1 to 0 along the first grating in the first direction; and
depositing a global encapsulant over the first and second gratings.
15. The method of claim 14 , further comprising:
depositing a first hardmask layer over the cured first encapsulant; and
forming a patterned second hardmask layer over the first hardmask layer.
16. The method of claim 15 , further comprising:
removing the first hardmask layer over the first grating; and
etching the first encapsulant over the first grating using one of the patterned second hardmask layer or the first hardmask layer as an etch mask.
17. The method of claim 14 , wherein forming the patterned photoresist layer comprises performing a gray-scale lithography process.
18. The method of claim 14 , wherein etching the first encapsulant via the patterned photoresist layer comprises transferring a profile of the patterned photoresist layer to the first encapsulant.
19. The method of claim 14 , wherein the first grating is formed on a frontside of the substrate, wherein the first encapsulant is deposited on the frontside, and wherein the second grating is formed on a backside of the substrate facing opposite the frontside, further comprising depositing a second encapsulant on the backside.