Granted Patent B2

US 12,354,625 · App. 18/434,091 · Granted Jul 8, 2025

Inventors: Taichi Okano (Yokohama Kanagawa, JP); Kiyokazu Ishizaki (Tokyo, JP); Nobuhiro Yamamoto (Yokohama Kanagawa, JP); Kota Tokuda (Fujisawa Kanagawa, JP); Hayato Yamaguchi (Yokohama Kanagawa, JP)

Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation

G11B33/122G06F3/0676G11B5/54H05K1/118G11B33/022G11B2220/2516

Abstract

Claims (81)

1. A disk device comprising:

a magnetic disk;

a magnetic head configured to read and write information from and to the magnetic disk;

a flexible printed circuit board electrically connected to the magnetic head;

an electronic component mounted on the flexible printed circuit board; and

a first plate having rigidity higher than the flexible printed circuit board and attached to the flexible printed circuit board, wherein

the flexible printed circuit board with a first through hole comprises

a first surface facing the electronic component with a space, and

a second surface opposite the first surface and facing the first plate, the first through hole being open to the first surface and the second surface to communicate with the space, and

the first plate is provided with a second through hole penetrating the first plate, wherein

the flexible printed circuit board comprises a first layer having the first surface, a second layer covering the first surface, and a first pad on the first surface,

the electronic component comprises a case and a wiring comprised in the case, and

the second layer is provided with a hole exposing the first surface and the first pad and an inner surface of the hole, and

the wiring comprises a bonded part bonded to the first pad through a solder, and a first lead located between the bonded part and the case.

2. The disk device according to claim 1 , wherein

in a direction along the first surface, the first lead is apart from the bonded part in a first direction, the first direction being a direction along the first surface,

in a direction orthogonal to the first surface, the first lead is farther away from the first surface, and

the inner surface is apart from a first end of the first pad, the first end being an end of the first pad in the first direction.

3. The disk device according to claim 2 , wherein

the wiring comprises an intermediate part between the bonded part and the first lead, the intermediate part extending diagonally with respect to the first surface, and

the inner surface is apart from an end of the intermediate part, the end of the intermediate part being an end of the intermediate part in the first direction.

4. The disk device according to claim 2 , wherein

at least a part of an end of the inner surface is located between the first surface and the case, the end of the inner surface being an end of the inner surface in the first direction.

5. The disk device according to claim 2 , wherein

a second end of the first pad is covered with the second layer, the second end being an end of the first pad in a second direction opposite to the first direction.

6. A disk device comprising:

a magnetic disk;

a magnetic head configured to read and write information from and to the magnetic disk;

a flexible printed circuit board with an exposure hole, electrically connected to the magnetic head, the flexible printed circuit board including a first layer, a first pad on a surface of the first layer, and a second layer covering the surface, the exposure hole penetrating the second layer to expose the surface and the first pad; and

an electronic component mounted on the flexible printed circuit board and including a case which is provided with a wiring, wherein

the wiring comprises a bonded part bonded to the first pad through a solder, and a first lead located between the bonded part and the case,

in a direction along the surface, the first lead is apart from the bonded part in a first direction, the first direction being a direction along the surface,

in a direction orthogonal to the surface, the first lead is farther away from the surface than the bonded part, and

an inner surface of the exposure hole is apart from a first end of the first pad, the first end being an end of the first pad in the first direction.

7. The disk device according to claim 6 , wherein

the wiring comprises an intermediate part between the bonded part and the first lead, the intermediate part extending diagonally with respect to the surface, and

the inner surface is apart from an end of the intermediate part, the end of the intermediate part being an end of the intermediate part in the first direction.

8. The disk device according to claim 6 , wherein

at least a part of an end of the inner surface is located between the surface and the case, the end of the inner surface being an end of the inner surface in the first direction.

9. The disk device according to claim 6 , wherein

a second end of the first pad is covered with the second layer, the second end being an end of the first pad in a second direction opposite to the first direction.

10. A disk device comprising:

a magnetic disk;

a magnetic head configured to read and write information from and to the magnetic disk;

a flexible printed circuit board comprising a first pad, the flexible printed circuit board being electrically connected to the magnetic head;

an electronic component mounted on the flexible printed circuit board; and

a first plate having rigidity higher than the flexible printed circuit board and attached to the flexible printed circuit board, wherein

the electronic component comprises a case and a wiring comprised in the case, the wiring bonded to the first pad through a solder,

the flexible printed circuit board with a first through hole comprises

a first surface facing the electronic component with a space, the space that lies between the first surface and the case,

a second surface opposite the first surface and facing the first plate,

a first layer having the first surface, and

a second layer covering the first surface and located apart from the case,

the first through hole being open to the first surface and the second surface to communicate with the space, and

the first plate is provided with a second through hole penetrating the first plate to communicate with the first through hole.

11. The disk device according to claim 10 , wherein

the second layer comprises a third surface surrounding the electronic component.

12. The disk device according to claim 11 , wherein

the second layer is provided with a third through hole that penetrates the second layer and exposes the first surface and the first through hole,

the third through hole is open to the third surface, and

the second layer comprises an inner surface of the third through hole extending between the first surface and the third surface.

13. The disk device according to claim 12 , wherein

in a direction along the first surface, an edge of the third surface connected to the inner surface is apart from the case.

14. The disk device according to claim 12 , wherein

the inner surface has a first edge connected to the first surface and a second edge connected to the third surface, the second edge being larger than the first edge, and

at least a part of the inner surface extends diagonally with respect to the first surface between the first edge and the second edge.

15. The disk device according to claim 10 , wherein

the flexible printed circuit board comprises a third layer having a conductive property and located between the first layer and the second layer, the third layer comprising a second pad,

the second layer is provided with a third through hole penetrating the second layer, the third through hole comprising:

an exposure part that exposes the first surface, the first through hole, and the second pad, and

an extending part that is apart from the third layer, extends from the exposure part, and exposes the first surface, and

in a direction along the first surface, at least a part of the extending part is apart from the case.

16. The disk device according to claim 10 , wherein

the flexible printed circuit board comprises a mounting surface and a second pad,

the mounting surface comprises

a first region, and

a second region comprising the first surface, recessed from the first region, and on which the second pad is provided, and

in a direction along the first region, an edge of the first region connected to the second region is apart from the case.

17. The disk device according to claim 10 , wherein

the first through hole comprises three through holes, each being open to the first surface and the second surface to communicate with the space, and

the three through holes are arranged in a third direction along the first surface.

Priority Claims (2)

Continuity (2)

References Cited (36)