IP Library Granted Patent US 12,354,802
Granted Patent B2
US 12,354,802 · App. 18/428,594 · Granted Jul 8, 2025

Multilayer ceramic capacitor and method of manufacturing the same

Inventors: Eun Jung Lee (Suwon-si, KR); Jong Ho Lee (Suwon-si, KR); Sim Chung Kang (Suwon-si, KR); Ki Pyo Hong (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/1227H01G4/012H01G4/248H01G4/30
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Quick Facts
Patent No.
US 12,354,802
App. No.
18/428,594
Granted
Jul 8, 2025
Kind
B2
Abstract

A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.

Claims (21)

1. A multilayer ceramic capacitor, comprising:

a ceramic body comprising a dielectric layer, and a first surface and a second surface opposing each other, a third surface and a fourth surface connecting the first and second surfaces and opposing each other, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other, and also including a plurality of internal electrodes disposed in the ceramic body, exposed on the first and second surfaces and each having one end exposed through the third surface or the fourth surface; and

a first side margin portion and a second side margin portion arranged on the first and second surfaces of the ceramic body, respectively,

wherein the ceramic body comprises an active portion in which the plurality of internal electrodes are arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost internal electrode and below a lowermost internal electrode of the active portion, and

the first and second side margin portions comprise tin, and a content of the tin included in the first and second side margin portions is different from a content of tin included in the cover portions.

2. The multilayer ceramic capacitor of claim 1 , wherein the content of tin included in the first and second side margin portions is 0.1 mol to 3.0 mol, based on 100 mol of barium titanate in the first and second side margin portions.

3. The multilayer ceramic capacitor of claim 1 , wherein the content of tin included in the first and second side margin portions is 0.25 mol to 3.0 mol, based on 100 mol of barium titanate in the first and second side margin portions.

4. The multilayer ceramic capacitor of claim 3 , wherein an average size of dielectric grains included in the first and second side margins is smaller than that included in the dielectric layer of the active portion.

5. The multilayer ceramic capacitor of claim 3 , wherein an average size of dielectric grains included in the first and second side margin portions is 90 nm to 410 nm.

6. The multilayer ceramic capacitor of claim 1 , wherein the content of tin included in the cover portions is less than 0.1 mol, based on 100 mol of barium titanate in the cover portions.

7. The multilayer ceramic capacitor of claim 1 , wherein an average size of dielectric grains included in the first and second side margin portions is smaller than an average size of dielectric grains included in the dielectric layer of the active portion.

8. The multilayer ceramic capacitor of claim 7 , wherein the average size of the dielectric grains included in the first and second side margin portions is 90 nm to 700 nm.

9. The multilayer ceramic capacitor of claim 7 , wherein the average size of the dielectric grains included in the side first and second margin portions is 100 nm to 410 nm.

10. The multilayer ceramic capacitor of claim 1 , wherein a thickness of the dielectric layer between each pair of adjacent internal electrodes of the plurality of internal electrodes is 0.4 μm or less, and a thickness of the internal electrodes is 0.4 μm or less.

11. The multilayer ceramic capacitor of claim 1 , wherein a length of the ceramic body is 400 μm to 1400 μm.

12. The multilayer ceramic capacitor of claim 1 , wherein the internal electrodes are laminated in 400 layers or more.

13. The multilayer ceramic capacitor of claim 1 , wherein each of the cover portions has a thickness of 20 μm or less.

14. The multilayer ceramic capacitor of claim 1 , wherein a thickness of the dielectric layer between each pair of adjacent internal electrodes of the plurality of internal electrodes is 0.4 μm or less.

15. The multilayer ceramic capacitor of claim 1 , wherein the cover portions do not include Sn.

16. The multilayer ceramic capacitor of claim 15 , wherein an average thickness of each of the first and second side margin portions is 2 μm to 15 μm.

17. The multilayer ceramic capacitor of claim 1 , wherein an average thickness of each of the first and second side margin portions is 2 μm to 15 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2024
From: LEE, EUN JUNG; LEE, JONG HO; KANG, SIM CHUNG; HONG, KI PYO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 066319/0904 →
Priority Claims (1)
KR 10-2019-0112304 · Sep 10, 2019 · national
Continuity (4)
Continuation 18139007 · Apr 25, 2023
Continuation 17586322 · Jan 27, 2022
Continuation 16824903 · Mar 20, 2020
Related Publication 20240170215A1 · May 23, 2024
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