Package and method of fabricating the same
Packages and methods of fabricating the same are provided. The package includes a first die, wherein the first die includes a plurality of through vias from a first surface of the first die toward a second surface of the first die; a second die disposed below the first die, wherein the second surface of the first die is bonded to the second die; an isolation layer disposed in the first die, wherein the plurality of through vias extend through the isolation layer; an encapsulation laterally surrounding the first die, wherein the encapsulation is laterally separated from the isolation layer; a buffer layer disposed over the first die, the isolation layer, and the encapsulation; and a plurality of conductive terminals disposed over the isolation layer, wherein the plurality of conductive terminals is electrically connected to corresponding ones of the plurality of through vias.
1. A package, comprising:
a first die, wherein the first die comprises a plurality of through vias extending from a first surface of the first die toward a second surface of the first die;
a second die disposed below the first die, wherein the second surface of the first die is bonded to the second die;
an isolation layer disposed in the first surface of the first die, wherein the plurality of through vias extend through the isolation layer, wherein the isolation layer is a dielectric material;
an encapsulation laterally surrounding the first die, wherein the encapsulation is laterally spaced apart from the isolation layer;
a buffer layer disposed over the first die, the isolation layer, and the encapsulation; and
a plurality of conductive terminals disposed over the buffer layer, wherein the plurality of conductive terminals is electrically connected to corresponding ones of the plurality of through vias.
2. The package of claim 1 , wherein the isolation layer comprises a bulk layer surrounding the plurality of through vias in the first die.
3. The package of claim 1 , wherein the isolation layer comprises a plurality of isolation parts, wherein each isolation part of the plurality of isolation parts surrounds at least one through via of the plurality of through vias.
4. The package of claim 3 , wherein each isolation part of the plurality of isolation parts surrounds a same number of the plurality of through vias.
5. The package of claim 3 , wherein the plurality of isolation parts comprises a first isolation part and a second isolation part, wherein the first isolation part surrounds a first number of through vias of the plurality of through vias, wherein the second isolation part surrounds a second number of through vias of the plurality of through vias, wherein the first number is different than the second number.
6. The package of claim 3 , wherein each isolation part of the plurality of isolation parts has a same width.
7. The package of claim 3 , wherein the plurality of isolation parts comprises a first isolation part and a second isolation part, wherein the first isolation part has a first width, wherein the second isolation part has a second width, wherein the first width is different than the second width.
8. The package of claim 3 , wherein the isolation layer comprises a dummy isolation part separated from the plurality of isolation parts, the dummy isolation part being disposed between adjacent ones of the plurality of isolation parts, and wherein no through via of the plurality of through vias penetrate the dummy isolation part.
9. The package of claim 3 , wherein the isolation layer comprises a dummy isolation part separate from the plurality of isolation parts, the dummy isolation part being disposed between a first isolation part of the plurality of isolation parts and the encapsulation, wherein the first isolation part is an isolation part closest to an edge of the first die, and wherein no through via of the plurality of through vias penetrate the dummy isolation part.
10. A package, comprising:
a first die, wherein the first die comprises a first substrate, the first die further comprising a first through via and a second through via extending from a top surface of the first substrate toward a bottom surface of the first die;
an isolation layer disposed in a recess in the top surface of the first die, the recess being in the first substrate, the isolation layer surrounding the first through via and the second through via, wherein the first substrate surrounds the isolation layer in a top view; and
a first encapsulation laterally surrounding the first die, wherein the first substrate laterally separates the isolation layer from the first encapsulation.
11. The package of claim 10 , wherein the top surface of the first substrate is level with a top surface of the first encapsulation and a top surface of the isolation layer.
12. The package of claim 11 , further comprising a buffer layer disposed over the first encapsulation, the first die, and the isolation layer, wherein a bottom surface of the buffer layer is in contact with the top surfaces of the first encapsulation, the first die, and the isolation layer.
13. The package of claim 12 , further comprising a dummy terminal over the buffer layer, wherein the isolation layer extends below the dummy terminal.
14. The package of claim 12 , further comprising a dummy terminal over the buffer layer, wherein the isolation layer does not extend below the dummy terminal.
15. The package of claim 10 , wherein the isolation layer comprises multiple layers.
16. A package, comprising:
a first die comprising a first substrate, a first interconnect structure on the first substrate, and a first through via in the first substrate;
a second substrate attached to the first die, wherein the first interconnect structure is between the first substrate and the second substrate;
an encapsulation over the second substrate, wherein the encapsulation extends along sidewalls of the first die;
a first isolation structure in a first recess in the first substrate, wherein the first substrate separates the first isolation structure from the encapsulation, wherein the first substrate is between the first isolation structure and the first interconnect structure;
a buffer layer on the encapsulation and the first isolation structure; and
a conductive terminal on the buffer layer, wherein the conductive terminal is electrically connected to the first through via.
17. The package of claim 16 , wherein the first isolation structure comprises:
a first isolation sub-layer adjacent the first substrate and along a sidewall of the first through via; and
a second isolation sub-layer over the first isolation sub-layer in the first recess.
18. The package of claim 16 , further comprising:
a first redistribution structure over the buffer layer and the conductive terminal; and
a conductive connector on the first redistribution structure, wherein the conductive connector is electrically connected to the first through via through the first redistribution structure.
19. The package of claim 16 , wherein a first surface of the first die, a surface of the first isolation structure, and a surface of the encapsulation are level.
20. The package of claim 16 , wherein the first die comprises a second through via in the first substrate, further comprising:
a second isolation structure in a second recess in the first substrate, wherein the first substrate is between the second isolation structure and the encapsulation, wherein the first isolation structure is spaced apart from the second isolation structure.