IP Library Granted Patent US 12,356,715
Granted Patent B2
US 12,356,715 · App. 18/433,751 · Granted Jul 8, 2025

Display panel

Inventors: Jeongho Lee (Yongin-si, KR); Swaehyun Kim (Yongin-si, KR); Hun Kim (Yongin-si, KR); Youhan Moon (Yongin-si, KR)
Assignee: SAMSUNG DISPLAY CO., LTD.
H10D86/423H10D30/6755H10D86/441H10D86/60H10K50/844H10K59/1213H10K59/8731H10K59/131H10K59/88
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Quick Facts
Patent No.
US 12,356,715
App. No.
18/433,751
Granted
Jul 8, 2025
Kind
B2
Abstract

A display panel includes: a substrate defining an opening therein; a plurality of light-emitting diodes in a display area surrounding the opening; an encapsulation layer on the plurality of light-emitting diodes, the encapsulation layer including at least one inorganic encapsulation layer and at least one organic encapsulation layer; a first partition wall and a second partition wall in a non-display area between the opening and the display area in a direction from the display area to the opening; and a plurality of grooves defined above the at least one inorganic insulating layer in the non-display area. The at least one inorganic insulating layer is on the substrate. At least one of the plurality of grooves is defined between the first partition wall and the second partition wall and is covered with the organic encapsulation layer.

Claims (82)

1. A display panel comprising:

a substrate having an opening defined therein;

a plurality of thin-film transistors on the substrate in a display area, the display area surrounding the opening of the substrate in a plan view;

a plurality of light-emitting diodes in the display area and electrically connected to the plurality of thin-film transistors, wherein one of the plurality of light-emitting diodes includes a first electrode, a second electrode, an emission layer between the first electrode and the second electrode;

an encapsulation layer on the plurality of light-emitting diodes in the display area, the encapsulation layer comprising at least one inorganic encapsulation layer and an organic encapsulation layer;

at least one inorganic insulating layer on the substrate in a non-display area between the opening of the substrate and the display area;

a first organic insulating layer on the thin-film transistor in the display area and on the at least one inorganic insulating layer in the non-display area;

a plurality of grooves defined in the first organic insulating layer in the non-display area;

a first metal pattern layer including a first tip directly on the first organic insulating layer and protruding over a first groove of the plurality of grooves; and

at least one organic layer between the first electrode and the second electrode in the display area, wherein the least one organic layer extends to the non-display area and is separated into a plurality of portions by the first tip,

wherein a first tip of the first metal pattern layer has a structure including a titanium layer, an aluminum layer, and another titanium layer stacked on each other.

2. The display panel of claim 1 , further comprising a data line electrically connected to one of the plurality of thin-film transistors, wherein the data line has a same structure as the first tip.

3. The display panel of claim 1 , wherein the first tip has an eave shape protruding toward the first groove beyond a first point at which an upper surface of the first organic insulating layer and a first lateral surface of the first organic insulating layer facing a first side of the first groove meet.

4. The display panel of claim 1 , further comprising:

a first partition wall in the non-display area; and

a second partition wall in the non-display area and located between the first partition wall and the opening of the substrate, wherein each of the first partition wall and the second partition wall comprises a stack structure of sub-organic insulating layers,

wherein the first groove is located between the first partition wall and the display area or between the first partition wall and the second partition wall.

5. The display panel of claim 1 , further comprising a second metal pattern layer including a second tip directly on the first organic insulating layer and protruding over the first groove,

wherein the second tip of the second metal pattern layer has a structure including a stack of a titanium layer, an aluminum layer, and another titanium layer.

6. The display panel of claim 5 , wherein the plurality of portions of the at least one organic layer comprises:

a first portion on the first tip;

a second portion on the second tip and separated from the first portion; and

a third portion in the first groove and separated from the first and second portions.

7. The display panel of claim 5 , wherein the second tip has an eave shape protruding toward the first groove beyond a second point at which the upper surface of the first organic insulating layer and a second lateral surface of the first organic insulating layer facing a second side of the first groove, opposite to the first side of the first groove, meet, and

wherein the first tip and the second tip are at opposite sides with respect to a virtual vertical line passing through a center of the first groove.

8. The display panel of claim 5 , wherein, in the plan view, the organic encapsulation layer overlaps the first groove.

9. A display panel comprising:

a substrate having an opening defined therein;

a plurality of thin-film transistors on the substrate in a display area, the display area surrounding the opening of the substrate in a plan view;

a plurality of light-emitting diodes in the display area and electrically connected to the plurality of thin-film transistors, wherein one of the plurality of light-emitting diodes includes a first electrode, a second electrode, an emission layer between the first electrode and the second electrode;

an encapsulation layer on the plurality of light-emitting diodes in the display area, the encapsulation layer comprising at least one inorganic encapsulation layer and an organic encapsulation layer;

at least one inorganic insulating layer on the substrate in a non-display area between the opening of the substrate and the display area;

a first partition wall in the non-display area;

a second partition wall in the non-display area and located between the first partition wall and the opening of the substrate, wherein each of the first partition wall and the second partition wall comprises a stack structure of sub-organic insulating layers,

a first organic insulating layer on the thin-film transistor in the display area and on the at least one inorganic insulating layer in the non-display area;

a data line electrically connected to one of the plurality of thin-film transistors and on the first organic insulating layer in the display area;

a plurality of grooves defined in the first organic insulating layer and arranged in the non-display area, the plurality of grooves including a first groove located between the first partition wall and the second partition wall;

a plurality of metal pattern layers directly on the first organic insulating layer, the plurality of metal pattern layers comprising a first metal pattern layer including a first tip, the first tip protruding over the first groove beyond a first lateral surface of the first organic insulating layer facing the first groove; and

at least one organic layer between the first electrode and the second electrode in the display area, wherein the least one organic layer extends to the non-display area and is separated into a plurality of portions by the first tip,

wherein the organic encapsulation layer overlaps the first groove and the first tip, and

the first tip of the first metal pattern layer and the data line each have a structure including a stack of a titanium layer, an aluminum layer, and another titanium layer.

10. The display panel of claim 9 , wherein the first tip has an eave shape protruding toward the first groove beyond a first point at which an upper surface of the first organic insulating layer and the first lateral surface of the first organic insulating layer facing the first groove meet.

11. The display panel of claim 9 , further comprising protrusions spaced apart from each other and arranged on the stack structure of sub-organic insulating layers of the first partition wall, and

wherein a recess is between two adjacent protrusions among the protrusions.

12. The display panel of claim 11 , wherein a portion of the organic encapsulation layer is in the recess.

13. The display panel of claim 11 , wherein the at least one inorganic encapsulation layer comprises:

a first inorganic encapsulation layer below the organic encapsulation layer; and

a second inorganic encapsulation layer above the organic encapsulation layer, wherein

in the non-display area, a portion of the second inorganic encapsulation layer and a portion of the first inorganic encapsulation layer are in direct contact with each other above one of the protrusions.

14. An electronic apparatus comprising:

a display panel including an opening area, a display area surrounding the opening area in a plan view, and a non-display area between the opening area and the display area; and

a component overlapping the opening area of the display panel,

wherein the display panel comprises:

a substrate having an opening defined therein, the opening in the substrate corresponding to the opening area in the display panel;

a plurality of thin-film transistors on the substrate in the display area;

a plurality of light-emitting diodes in the display area and electrically connected to the plurality of thin-film transistors, wherein one of the plurality of light-emitting diodes includes a first electrode, a second electrode, an emission layer between the first electrode and the second electrode;

an encapsulation layer on the plurality of light-emitting diodes in the display area, the encapsulation layer comprising a first inorganic encapsulation layer, a second inorganic encapsulation layer, and an organic encapsulation layer between the first inorganic encapsulation layer and the second inorganic encapsulation layer;

at least one inorganic insulating layer on the substrate in the non-display area;

a first organic insulating layer on the thin-film transistor in the display area and on the at least one inorganic insulating layer in the non-display area;

a plurality of grooves defined in the first organic insulating layer in the non-display area;

a first metal pattern layer including a first tip directly on the first organic insulating layer and protruding over a first groove of the plurality of grooves; and

at least one organic layer between the first electrode and the second electrode in the display area, wherein the least one organic layer extends to the non-display area and is separated into a plurality of portions by the first tip,

wherein a first tip of the first metal pattern layer has a structure including a stack of a titanium layer, an aluminum layer, and another titanium layer.

15. The electronic apparatus of claim 14 , wherein the display panel further comprises a data line electrically connected to one of the plurality of thin-film transistors, wherein the data line has a same structure as the first tip.

16. The electronic apparatus of claim 14 , wherein the component comprises a sensor or a camera.

17. The electronic apparatus of claim 14 , wherein the first tip has an eave shape protruding toward the first groove beyond a first point at which an upper surface of the first organic insulating layer and a first lateral surface of the first organic insulating layer facing a first side of the first groove meet.

18. The electronic apparatus of claim 17 , wherein the display panel further comprises a second metal pattern layer including a second tip directly on the first organic insulating layer and protruding over the first groove,

the second tip has an eave shape protruding toward the first groove beyond a second point at which the upper surface of the first organic insulating layer and a second lateral surface of the first organic insulating layer facing a second side of the first groove, opposite to the first side of the first groove, meet,

wherein the second tip of the second metal pattern layer has a structure including a stack of a titanium layer, an aluminum layer, and another titanium layer.

19. The electronic apparatus of claim 18 , wherein the plurality of portions of the at least one organic layer comprises:

a first portion on the first tip;

a second portion on the second tip and separated from the first portion; and

a third portion in the first groove and separated from the first and second portions.

20. The electronic apparatus of claim 14 , wherein, in the plan view, the organic encapsulation layer overlaps the first groove.

21. The electronic apparatus of claim 20 , wherein the display panel further comprises:

a first partition wall in the non-display area; and

a second partition wall in the non-display area and located between the first partition wall and the opening of the substrate, wherein each of the first partition wall and the second partition wall comprises a stack structure of sub-organic insulating layers,

wherein the first groove is located between the first partition wall and the display area or between the first partition wall and the second partition wall.

22. The electronic apparatus of claim 21 , wherein the display panel further comprises protrusions spaced apart from each other and arranged on the stack structure of sub-organic insulating layers of the first partition wall, and

wherein a recess is between two adjacent protrusions among the protrusions.

23. The electronic apparatus of claim 22 , wherein a portion of the organic encapsulation layer is in the recess.

24. The electronic apparatus of claim 22 , wherein, in the non-display area, a portion of the second inorganic encapsulation layer and a portion of the first inorganic encapsulation layer are in direct contact with each other above one of the protrusions.

Priority Claims (1)
KR 10-2020-0177818 · Dec 17, 2020 · national
Continuity (2)
Continuation 17407455 · Aug 20, 2021
Related Publication 20240179941A1 · May 30, 2024
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