Cutting tool
A cutting tool ( 1 ) formed of a silicon nitride-based sintered body ( 2 ) including a matrix phase ( 3 ), a hard phase ( 4 ), and a grain boundary phase ( 10 ) in which a glass phase ( 11 ) and a crystal phase ( 12 ) exist. The sintered body ( 2 ) contains yttrium in an amount of 5.0 wt % to 15.0 wt % in terms of an oxide, and contains titanium nitride as the hard phase ( 4 ) in an amount of 5.0 wt % to 25.0 wt %. In an X-ray diffraction peak, a halo pattern appears at 2θ ranging from 25° to 35° in an internal region of the sintered body ( 2 ). A ratio B/A of a maximum peak intensity B to a maximum peak intensity A satisfies 0.11≤B/A≤0.40 . . . Expression (1) in a surface region of the sintered body ( 2 ), and satisfies 0.00≤B/A≤0.10 . . . Expression (2) in the internal region of the sintered body ( 2 ).
1. A cutting tool formed of a silicon nitride-based sintered body that includes a matrix phase formed of silicon nitride or Sialon, a hard phase, and a grain boundary phase in which a glass phase and a crystal phase exist,
wherein the silicon nitride-based sintered body
contains yttrium such that a content of the yttrium is not less than 5.0 wt % and not greater than 15.0 wt % in terms of an oxide, and contains titanium nitride as the hard phase such that a content of the titanium nitride is not less than 5.0 wt % and not greater than 25.0 wt %;
in an X-ray diffraction peak of the silicon nitride-based sintered body,
a halo pattern appears at 2θ ranging from 25° to 35° in an internal region that is deep from a surface of the silicon nitride-based sintered body by a distance of greater than 1.0 mm;
wherein regarding a maximum peak intensity A of the matrix phase and a maximum peak intensity B of the crystal phase in the grain boundary phase as defined below, a ratio B/A of the maximum peak intensity B to the maximum peak intensity A
satisfies a relationship represented by Expression (1) in a surface region distant from the surface of the silicon nitride-based sintered body by 0.2 mm or less, and
satisfies a relationship represented by Expression (2) in the internal region of the silicon nitride-based sintered body,
0.11≤ B/A≤ 0.40 Expression (1)
0.00≤ B/A< 0.10 Expression (2),
when the matrix phase is formed of a single kind of phase, the maximum peak intensity A is obtained as a maximum peak intensity of the phase, and, when the matrix phase is formed of a plurality of kinds of phases, the maximum peak intensity A is obtained as a sum of maximum peak intensities of the respective phases, and
when the crystal phase in the grain boundary phase is formed of a single kind of phase, the maximum peak intensity B is obtained as a maximum peak intensity of the phase, and, when the crystal phase in the grain boundary phase is formed of a plurality of kinds of phases, the maximum peak intensity B is obtained as a sum of maximum peak intensities of the respective phases; and
wherein when a cross-section of the silicon nitride-based sintered body is observed,
a proportion of a number of particles having a maximum diameter of not greater than 0.5 μm among entire particles of the silicon nitride or the Sialon is not less than 50%, and
a proportion of a number of particles having an aspect ratio of not less than 1.5 among particles, of the silicon nitride or the Sialon, having a minimum diameter of not less than 0.5 μm is not less than 55%.
2. The cutting tool according to claim 1 , wherein
when a cross-section of the silicon nitride-based sintered body is observed,
in the surface region of the silicon nitride-based sintered body, a proportion Cs of an area occupied by the grain boundary phase is not less than 7.0 area % and not greater than 14.0 area % when an area of an entire visual field is 100 area %,
in the internal region of the silicon nitride-based sintered body, a proportion Ci of an area occupied by the grain boundary phase is not less than 3.0 area % and not greater than 9.0 area % when an area of an entire visual field is 100 area %, and
a relationship represented by Expression (3) is satisfied:
Cs>Ci Expression (3).
3. The cutting tool according to claim 1 , wherein a halo pattern does not appear at 2θ ranging from 25° to 35° in an X-ray diffraction peak of the surface region of the silicon nitride-based sintered body.
4. The cutting tool according to claim 2 , wherein a halo pattern does not appear at 2θ ranging from 25° to 35° in an X-ray diffraction peak of the surface region of the silicon nitride-based sintered body.