Systems and methods for manufacturing electrical components using electrochemical deposition
A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.
1. A system for making an electrical component, the system comprising:
a build plate, comprising an intralayer electrical-connection feature;
a deposition anode array, comprising a plurality of deposition anodes;
an electrodeposition cell, configured to hold an electrolyte solution;
a mounting system, configured to position the intralayer electrical-connection feature and the plurality of deposition anodes in direct contact with the electrolyte solution, such that a gap is established between the intralayer electrical-connection feature and the plurality of deposition anodes, when the electrolyte solution is held in the electrodeposition cell;
a power source, configured to create a voltage potential on the intralayer electrical-connection feature;
a positioning system, configured to control a distance between the intralayer electrical-connection feature and the plurality of deposition anodes;
a controller, configured to control a current field across at least some deposition anodes of the plurality of deposition anodes, when the electrodeposition cell holds the electrolyte solution, and when the intralayer electrical-connection feature and the plurality of deposition anodes are positioned in direct contact with the electrolyte solution, to selectively deposit electrically-conductive material onto the intralayer electrical-connection feature to form an interlayer electrical-connection feature of the electrical component;
a dielectric application station comprising a stopping plate and a dielectric source, wherein:
the controller is operable to move the build plate relative to the stopping plate so that a gap, in which the intralayer electrical-connection feature and the interlayer electrical-connection feature are located, is defined between the stopping plate and the build plate, wherein the controller controls a size of the gap such that a portion of the interlayer electrical-connection feature contacts the stopping plate; and
when the gap is defined between the stopping plate and the build plate, the controller is configured to control operation of the dielectric source so that a dielectric material supplied by the dielectric source flows into and fills at least a portion of the gap from the stopping plate to the build plate so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature, contacts and at least partially electrically insulates the interlayer electrical-connection feature, and is secured to the build plate;
a plating station configured to deposit a seed layer, made of an electrically conductive material, onto the dielectric material and the interlayer electrical-connection feature after the dielectric application station couples the dielectric material to the build plate, wherein the power source is further configured to create a voltage potential on the seed layer and, after the seed layer is formed, the controller is further configured to control a second current field across at least some deposition anodes of the plurality of deposition anodes, when the electrodeposition cell holds the electrolyte solution and when the seed layer and the plurality of deposition anodes are positioned in direct contact with the electrolyte solution, to selectively deposit electrically-conductive material onto the seed layer to form at least one second intralayer electrical-connection feature of the electrical component; and
an etching station configured to remove one or more portions of the seed layer, onto which the electrically-conductive material is not deposited.
2. The system of claim 1 , wherein:
the dielectric application station is configured to form a hole in the dielectric material; and
the electrically-conductive material is selectively deposited into the hole to form the intralayer electrical-connection feature.
3. The system of claim 1 , wherein:
the dielectric application station comprises a dielectric source configured to contain the dielectric material in a flowable state;
the dielectric application station is further configured to inject the dielectric material from the dielectric source into contact with the build plate, the intralayer electrical-connection feature, and the interlayer electrical-connection feature; and
the dielectric application station is further configured to solidify the dielectric material.
4. The system of claim 1 , wherein the dielectric application station is further configured to secure a second dielectric material to the dielectric material so that the second dielectric material contacts and at least partially electrically insulates the second intralayer electrical-connection feature.
5. The system of claim 4 , wherein the controller is further configured to control a current field across at least some deposition anodes of the plurality of deposition anodes, when the electrodeposition cell holds the electrolyte solution, and when the second intralayer electrical-connection feature and the plurality of deposition anodes are positioned in direct contact with the electrolyte solution, to selectively deposit electrically-conductive material onto the second intralayer electrical-connection feature to form at least one second interlayer electrical-connection feature of the electrical component.
6. The system of claim 1 , wherein the dielectric application station is configured to flow the dielectric material into contact with the build plate, the intralayer electrical-connection feature, and the interlayer electrical-connection feature.
7. The system of claim 6 , wherein the dielectric application station comprises devices that actively aid in solidifying the dielectric material after it has flowed into contact with the build plate, the intralayer electrical-connection feature, and the interlayer electrical-connection feature.
8. The system of claim 1 , wherein the dielectric application station is configured to attach a patterned dielectric substrate, comprising the dielectric material, to the build plate.
9. The system of claim 8 , wherein the patterned dielectric substrate comprises an opening and the interlayer electrical-connection feature is within the opening when the patterned dielectric substrate is attached to the build plate.
10. The system of claim 9 , wherein:
the controller is configured to control the current field so that the electrically-conductive material is selectively deposited onto the intralayer electrical-connection feature after the dielectric application station attaches the patterned dielectric substrate to the build plate; and
the opening is a mold that defines a shape of the electrically-conductive material selectively deposited onto the intralayer electrical-connection feature.
11. The system of claim 9 , wherein:
the controller is configured to control the current field so that the electrically-conductive material is selectively deposited onto the intralayer electrical-connection feature before the dielectric application station attaches the patterned dielectric substrate to the build plate; and
the opening is a receptacle that receives the intralayer electrical-connection feature as the dielectric application station attaches the patterned dielectric substrate to the build plate.
12. The system of claim 9 , wherein:
the interlayer electrical-connection feature is within only a first portion of the opening when the patterned dielectric substrate is attached to the build plate; and
the controller is further configured to control the current field so that additional electrically-conductive material is selectively deposited into a second portion of the opening and onto the interlayer electrical-connection feature within only the first portion of the opening.
13. The system of claim 1 , wherein:
the build plate comprises at least two intralayer electrical-connection features that are electrically isolated from each other;
the power source is configured to create the voltage potential on each one of the at least two intralayer electrical-connection features independently of each other; and
the controller is further configured to concurrently and separately control the current field across two or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the at least two intralayer electrical-connection features such that the electrically-conductive material is separately deposited onto each one of the at least two intralayer electrical-connection features and forms at least two interlayer electrical-connection features of the electrical component.
14. The system of claim 1 , wherein the controller is further configured to control the current field across at least some deposition anodes of the plurality of deposition anodes, when the electrodeposition cell holds the electrolyte solution, and when the intralayer electrical-connection feature and the plurality of deposition anodes are positioned in direct contact with the electrolyte solution, to selectively deposit electrically-conductive material onto the intralayer electrical-connection feature in at least two spaced-apart locations to form at least two interlayer electrical-connection features of the electrical component that are spaced apart from each other about the intralayer electrical-connection feature.
15. The system of claim 1 , wherein:
the electrical component is a printed circuit board;
the intralayer electrical-connection feature is an electrical trace or an electrical contact pad of the printed circuit board; and
the interlayer electrical-connection feature is a via of the printed circuit board.
16. The system of claim 1 , further comprising a dielectric trimming station configured to shape the dielectric material after the dielectric material is secured to the build plate.
17. The system of claim 1 , wherein the build plate comprises a metallic substrate and the intralayer electrical-connection feature is coupled directly to the metallic substrate.
18. The system of claim 1 , wherein the plating station is configured to deposit the seed layer onto the dielectric material and the interlayer electrical-connection feature via sputtering.