IP Library › Granted Patent US 12,361,967
Granted Patent B2
US 12,361,967 · App. 18/243,518 · Granted Jul 15, 2025

Head suspension assembly and disk device

Inventor: Kenichiro Aoki (Tokyo, JP)
Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation
G11B5/486G11B5/4833G11B2220/2516
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Quick Facts
Patent No.
US 12,361,967
App. No.
18/243,518
Granted
Jul 15, 2025
Kind
B2
Abstract

According to one embodiment, a head suspension assembly includes a support plate, a wiring member on the support plate, and a magnetic head mounted on the wiring member. The magnetic head includes a slider, a head element, connection pads, and a laser oscillation element on the slider. The wiring member includes a plurality of first connection terminals each having a bonding surface bonded to a connection pad of the slider and a second connection terminal including a bonding surface bonded to a connection pad of the laser oscillation element and a non-bonding surface opposite to the bonding surface. The wiring member includes a cover layer covering at least a part of the non-bonding surface of the second connection terminal.

Claims (38)

1. A head suspension assembly comprising:

a support plate;

a wiring member including a displaceable gimbal portion and provided on the support plate; and

a magnetic head mounted on the gimbal portion, comprising a slider, a head element provided in the slider, connection pads provided on the slider, and a laser oscillation element provided on the slider and having a connection pad, wherein

the wiring member includes a metal plate, a base insulating layer provided on the metal plate, a conductive layer formed on the base insulating layer and configuring a plurality of wiring lines and a plurality of connection terminals, and a cover insulating layer overlaid on the conductive layer and the base insulating layer,

the plurality of connection terminals include a plurality of first connection terminals each having a bonding surface bonded to a connection pad of the slider and a second connection terminal including a bonding surface contacting solder and bonded by the solder to the connection pad of the laser oscillation element and a non-bonding surface opposite to the bonding surface,

the wiring member includes a cover layer covering at least a part of the non-bonding surface of the second connection terminal,

the magnetic head includes a dummy connection pad provided on the slider, and

the dummy connection pad is bonded to the non-bonding surface of the second connection terminal.

2. The head suspension assembly of claim 1 , wherein the wiring member includes a recess formed in the base insulating layer and the metal plate, and

the second connection terminal has an extended end portion extending into the recess, the connection pad of the laser oscillation element is bonded to a bonding surface of the extended end portion, and the cover layer covers a non-bonding surface of the extended end portion and the recess.

3. The head suspension assembly of claim 1 , wherein the plurality of first connection terminals includes a first connection terminal for grounding that connects to a ground of the magnetic head, and the second connection terminal includes a second connection terminal for grounding that is integrally formed with the first connection terminal for grounding.

4. A head suspension assembly comprising:

a support plate;

a wiring member including a displaceable gimbal portion and provided on the support plate; and

a magnetic head mounted on the gimbal portion, comprising a slider, a head element provided in the slider, connection pads provided on the slider, and a laser oscillation element provided on the slider and having a connection pad, wherein

the wiring member includes a metal plate, a base insulating layer provided on the metal plate, a conductive layer formed on the base insulating layer and configuring a plurality of wiring lines and a plurality of connection terminals, a cover insulating layer overlaid on the conductive layer and the base insulating layer, and a recess formed in the base insulating layer and the metal plate,

the plurality of connection terminals include a plurality of first connection terminals each having a bonding surface bonded to a connection pad of the slider and a second connection terminal including a bonding surface bonded to the connection pad of the laser oscillation element and a non-bonding surface opposite to the bonding surface,

the wiring member includes a cover layer covering at least a part of the non-bonding surface of the second connection terminal, and

the second connection terminal includes an extended end portion extending into the recess, the connection pad of the laser oscillation element is bonded to a bonding surface of the extended end portion, and the cover layer covers a non-bonding surface of the extended end portion and the recess.

5. The head suspension assembly of claim 4 , wherein the magnetic head includes a dummy connection pad provided on the slider, and

the dummy connection pad is bonded to the non-bonding surface of the second connection terminal.

6. A disk device comprising:

a disk-shaped recording medium; and

the head suspension assembly of claim 4 .

7. The disk device of claim 6 , wherein

the plurality of first connection terminals includes a first connection terminal for grounding that connects to a ground of the magnetic head, and the second connection terminal includes a second connection terminal for grounding that is integrally formed with the first connection terminal for grounding.

8. The disk device of claim 6 , wherein

the magnetic head includes a dummy connection pad provided on the slider, and

the dummy connection pad is bonded to the non-bonding surface of the second connection terminal.

9. A head suspension assembly comprising:

a support plate;

a wiring member including a displaceable gimbal portion and provided on the support plate; and

a magnetic head mounted on the gimbal portion, comprising a slider, a head element provided in the slider, connection pads provided on the slider, and a laser oscillation element provided on the slider and having a connection pad, wherein

the wiring member includes a metal plate, a base insulating layer provided on the metal plate, a conductive layer formed on the base insulating layer and configuring a plurality of wiring lines and a plurality of connection terminals, and a cover insulating layer overlaid on the conductive layer and the base insulating layer,

the plurality of connection terminals include a plurality of first connection terminals each having a bonding surface bonded to a connection pad of the slider and a second connection terminal including a bonding surface bonded to the connection pad of the laser oscillation element and a non-bonding surface opposite to the bonding surface,

the wiring member includes a cover layer covering at least a part of the non-bonding surface of the second connection terminal, and

the plurality of first connection terminals includes a first connection terminal for grounding that connects to a ground of the magnetic head, and the second connection terminal includes a second connection terminal for grounding that is integrally formed with the first connection terminal for grounding.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 5, 2023
From: AOKI, KENICHIRO
To: KABUSHIKI KAISHA TOSHIBA; TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 065763/0118 →
Priority Claims (1)
JP 2023-048558 · Mar 24, 2023 · national
Continuity (1)
Related Publication 20240321299A1 · Sep 26, 2024
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