Semiconductor drive device and semiconductor module
View Patent ↗The semiconductor drive device includes a third turn-off gate resistor that is electrically connected to the third gate electrode of each of the first semiconductor device and the second semiconductor device, and that is inserted into a third turn-off interconnect configured to apply a potential for turning off the third gate electrode. And R CGsoff ≤ Vth 3 min ( C CGsgc ) dv dt ( 1 ) where, in each of the first semiconductor device and the second semiconductor device, a threshold voltage of the third gate electrode being Vth3, a resistance value of the third turn-off gate resistor being R CGsoff , a minimum value of a capacitance between the third gate electrode and the collector electrode in a voltage dependence characteristic being min (C CGsgc ), and a time displacement of a voltage at a time of turning on being dv/dt.
1. A semiconductor drive device for driving a first semiconductor device and a second semiconductor device each including a collector electrode, an emitter electrode, a first gate electrode, a second gate electrode, and a third gate electrode,
the first gate electrode, the second gate electrode, and the third gate electrode being independently controlled,
in a period from when the first gate electrode is turned on to when the first gate electrode is turned off, a turn-on period of the second gate electrode being less than a turn-on period of the first gate electrode, and a turn-on period of the third gate electrode being less than the turn-on period of the second gate electrode,
the semiconductor drive device comprising a third turn-off gate resistor that is electrically connected to the third gate electrode of each of the first semiconductor device and the second semiconductor device, and that is inserted into a third turn-off interconnect configured to apply a potential for turning off the third gate electrode, and
R
CGsoff
≤
Vth
3
min
(
C
CGsgc
)
dv
dt
(
1
)
where, in each of the first semiconductor device and the second semiconductor device, a threshold voltage of the third gate electrode being Vth3, a resistance value of the third turn-off gate resistor being R CGsoff , a minimum value of a capacitance between the third gate electrode and the collector electrode in a voltage dependence characteristic being min (C CGsgc ), and a time displacement of a voltage at a time of turning on being dv/dt.
2. The device according to claim 1 , wherein
R
CGsoff
≤
Vth
3
(
min
(
C
CGsgc
)
+
max
(
C
CGsgc
)
)
2
×
dv
dt
(
2
)
where a maximum value of the capacitance between the third gate electrode and the collector electrode in the voltage dependence characteristic is max (C CGsgc ).
3. The device according to claim 2 , wherein
R
CGsoff
≤
Vth
3
max
(
C
CGsgc
)
dv
dt
.
(
3
)
4. The device according to claim 1 , further comprising:
a first turn-off gate resistor that is electrically connected to the first gate electrode of each of the first semiconductor device and the second semiconductor device and is inserted into a first turn-off interconnect configured to apply a potential for turning off the first gate electrode, and
R CGsoff C CGsgc ≤R MGoff C MGgc (4)
where, in each of the first semiconductor device and the second semiconductor device, the capacitance between the third gate electrode and the collector electrode being C CGsgc , a resistance value of the first turn-off gate resistor being R MGoff , and a capacitance between the first gate electrode and the collector electrode being C MGgc .
5. The device according to claim 3 , further comprising:
a first turn-off gate resistor that is electrically connected to the first gate electrode of each of the first semiconductor device and the second semiconductor device and that is inserted into a first turn-off interconnect configured to apply a potential for turning off the first gate electrode, and
Vth
1
max
(
C
MGgc
)
dv
dt
≤
R
MGoff
(
5
)
where, in each of the first semiconductor device and the second semiconductor device, a threshold voltage of the first gate electrode being Vth1, a resistance value of the first turn-off gate resistor being R MGoff , and a maximum value of a capacitance between the first gate electrode and the collector electrode in the voltage dependence characteristic being max (C MGgc ).
6. The device according to claim 3 , further comprising:
a first turn-off gate resistor that is electrically connected to the first gate electrode of each of the first semiconductor device and the second semiconductor device and that is inserted into a first turn-off interconnect configured to apply a potential for turning off the first gate electrode, and
Vth
1
max
(
C
MGgc
)
dv
dt
≤
R
MGoff
≤
Vth
1
+
❘
"\[LeftBracketingBar]"
V
-
GE
❘
"\[RightBracketingBar]"
min
(
C
MGgc
)
dv
dt
(
6
)
where, in each of the first semiconductor device and the second semiconductor device, a threshold voltage of the first gate electrode being Vth1, a resistance value of the first turn-off gate resistor being R MGoff , a maximum value of a capacitance between the first gate electrode and the collector electrode in the voltage dependence characteristic being max (C MGgc ), a minimum value of the capacitance between the first gate electrode and the collector electrode in the voltage dependence characteristic being min (C MGgc ), and a voltage between the first gate electrode and the emitter electrode being V −GE .
7. A semiconductor module comprising:
a first semiconductor device and a second semiconductor device each including a collector electrode, an emitter electrode, a first gate electrode, a second gate electrode, and a third gate electrode, the first gate electrode, the second gate electrode, and the third gate electrode being controlled independently, and in a period from when the first gate electrode is turned on to when the first gate electrode is turned off, a turn-on period of the second gate electrode being less than a turn-on period of the first gate electrode, and a turn-on period of the third gate electrode being less than the turn-on period of the second gate electrode; and
a semiconductor drive device configured to drive the first semiconductor device and the second semiconductor device,
the semiconductor drive device including a third turn-off gate resistor that is electrically connected to the third gate electrode of each of the first semiconductor device and the second semiconductor device and that is inserted into a third turn-off interconnect configured to apply a potential for turning off the third gate electrode, and
R
CGsoff
≤
Vth
3
min
(
C
CGsgc
)
dv
dt
(
1
)
where, in each of the first semiconductor device and the second semiconductor device, a threshold voltage of the third gate electrode being Vth3, a resistance value of the third turn-off gate resistor being R CGsoff , a minimum value of a capacitance between the third gate electrode and the collector electrode in a voltage dependence characteristic being min (C CGsgc ), and a time displacement of a voltage at a time of turning on being dv/dt.
8. A semiconductor module comprising:
the semiconductor drive device according to claim 3 ;
the first semiconductor device; and
the second semiconductor device.
9. The module according to claim 8 , wherein
the semiconductor drive device includes a first turn-off gate resistor that is electrically connected to the first gate electrode of each of the first semiconductor device and the second semiconductor device and that is inserted into a first turn-off interconnect configured to apply a potential for turning off the first gate electrode, and
R CGsoff C CGsgc ≤R MGoff C MGgc (4)
where, in each of the first semiconductor device and the second semiconductor device, the capacitance between the third gate electrode and the collector electrode is C CGsgc , a resistance value of the first turn-off gate resistor is R MGoff , and a capacitance between the first gate electrode and the collector electrode is C MGgc .
10. The module according to claim 8 , wherein
the semiconductor drive device includes a first turn-off gate resistor that is electrically connected to the first gate electrode of each of the first semiconductor device and the second semiconductor device and that is inserted into a first turn-off interconnect configured to apply a potential for turning off the first gate electrode, and
Vth
1
max
(
C
MGgc
)
dv
dt
≤
R
MGoff
(
5
)
where, in each of the first semiconductor device and the second semiconductor device, a threshold voltage of the first gate electrode is Vth1, a resistance value of the first turn-off gate resistor is R MGoff , and a maximum value of a capacitance between the first gate electrode and the collector electrode in the voltage dependence characteristic is max (C MGgc ).
11. The module according to claim 8 , wherein
the semiconductor drive device includes a first turn-off gate resistor that is electrically connected to the first gate electrode of each of the first semiconductor device and the second semiconductor device and that is inserted into a first turn-off interconnect configured to apply a potential for turning off the first gate electrode, and
Vth
1
max
(
C
MGgc
)
dv
dt
≤
R
MGoff
≤
Vth
1
+
❘
"\[LeftBracketingBar]"
V
-
GE
❘
"\[RightBracketingBar]"
min
(
C
MGgc
)
dv
dt
(
6
)
where, in each of the first semiconductor device and the second semiconductor device, a threshold voltage of the first gate electrode is Vth1, a resistance value of the first turn-off gate resistor is R MGoff , a maximum value of a capacitance between the first gate electrode and the collector electrode in the voltage dependence characteristic is max (C MGgc ), a minimum value of the capacitance between the first gate electrode and the collector electrode in the voltage dependence characteristic is min (C MGgc ), and a voltage between the first gate electrode and the emitter electrode is V −GE .